Laser debonding technology has been widely used in advanced chip packaging,such as fan-out integration,2.5D/3D ICs,and MEMS devices.Typically,laser debonding of bonded pairs(R/R separation)is typically achieved by com...Laser debonding technology has been widely used in advanced chip packaging,such as fan-out integration,2.5D/3D ICs,and MEMS devices.Typically,laser debonding of bonded pairs(R/R separation)is typically achieved by completely removing the material from the ablation region within the release material layer at high energy densities.However,this R/R separation method often results in a significant amount of release material and carbonized debris remaining on the surface of the device wafer,severely reducing product yields and cleaning efficiency for ultra-thin device wafers.Here,we proposed an interfacial separation strategy based on laser-induced hot stamping effect and thermoelastic stress wave,which enables stress-free separation of wafer bonding pairs at the interface of the release layer and the adhesive layer(R/A separation).By comprehensively analyzing the micro-morphology and material composition of the release material,we elucidated the laser debonding behavior of bonded pairs under different separation modes.Additionally,we calculated the ablation threshold of the release material in the case of wafer bonding and established the processing window for different separation methods.This work offers a fresh perspective on the development and application of laser debonding technology.The proposed R/A interface separation method is versatile,controllable,and highly reliable,and does not leave release materials and carbonized debris on device wafers,demonstrating strong industrial adaptability,which greatly facilitates the application and development of advanced packaging for ultra-thin chips.展开更多
Technological advancements and the emphasis on reducing the use of hazardous materials,such as Pb,have led to the widely use of Sn-based Pb-free solder in advanced packaging technology.With the miniaturization of sold...Technological advancements and the emphasis on reducing the use of hazardous materials,such as Pb,have led to the widely use of Sn-based Pb-free solder in advanced packaging technology.With the miniaturization of solder joints,Sn-based micro solder joints often contain single or limitedβ-Sn grains.The strong anisotropy ofβ-Sn,which is significantly correlated with the reliability of the micro solder joints during service,requires the development of methods for controlling the orientations of theseβ-Sn grains.In this review,we focus on the anisotropy of theβ-Sn grains in micro solder joints and the interactions betweenβ-Sn grain orientation and reliability issues concerning electromigration(EM),thermomigration(TM),EM+TM,corrosion process,tensile and shear creep behavior,thermal cycling(TC)and cryogenic temperature.Furthermore,we summarize the strategies for controlling theβ-Sn orientation in micro solder joints.The methods include changing the solder joint size and composition,adding additives,nucleating on specific substrates and interfacial intermetallic compounds,with the aid of external loads during solidification process and introducing heredity effect of theβ-Sn texture during multi-reflow.Finally,the{101}and{301}twinning models with∼60°rotations about a common〈100〉are adopted to explain the mechanism ofβ-Sn grain nucleation and morphology.The shortcomings of the existing methods and the further potential for the development in the field are discussed to promote the application of Pb-free solders in advanced packaging.展开更多
In the post-Moore era,advanced packaging is becoming more critical to meet the everlasting demands of elec-tronic products with smaller size,more powerful performance and lower cost.In this paper,developments in advan...In the post-Moore era,advanced packaging is becoming more critical to meet the everlasting demands of elec-tronic products with smaller size,more powerful performance and lower cost.In this paper,developments in advanced packaging have been discussed,such as 3D IC packaging,fan-out packaging,and chiplet packaging.Insights on the major advantages and challenges have also been briefly introduced.Our prospects about the solu-tions to some fundamental issues in sustainable development of advanced packaging have also been elucidated.The critical aspects and opportunities lie in standardization,co-design tools,new handling technologies,as well as multi-scale modeling and simulation.展开更多
Electronic packaging is an essential branch of electronic engineering that aims to protect electronic,microelec-tronic,and nanoelectronic systems from environmental conditions.The design of electronic packaging is hig...Electronic packaging is an essential branch of electronic engineering that aims to protect electronic,microelec-tronic,and nanoelectronic systems from environmental conditions.The design of electronic packaging is highly complex and requires the consideration of multi-physics phenomena,such as thermal transport,electromagnetic fields,and mechanical stress.This review presents a comprehensive overview of the multiphysics coupling of electric,magnetic,thermal,mechanical,and fluid fields,which are crucial for assessing the performance and reliability of electronic devices.The recent advancements in multi-scale simulation techniques are also system-atically summarized,such as finite element methods at the macroscopic scale,molecular dynamics and density functional theory at the microscopic scale,and particularly machine learning methods for bridging different scales.Additionally,we illustrate how these methods can be applied to study various aspects of electronic pack-aging,such as material properties,interfacial failure,thermal management,electromigration,and stress analysis.The challenges and the potential applications of multi-scale simulation techniques in electronic packaging are also highlighted.Further,some future directions for multi-scale simulation techniques in electronic packaging are concluded for further investigation.展开更多
A linear fluorinated benzocyclobutene-type monomer(4F-bis-BCB) was facilely synthesized by a one-step copper-catalyzed etherification reaction and a simple precipitation post-purification method.Moreover,a series of B...A linear fluorinated benzocyclobutene-type monomer(4F-bis-BCB) was facilely synthesized by a one-step copper-catalyzed etherification reaction and a simple precipitation post-purification method.Moreover,a series of BCB-based polymeric low-dielectric(low-k)materials were obtained by the thermal-induced ring-opening copolymerization of 4F-bis-BCB with divinyl tetramethyl disiloxanebisbenzocyclobutene(DVS-BCB) monomer and further simple thermal curing at high temperature(200-300℃).The resultant fully cured materials demonstrated excellent low dielectric properties at high frequency of 10 GHz(dielectric constant(D_(k))<2.6,dielectric loss(D_(f))<1.57×10^(-2)),great hydrophobicity(water contact angle>116°),ultra-low water absorption(<0.19% after soaked in water at room temperature for 60 h) and excellent planarization ability(surface roughness<0.56 nm of 3 μm-thick film).Overall,this new fluorinated BCB-type monomer provides us an alternative for the facile preparation of low-k polymeric materials and exhibits great potential for future applications in high-frequency communication and three-dimensional high-density packaging technologies.展开更多
An advanced direct chip attaching packaged two-dimensional ceramic thermal wind sensor is studied. The thermal wind sensor chip is fabricated by metal lift-off processes on the ceramic substrate. An advanced direct ch...An advanced direct chip attaching packaged two-dimensional ceramic thermal wind sensor is studied. The thermal wind sensor chip is fabricated by metal lift-off processes on the ceramic substrate. An advanced direct chip attaching （DCA） packaging is adopted and this new packaged method simplifies the processes of packaging further. Simulations of the advanced DCA packaged sensor based on computational fluid dynamics （CFD） model show the sensor can detect wind speed and direction effectively. The wind tunnel testing results show the advanced DCA packaged sensor can detect the wind direction from 0° to 360° and wind speed from 0 to 20 m/s with the error less than 0.5 m/s. The nonlinear fitting based least square method in Matlab is used to analyze the performance of the sensor.展开更多
Power grid simulation calculation iswidely used in fields such as power grid operation,planning,safety defense,and accident inversion,which is one of the fundamental support technologies for power grid operation.At pr...Power grid simulation calculation iswidely used in fields such as power grid operation,planning,safety defense,and accident inversion,which is one of the fundamental support technologies for power grid operation.At present,mainstream software for power grid simulation calculation used by domestic power grid enterprises include PSD Power Tools,Power System Analysis Software Package(PSASP),Advanced Digital Power System Simulator(ADPSS)and so on,which can provide various simulation calculation functions such as power flow calculation,transient stability calculation,short circuit current calculation,etc.But in the process of using these software,various calculation data adjustments still rely entirely on manual experience.This article introduces artificial intelligence technology into power grid simulation calculation and develops an intelligent power system analysis platform which can be used in the simulation for large power grids,achieving the combination of artificial intelligence technology and power grid simulation technology,which can provide technical support for the transformation of power grid simulation and analysis work mode.展开更多
Due to the rise of 5G,IoT,AI,and high-performance computing applications,datacenter trafc has grown at a compound annual growth rate of nearly 30%.Furthermore,nearly three-fourths of the datacenter trafc resides withi...Due to the rise of 5G,IoT,AI,and high-performance computing applications,datacenter trafc has grown at a compound annual growth rate of nearly 30%.Furthermore,nearly three-fourths of the datacenter trafc resides within datacenters.The conventional pluggable optics increases at a much slower rate than that of datacenter trafc.The gap between application requirements and the capability of conventional pluggable optics keeps increasing,a trend that is unsustainable.Copackaged optics(CPO)is a disruptive approach to increasing the interconnecting bandwidth density and energy efciency by dramatically shortening the electrical link length through advanced packaging and co-optimization of electronics and photonics.CPO is widely regarded as a promising solution for future datacenter interconnections,and silicon platform is the most promising platform for large-scale integration.Leading international companies(e.g.,Intel,Broadcom and IBM)have heavily investigated in CPO technology,an inter-disciplinary research feld that involves photonic devices,integrated circuits design,packaging,photonic device modeling,electronic-photonic co-simulation,applications,and standardization.This review aims to provide the readers a comprehensive overview of the state-of-the-art progress of CPO in silicon platform,identify the key challenges,and point out the potential solutions,hoping to encourage collaboration between diferent research felds to accelerate the development of CPO technology.展开更多
基金the National Natural Science Foundation of China(62174170)the Natural Science Foundation of Guangdong Province(2024A1515010123)+4 种基金the Shenzhen Science and Technology Program(20220807020526001)the Strategic Priority Research Program of the Chinese Academy of Sciences(XDB0670000)the Shenzhen Science and Technology Program(KJZD20230923114708018,KJZD20230923114710022)the Talent Support Project of Guangdong(2021TX06C101)the Shenzhen Basic Research(JCYJ20210324115406019).
文摘Laser debonding technology has been widely used in advanced chip packaging,such as fan-out integration,2.5D/3D ICs,and MEMS devices.Typically,laser debonding of bonded pairs(R/R separation)is typically achieved by completely removing the material from the ablation region within the release material layer at high energy densities.However,this R/R separation method often results in a significant amount of release material and carbonized debris remaining on the surface of the device wafer,severely reducing product yields and cleaning efficiency for ultra-thin device wafers.Here,we proposed an interfacial separation strategy based on laser-induced hot stamping effect and thermoelastic stress wave,which enables stress-free separation of wafer bonding pairs at the interface of the release layer and the adhesive layer(R/A separation).By comprehensively analyzing the micro-morphology and material composition of the release material,we elucidated the laser debonding behavior of bonded pairs under different separation modes.Additionally,we calculated the ablation threshold of the release material in the case of wafer bonding and established the processing window for different separation methods.This work offers a fresh perspective on the development and application of laser debonding technology.The proposed R/A interface separation method is versatile,controllable,and highly reliable,and does not leave release materials and carbonized debris on device wafers,demonstrating strong industrial adaptability,which greatly facilitates the application and development of advanced packaging for ultra-thin chips.
基金financially supported by the National Natural Science Foundation of China(No.52075072)the Provincial Applied Basic Research Program of Liaoning Provincial Department of Science and Technology(No.2023JH2/101300181)the Key R&D Program of Shandong Province,China(No.2022CXGC020408)。
文摘Technological advancements and the emphasis on reducing the use of hazardous materials,such as Pb,have led to the widely use of Sn-based Pb-free solder in advanced packaging technology.With the miniaturization of solder joints,Sn-based micro solder joints often contain single or limitedβ-Sn grains.The strong anisotropy ofβ-Sn,which is significantly correlated with the reliability of the micro solder joints during service,requires the development of methods for controlling the orientations of theseβ-Sn grains.In this review,we focus on the anisotropy of theβ-Sn grains in micro solder joints and the interactions betweenβ-Sn grain orientation and reliability issues concerning electromigration(EM),thermomigration(TM),EM+TM,corrosion process,tensile and shear creep behavior,thermal cycling(TC)and cryogenic temperature.Furthermore,we summarize the strategies for controlling theβ-Sn orientation in micro solder joints.The methods include changing the solder joint size and composition,adding additives,nucleating on specific substrates and interfacial intermetallic compounds,with the aid of external loads during solidification process and introducing heredity effect of theβ-Sn texture during multi-reflow.Finally,the{101}and{301}twinning models with∼60°rotations about a common〈100〉are adopted to explain the mechanism ofβ-Sn grain nucleation and morphology.The shortcomings of the existing methods and the further potential for the development in the field are discussed to promote the application of Pb-free solders in advanced packaging.
基金funded by National Natural Science Foundation of China(62274122 and 62004144)Guangdong Basic and Applied Basic Research Foundation(2021A1515010651)Hubei Provincial Natural Science Foundation of China(2020CFA032).
文摘In the post-Moore era,advanced packaging is becoming more critical to meet the everlasting demands of elec-tronic products with smaller size,more powerful performance and lower cost.In this paper,developments in advanced packaging have been discussed,such as 3D IC packaging,fan-out packaging,and chiplet packaging.Insights on the major advantages and challenges have also been briefly introduced.Our prospects about the solu-tions to some fundamental issues in sustainable development of advanced packaging have also been elucidated.The critical aspects and opportunities lie in standardization,co-design tools,new handling technologies,as well as multi-scale modeling and simulation.
基金supported by the National Natural Science Foundation of China(U2241244).
文摘Electronic packaging is an essential branch of electronic engineering that aims to protect electronic,microelec-tronic,and nanoelectronic systems from environmental conditions.The design of electronic packaging is highly complex and requires the consideration of multi-physics phenomena,such as thermal transport,electromagnetic fields,and mechanical stress.This review presents a comprehensive overview of the multiphysics coupling of electric,magnetic,thermal,mechanical,and fluid fields,which are crucial for assessing the performance and reliability of electronic devices.The recent advancements in multi-scale simulation techniques are also system-atically summarized,such as finite element methods at the macroscopic scale,molecular dynamics and density functional theory at the microscopic scale,and particularly machine learning methods for bridging different scales.Additionally,we illustrate how these methods can be applied to study various aspects of electronic pack-aging,such as material properties,interfacial failure,thermal management,electromigration,and stress analysis.The challenges and the potential applications of multi-scale simulation techniques in electronic packaging are also highlighted.Further,some future directions for multi-scale simulation techniques in electronic packaging are concluded for further investigation.
基金the National Natural Science Foundation of China(No.22075298)the Beijing Municipal Natural Science Foundation(No.2212053)。
文摘A linear fluorinated benzocyclobutene-type monomer(4F-bis-BCB) was facilely synthesized by a one-step copper-catalyzed etherification reaction and a simple precipitation post-purification method.Moreover,a series of BCB-based polymeric low-dielectric(low-k)materials were obtained by the thermal-induced ring-opening copolymerization of 4F-bis-BCB with divinyl tetramethyl disiloxanebisbenzocyclobutene(DVS-BCB) monomer and further simple thermal curing at high temperature(200-300℃).The resultant fully cured materials demonstrated excellent low dielectric properties at high frequency of 10 GHz(dielectric constant(D_(k))<2.6,dielectric loss(D_(f))<1.57×10^(-2)),great hydrophobicity(water contact angle>116°),ultra-low water absorption(<0.19% after soaked in water at room temperature for 60 h) and excellent planarization ability(surface roughness<0.56 nm of 3 μm-thick film).Overall,this new fluorinated BCB-type monomer provides us an alternative for the facile preparation of low-k polymeric materials and exhibits great potential for future applications in high-frequency communication and three-dimensional high-density packaging technologies.
基金supported by the National Natural Science Foundation of China(No.61076071)
文摘An advanced direct chip attaching packaged two-dimensional ceramic thermal wind sensor is studied. The thermal wind sensor chip is fabricated by metal lift-off processes on the ceramic substrate. An advanced direct chip attaching （DCA） packaging is adopted and this new packaged method simplifies the processes of packaging further. Simulations of the advanced DCA packaged sensor based on computational fluid dynamics （CFD） model show the sensor can detect wind speed and direction effectively. The wind tunnel testing results show the advanced DCA packaged sensor can detect the wind direction from 0° to 360° and wind speed from 0 to 20 m/s with the error less than 0.5 m/s. The nonlinear fitting based least square method in Matlab is used to analyze the performance of the sensor.
基金supported by the State Grid Corporation of China‘s project:Research on artificial intelligence analysis technology of available transmission capacity(ATC)of key section under multiple power grid operation modes(5100-202255020A-1-1-ZN).
文摘Power grid simulation calculation iswidely used in fields such as power grid operation,planning,safety defense,and accident inversion,which is one of the fundamental support technologies for power grid operation.At present,mainstream software for power grid simulation calculation used by domestic power grid enterprises include PSD Power Tools,Power System Analysis Software Package(PSASP),Advanced Digital Power System Simulator(ADPSS)and so on,which can provide various simulation calculation functions such as power flow calculation,transient stability calculation,short circuit current calculation,etc.But in the process of using these software,various calculation data adjustments still rely entirely on manual experience.This article introduces artificial intelligence technology into power grid simulation calculation and develops an intelligent power system analysis platform which can be used in the simulation for large power grids,achieving the combination of artificial intelligence technology and power grid simulation technology,which can provide technical support for the transformation of power grid simulation and analysis work mode.
基金supported by the National Key Research and Development Program of China(No.2019YFB2203004).
文摘Due to the rise of 5G,IoT,AI,and high-performance computing applications,datacenter trafc has grown at a compound annual growth rate of nearly 30%.Furthermore,nearly three-fourths of the datacenter trafc resides within datacenters.The conventional pluggable optics increases at a much slower rate than that of datacenter trafc.The gap between application requirements and the capability of conventional pluggable optics keeps increasing,a trend that is unsustainable.Copackaged optics(CPO)is a disruptive approach to increasing the interconnecting bandwidth density and energy efciency by dramatically shortening the electrical link length through advanced packaging and co-optimization of electronics and photonics.CPO is widely regarded as a promising solution for future datacenter interconnections,and silicon platform is the most promising platform for large-scale integration.Leading international companies(e.g.,Intel,Broadcom and IBM)have heavily investigated in CPO technology,an inter-disciplinary research feld that involves photonic devices,integrated circuits design,packaging,photonic device modeling,electronic-photonic co-simulation,applications,and standardization.This review aims to provide the readers a comprehensive overview of the state-of-the-art progress of CPO in silicon platform,identify the key challenges,and point out the potential solutions,hoping to encourage collaboration between diferent research felds to accelerate the development of CPO technology.
