Boron nitride(BN),characterised by its wide band gap and robust dielectric properties,has emerged as a promising filler for polymer-based dielectric composites.Nevertheless,its practical implementation in polymer matr...Boron nitride(BN),characterised by its wide band gap and robust dielectric properties,has emerged as a promising filler for polymer-based dielectric composites.Nevertheless,its practical implementation in polymer matrices has been hindered by poor dispersibility and inadequate interfacial adhesion.This study addresses these challenges by developing hyperbranched polymer(HBP)-functionalised BN(HBP-BN)and fabricating HBP-BN/cellulose nanofiber(CNF)composite films via vacuum-assisted self-assembly.The HBP-BN/CNF films demonstrate a low dielectric loss(tanδ<0.016)and significantly improved volume resistivity(109^(Ω)·m)and high thermal stability(55.36%residual mass at 800℃).Notably,the surface flashover voltage is elevated from 13.82 to 15.61 kV,demonstrating superior insulation capability.All these results highlight the promising potential of HBP-BN/CNF composite films for use as advanced dielectric materials,providing a novel approach to develop eco-friendly high-performance materials for high-voltage insulation systems in next-generation electronics and electrical devices.展开更多
基金supported by the National Natural Science Foundation of China(Grant 52507034)Natural Science Foundation of Sichuan(Grant 2025ZNSFSC1242)+1 种基金Postdoctoral Fellowship Program of CPSF(Grant GZC20241413)Fundamental Research Funds for the Central Universities(Grant 2682024CX052).
文摘Boron nitride(BN),characterised by its wide band gap and robust dielectric properties,has emerged as a promising filler for polymer-based dielectric composites.Nevertheless,its practical implementation in polymer matrices has been hindered by poor dispersibility and inadequate interfacial adhesion.This study addresses these challenges by developing hyperbranched polymer(HBP)-functionalised BN(HBP-BN)and fabricating HBP-BN/cellulose nanofiber(CNF)composite films via vacuum-assisted self-assembly.The HBP-BN/CNF films demonstrate a low dielectric loss(tanδ<0.016)and significantly improved volume resistivity(109^(Ω)·m)and high thermal stability(55.36%residual mass at 800℃).Notably,the surface flashover voltage is elevated from 13.82 to 15.61 kV,demonstrating superior insulation capability.All these results highlight the promising potential of HBP-BN/CNF composite films for use as advanced dielectric materials,providing a novel approach to develop eco-friendly high-performance materials for high-voltage insulation systems in next-generation electronics and electrical devices.
