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EXPERIMENTAL INVESTIGATION INTO PLASTIC DAMAGE OF MICROVOIDS WITH INTERACTION 被引量:1
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作者 方竞 倪受庸 +2 位作者 杨宏伟 白树林 戴福隆 《Acta Mechanica Sinica》 SCIE EI CAS CSCD 1997年第3期280-288,共9页
A mechanism of plastic how localization in ductile matter near microvoids is studied. The voids with the size-scale of micromillimeter exist in sheet specimens under tensile loading, and the plastic strain held around... A mechanism of plastic how localization in ductile matter near microvoids is studied. The voids with the size-scale of micromillimeter exist in sheet specimens under tensile loading, and the plastic strain held around voids is obtained by digital image processing of deformed grids. The size growth of the microvoids, the spacing change of the neighboring voids, and the development of shear bands in the ligament between the voids, are presented by experimental results accompanied with the plastic strain distribution, that gives good interpretation to the process of void growth and coalescence with the how localization in the ligaments. 展开更多
关键词 void damage flow localization plastic strain field void interaction
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Void Growth and Interaction in a Structural Aluminum Alloy: Experiments and Theory
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作者 Scott Gampert Abu Bakar Siddique Tariq A. Khraishi 《Journal of Minerals and Materials Characterization and Engineering》 2021年第1期14-37,共24页
The problem of void growth and interaction is of importance to understanding the mechanics of failure in metals exhibiting ductility. In this work, the growth and interaction of voids in 6061-T6 aluminum were studied ... The problem of void growth and interaction is of importance to understanding the mechanics of failure in metals exhibiting ductility. In this work, the growth and interaction of voids in 6061-T6 aluminum were studied experimentally. Specifically, holes of varying numbers and relative placement were investigated for their normalized area growth with applied displacement. Flat dog-bone specimens were carefully drilled in their gauge area with no (zero) holes, one hole, and two holes (arranged vertically or horizontally) for experimentation after polishing. The growth of holes, captured by video recordings, exhibited exponential behavior and was influenced greatly by the number and arrangement of holes with the horizontal voids growing the fastest and the vertical ones growing the slowest. Also, the ensuring deformation of the sample was studied using load-displacement curves, pictography and videography, SEM imaging and Atomic Force Microscopy (AFM). The methods revealed that although the major part failure is due to large crack formation, it was preceded by intense dislocation slip activity and the formation of micro cavities. Also, the AFM quantified the three-dimensional nature of crystal or grain deformation and how it is greatly influenced by distance and location from the hole. Lastly, theoretical understanding of hole growth was offered. 展开更多
关键词 voids HOLES Stress Concentration void Growth void interaction
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