The paper proposes a novel transceiver in physical layer for high-speed serial data link based upon Universal Serial Bus (USB) 2.0, comprising transmitter and receiver. In the design, transmitter contains pre-and-main...The paper proposes a novel transceiver in physical layer for high-speed serial data link based upon Universal Serial Bus (USB) 2.0, comprising transmitter and receiver. In the design, transmitter contains pre-and-main driver to satisfy slew rate of output data, receiver includes optimized topology to improve preci- sion of received data. The circuit simulation is based on Cadence’s spectre software and Taiwan Semiconduc- tor Manufacture Corporation’s library of 0.25μm mixed-signal Complementary Metal-Oxide Semiconductor (CMOS) model. The front and post-simulation results reveal that the transceiver designed can transmit and re- ceive high-speed data in 480Mbps, which is in agreement with USB2.0 specification. The chip of physi- cal-layer transceiver has been designed and implemented with 0.25μm standard CMOS technology.展开更多
文摘The paper proposes a novel transceiver in physical layer for high-speed serial data link based upon Universal Serial Bus (USB) 2.0, comprising transmitter and receiver. In the design, transmitter contains pre-and-main driver to satisfy slew rate of output data, receiver includes optimized topology to improve preci- sion of received data. The circuit simulation is based on Cadence’s spectre software and Taiwan Semiconduc- tor Manufacture Corporation’s library of 0.25μm mixed-signal Complementary Metal-Oxide Semiconductor (CMOS) model. The front and post-simulation results reveal that the transceiver designed can transmit and re- ceive high-speed data in 480Mbps, which is in agreement with USB2.0 specification. The chip of physi- cal-layer transceiver has been designed and implemented with 0.25μm standard CMOS technology.
