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TiFeSb基Half-Heusler热电材料的制备与热电性能 被引量:1
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作者 来忠红 马健 +1 位作者 朱景川 赵荣达 《稀有金属材料与工程》 SCIE EI CAS CSCD 北大核心 2013年第8期1742-1745,共4页
采用固相反应+放电等离子体两步法成功地制备了TiFeSb及Mn掺杂的(Ti0.75Mn0.25)FeSb两种P型Half-Heusler热电材料,并对这两种新型热电材料体系的X射线衍射谱进行了计算模拟和试验研究,同时对其组织结构和热电性能进行了表征。试验结果表... 采用固相反应+放电等离子体两步法成功地制备了TiFeSb及Mn掺杂的(Ti0.75Mn0.25)FeSb两种P型Half-Heusler热电材料,并对这两种新型热电材料体系的X射线衍射谱进行了计算模拟和试验研究,同时对其组织结构和热电性能进行了表征。试验结果表明,合成材料的X射线衍射试验谱可以与模拟计算谱很好的吻合;50℃时,TiFeSb的ZT值为0.011,而(Ti0.75Mn0.25)FeSb体系因Mn掺杂后电阻率大幅度下降,Seebeck系数变化不大,热导率下降了1.2 W·m-1·K-1,使得最终的功率因子较TiFeSb体系提高了3.5倍,ZT值提高了4.3倍。 展开更多
关键词 Half-Heusler化合物 tifesb MN掺杂 固相反应 放电等离子体烧结
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Structure and thermoelectric properties of half-Heusler-like TiFeCu_(x)Sb alloys
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作者 Siyuanyang Yin Qizhu Li +6 位作者 Shaoqin Wang Jiajun Chen Zirui Dong Yubo Zhang Binghui Ge Jiye Zhang Jun Luo 《Journal of Materiomics》 SCIE CSCD 2024年第3期523-530,共8页
Previous research on the ternary Ti-Fe-Sb system has revealed that stoichiometric TiFeSb cannot exist as a stable compound,whereas a single-phase TiFe_(1.33)Sb alloy with the half-Heusler-like structure has been synth... Previous research on the ternary Ti-Fe-Sb system has revealed that stoichiometric TiFeSb cannot exist as a stable compound,whereas a single-phase TiFe_(1.33)Sb alloy with the half-Heusler-like structure has been synthesized by adding excessive Fe.In this work,we report that TiFeSb can also be stabilized by filling additional Cu to the vacant 4d site of the half-Heusler lattice.Our experiments indicate that the TiFe-Cu_(x)Sb(x=0-0.25)samples exhibit a p-type conduction with extremely high carrier concentration((0.5-2.5)×10^(22)cm^(-3)),while these samples attain very large Seebeck coefficients,over 100 mV/K in the whole measured temperature range for the samples with x=0.15-0.25.In addition,a logarithmic divergence of the temperature-dependent specific heat capacity(CP/T)is observed at low temperatures,implying the strange-metal behavior of TiFeCu_(x)Sb samples.The partial filling of the vacant 4d site results in significantly reduced lattice thermal conductivity,leading to the low total thermal conductivity of 2.8 W·m^(-1)·K^(-1)at 823 K for the TiFeCu_(0.20)Sb sample.Consequently,a dimensionless figure of merit zT of 0.54 at 923 K is realized for TiFeCu_(0.20)Sb,demonstrating that promising thermoelectric materials with intriguing physical properties can be discovered in the composition gap of half-and full-Heusler alloys. 展开更多
关键词 tifesb Thermoelectric materials Heusler alloys Vacancy-filled
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TiFe_(1.1−x)Ni_(x)Sb的结构和热电性能随Ni填充量的演变 被引量:1
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作者 王晨心 董子睿 +5 位作者 陈家俊 李志立 甘露 杨炯 张继业 骆军 《Science China Materials》 SCIE EI CAS CSCD 2023年第8期3230-3237,共8页
TiFeSb是一种以half-Heusler结构为主相的多相材料.在这项工作中,我们发现可以通过将Ni填充到half-Heusler结构的4d空位来稳定TiFeSb,并获得单相TiFeNi_(0.1)Sb合金.为了提高热电性能,我们设计并合成了具有更多价电子的TiFe_(1.1−x)Ni_(... TiFeSb是一种以half-Heusler结构为主相的多相材料.在这项工作中,我们发现可以通过将Ni填充到half-Heusler结构的4d空位来稳定TiFeSb,并获得单相TiFeNi_(0.1)Sb合金.为了提高热电性能,我们设计并合成了具有更多价电子的TiFe_(1.1−x)Ni_(x)Sb(x=0.1–1.0)样品.结构分析表明,x=0–0.3的样品是具有类half-Heusler结构的单相合金,x=0.4–0.7的样品是以Double half-Heusler为主相的两相材料,x=0.8–1.0的样品是类full-Heusler结构的单相材料.同时,在TiFe_(1.1−x)Ni_(x)Sb中实现了优异的p型(x=0–0.3)和n型(x=0.8–1.0)电输运性能,这可以用Slater-Pauling规则很好地解释.结合由于无序晶体结构而大大降低的晶格热导率,p型TiFe_(0.8)Ni_(0.3)Sb和n型TiFe_(0.3)Ni_(0.8)Sb在973 K下分别获得了约0.6和0.4的热电优值.我们还证明,这些样品的热电性能可以通过常规掺杂或合金化方法进一步优化.通过Cu代替Ni(或Fe),p型TiFe_(0.8)Ni_(0.2)Cu_(0.1)Sb的载流子浓度降低,并且在973 K时热电优值达到0.8,这是空位填充型Heusler合金的最高记录. 展开更多
关键词 HEUSLER合金 热电性能 热电优值 多相材料 晶格热导率 两相材料 填充量 填充型
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