Rapid technological advancements drive miniaturization and high energy density in devices,thereby increasing nanoscale thermal management demands and urging development of higher spatial resolution technologies for th...Rapid technological advancements drive miniaturization and high energy density in devices,thereby increasing nanoscale thermal management demands and urging development of higher spatial resolution technologies for thermal imaging and transport research.Here,we introduce an approach to measure nanoscale thermal resistance using in situ inelastic scanning transmission electron microscopy.By constructing unidirectional heating flux with controlled temperature gradients and analyzing electron energy-loss/gain signals under optimized acquisition conditions,nanometer-resolution in mapping phonon apparent temperature is achieved.Thus,interfacial thermal resistance is determined by calculating the ratio of interfacial temperature difference to bulk temperature gradient.This methodology enables direct measurement of thermal transport properties for atomic-scale structural features(e.g.,defects and heterointerfaces),resolving critical structure-performance relationships,providing a useful tool for investigating thermal phenomena at the(sub-)nanoscale.展开更多
Efficient thermal management is critical to the reliability and performance of nanoscale electronic and photonic devices,particularly those incorporating multilayer structures.In this study,non-equilibrium molecular d...Efficient thermal management is critical to the reliability and performance of nanoscale electronic and photonic devices,particularly those incorporating multilayer structures.In this study,non-equilibrium molecular dynamics simulations were conducted to systematically investigate the effects of temperature,penetration depth,and Si layer thickness on the interfacial thermal resistance(ITR)in nanometer-scale Mo/Si multilayers,widely employed in extreme ultraviolet lithography.The results indicate that:(i)temperature variations exert a negligible influence on the ITR of amorphous Mo/Si interfaces,which remains stable across the range of 200-900 K;(ii)increasing penetration depth enhances the overlap of phonon density of states,thereby significantly reducing ITR;(iii)the ITR decreases with increasing Si thickness up to4.2 nm due to quasi-ballistic phonon transport,but rises again as phonon scattering becomes more pronounced at larger thicknesses.This study provides quantitative insights into heat transfer mechanisms at amorphous interfaces and also offers a feasible strategy for tailoring interfacial thermal transport through structural design.展开更多
Rapid development of energy,electrical and electronic technologies has put forward higher requirements for the thermal conductivities of polymers and their composites.However,the thermal conductivity coefficient(λ)va...Rapid development of energy,electrical and electronic technologies has put forward higher requirements for the thermal conductivities of polymers and their composites.However,the thermal conductivity coefficient(λ)values of prepared thermally conductive polymer composites are still difficult to achieve expectations,which has become the bottleneck in the fields of thermally conductive polymer composites.Aimed at that,based on the accumulation of the previous research works by related researchers and our research group,this paper proposes three possible directions for breaking through the bottlenecks:(1)preparing and synthesizing intrinsically thermally conductive polymers,(2)reducing the interfacial thermal resistance in thermally conductive polymer composites,and(3)establishing suitable thermal conduction models and studying inner thermal conduction mechanism to guide experimental optimization.Also,the future development trends of the three above-mentioned directions are foreseen,hoping to provide certain basis and guidance for the preparation,researches and development of thermally conductive polymers and their composites.展开更多
Fifteen common rice maintainer lines and 26 high-yielding restorer lines were used to evaluate their thermal resistance and fertility during flowering and early grain filling stages. The rice plants were subjected to ...Fifteen common rice maintainer lines and 26 high-yielding restorer lines were used to evaluate their thermal resistance and fertility during flowering and early grain filling stages. The rice plants were subjected to high temperature stress （39-43 ℃） for 1-15 d from main stem flowering. Based on the heat stress index, they were divided into thermal resistant lines, semi-thermal resistant lines, semi-thermal sensitive lines and thermal sensitive lines. Therefore, the maintainer lines K22B, Bobai B and V20B belonged to thermal resistant lines, whereas 11-32B, Zhongzhe B and Zhong 9B belonged to thermal sensitive lines. For rice restorer lines, Minghui 63 had the highest thermal resistance, followed by R207, P32, P929, and the lowest thermal resistant lines P62-2-2, R8006 and P51. The correlation analysis indicated that the heat stress index was significantly correlated with seed-setting rate and abortive grain rate under heat stress, but not under natural conditions. This indicated that heat stress occurred during flowering and early grain filling stages mainly decreased the seed- setting rate and significantly increased the abortive grain rate in both rice maintainer and restorer lines.展开更多
To predicate the temperature distribution of concrete-filled steel tubes(CFSTs) being exposure to fire,a finite element analysis model was developed using a finite element package,ANSYS.A suggested value of contact th...To predicate the temperature distribution of concrete-filled steel tubes(CFSTs) being exposure to fire,a finite element analysis model was developed using a finite element package,ANSYS.A suggested value of contact thermal resistance was therefore proposed with the supporting of massive numbers of collected test data.Parametric analysis was conducted subsequently towards the cross-sectional temperature distribution of CFST columns in four-side fire,in which the exposure time,width of the cross section,steel ratio were taken into account with considering contact thermal resistance.It was found that contact thermal resistance has little effect on the overall temperature regulation with the exposure time,the width of cross-section or the change of steel ratio.However,great temperature dropping at the concrete adjacent to the contact interface,and gentle temperature increase at steel tube,exist if considering contact thermal resistance.The results of the study are expected to provide theoretical basis for the fire resistance behavior and design of the CFST columns being exposure to fire.展开更多
Au80Sn20 alloy is a widely used solder for laser diode packaging.In this paper,the thermal resistance of Ga N-based blue laser diodes packaged in TO56 cans were measured by the forward voltage method.The microstructur...Au80Sn20 alloy is a widely used solder for laser diode packaging.In this paper,the thermal resistance of Ga N-based blue laser diodes packaged in TO56 cans were measured by the forward voltage method.The microstructures of Au80Sn20 solder were then investigated to understand the reason for the difference in thermal resistance.It was found that the microstructure with a higher content of Au-rich phase in the center of the solder and a lower content of(Au,Ni)Sn phase at the interface of the solder/heat sink resulted in lower thermal resistance.This is attributed to the lower thermal resistance of Au-rich phase and higher thermal resistance of(Au,Ni)Sn phase.展开更多
Using a transient thermoreflectance （TTR） technique, several Au films with different thicknesses on glass and SiC substrates are measured for thermal characterization of metMlic nano-films, including the electron ph...Using a transient thermoreflectance （TTR） technique, several Au films with different thicknesses on glass and SiC substrates are measured for thermal characterization of metMlic nano-films, including the electron phonon coupling factor G, interfazial thermal resistance R, and thermal conductivity Ks of the substrate. The rear heating-front detecting （RF） method is used to ensure the femtosecond temporal resolution. An intense laser beam is focused on the rear surface to heat the film, and another weak laser beam is focused on the very spot of the front surface to detect the change in the electron temperature. By varying the optical path delay between the two beams, a complete electron temperature profile can be scanned. Different from the normally used single-layer model, the double-layer model involving interfaciM thermal resistance is studied here. The electron temperature cooling profile can be affected by the electron energy transfer into the substrate or the electron-phonon interactions in the metallic films. For multiple-target optimization, the genetic algorithm （GA） is used to obtain both G and R. The experimental result gives a deep understanding of the mechanism of ultra-fast heat transfer in metals.展开更多
To improve the thermal conductivity of polymeric composites, the numerous interfacial thermal resistance （ITR） inside is usually considered as a bottle neck, but the direct measurement of the ITR is hardly reported....To improve the thermal conductivity of polymeric composites, the numerous interfacial thermal resistance （ITR） inside is usually considered as a bottle neck, but the direct measurement of the ITR is hardly reported. In this paper, a sandwich structure which consists of transducer/high density polyethylene （HDPE）/sapphire is prepared to study the interface characteristics. Then, the ITRs between HDPE and sapphire of two samples with different HDPE thickness values are measured by time-domain thermoreflectance （TDTR） method and the results are -- 2 × 10-7 m2.K.W-1. Furthermore, a model is used to evaluate the importance of ITR for the thermal conductivity of composites. The model＇s analysis indicates that reducing the ITR is an effective way of improving the thermal conductivity of composites. These results will provide valuable guidance for the design and manufacture of polymer-based thermally conductive materials.展开更多
In this paper,high-power LED with many integrated chips is used as thermal resistance analysis research object, and we do thermal resistance testing technology research on it. We put forward the thermocouple point con...In this paper,high-power LED with many integrated chips is used as thermal resistance analysis research object, and we do thermal resistance testing technology research on it. We put forward the thermocouple point contact test method. According to the principle that LED forward voltage changes with temperature,LED heat sink to surface temperature distribution is studied directly in the test,and then we analyze the thermal resistance of high-power LED with many integrated chips when its secondary packaging is introduced. This method makes the measurement of thermal resistance of LED more rapid and convenient. It provides an effective assessment method for the analysis of high power LED device design and engineering application.展开更多
Organic dust flames deal with a field of science in which many complicated phenomena like pyrolysis or devolatization of solid particles and combustion of volatile particles take place. One-dimensional flame propagati...Organic dust flames deal with a field of science in which many complicated phenomena like pyrolysis or devolatization of solid particles and combustion of volatile particles take place. One-dimensional flame propagation in cloud of fuel mixture is analyzed in which flame structure is divided into three zones. The first zone is preheat zone in which rate of the chemical reaction is small and transfer phenomena play significant role in temperature and mass distributions. In this model, it is assumed that particles pyrolyze first to yield a gaseous fuel mixture. The second zone is reaction zone where convection and vaporization rates of the particles are small. The third zone is convection zone where diffusive terms are negligible in comparison of other terms. Non-zero Biot number is used in order to study effect of particles thermal resistance on flame characteristics. Also, effect of particle size on combustion of micro organic dust is investigated. According to obtained results, it is understood that both flame temperature and burning velocity decrease with rise in the Biot number and particle size.展开更多
With the rapid increase in chip integration and power density,there is a growing need to develop advanced thermal interface materials for effective thermal management.Liquid metals with high thermal conductivity,excel...With the rapid increase in chip integration and power density,there is a growing need to develop advanced thermal interface materials for effective thermal management.Liquid metals with high thermal conductivity,excellent gap-filling capability and non-toxicity have received much attention.However,low-melting-point metals,such as galinstan and indium-bismuth-tin(EInBiSn) eutectic alloys,are prone to leaking,which limits their applications.In this study,In-Ga alloy composite thermal pads with a sandwich structure and a graphite film as an intermediate layer were prepared.The In-Ga alloy composition was adjusted so that these pads underwent partial phase change in the operating temperature range of the laptop CPU(50-100℃).This results in low thermal resistance and leakage prevention.The thermal resistance of the InGa5,InGa15 and InGa25 alloy thermal pads decreases to 7.3,4.1 and 2.66 K·mm^(2)·W^(-1),respectively,at a temperature and pressure of 100℃ and 50 psi.In a test measuring the actual cooling effect of the fabricated material on a CPU,the InGa 15 alloy thermal pad maintained the average CPU temperature at 90.1 ℃,significantly better than the EInBiSn thermal pad with an average CPU temperature of 94.1℃,and comparable to Galinstan,which had an average CPU temperature of 89.3℃.Due to their good heat dissipation and leak-proof properties,InGa alloy composite thermal pads are expected to become a new generation of thermal interface materials.展开更多
The utilization of prefabricated light modular radiant heating system has demonstrated significant increases in heat transfer efficiency and energy conservation capabilities.Within prefabricated building construction,...The utilization of prefabricated light modular radiant heating system has demonstrated significant increases in heat transfer efficiency and energy conservation capabilities.Within prefabricated building construction,this new heating method presents an opportunity for the development of comprehensive facilities.The parameters for evaluating the effectiveness of such a system are the upper surface layer’s heat flux and temperature.In this paper,thermal resistance analysis calculation based on a simplified model for this unique radiant heating system analysis is presented with the heat transfer mechanism’s evaluation.The results obtained from thermal resistance analysis calculation and numerical simulation indicate that the thermal resistance analysis method is highly accurate with temperature discrepancies ranging from 0.44℃ to−0.44℃ and a heat flux discrepancy of less than 7.54%,which can meet the requirements of practical engineering applications,suggesting a foundation for the prefabricated radiant heating system.展开更多
The thermal resistance matrix including self-heating thermal resistance and thermal coupling resistance is presented to describe the thermal effects of multi-finger power heterojunction bipolar transistors. The depend...The thermal resistance matrix including self-heating thermal resistance and thermal coupling resistance is presented to describe the thermal effects of multi-finger power heterojunction bipolar transistors. The dependence of thermal resistance matrix on finger spacing is also investigated. It is shown that both self-heating thermal resistance and thermal coupling resistance are lowered by increasing the finger spacing, in which the downward dissipated heat path is widened and the heat flow from adjacent fingers is effectively suppressed. The decrease of self-heating thermal resistance and thermal coupling resistance is helpful for improving the thermal stability of power devices. Furthermore, with the aid of the thermal resistance matrix a 10-finger power heterojunction bipolar transistor （HBT） with non-uniform finger spacing is designed for high thermal stability. The optimized structure can effectively lower the peak temperature while maintaining a uniformity of the temperature profile at various biases and thus the device effectively may operate at a higher power level.展开更多
A novel analytical method with the guarded-hot-box （GHB） in investigating the thermal resistance of heat-resistant fabrics is described and the analytical method is also presented in this paper. The new apparatus is...A novel analytical method with the guarded-hot-box （GHB） in investigating the thermal resistance of heat-resistant fabrics is described and the analytical method is also presented in this paper. The new apparatus is capable of measure thermal resistance of the fabrics in high temperature up to an average applied temperature of 250~C. The maximum measurement error of the apparatus is 6.5% and relative error is less than 2.8% between the introduced method and standard given value. In the G/-IB method, air layer thickness is the most important factor that influences measurement value of thermal resistance of heat-resistant fabrics. Results show that the method is more accurate and efficient than GBl1048-89 one in measuring thermal resistance of heat-resistant fabrics.展开更多
The paper compares clothing thermal resistance of the same ensemble tested by different thermal manikins in different laboratories. It also examines the consistence of the two groups of total thermal resistance by Pai...The paper compares clothing thermal resistance of the same ensemble tested by different thermal manikins in different laboratories. It also examines the consistence of the two groups of total thermal resistance by Paired-Sample T Test method, which proves that there is no remarkable difference in testing results under the same experiment method and requirement. It is of great significance in promoting the application of thermal manikin testing technology and academic exchange among different institutes.展开更多
High-performance solid thermal interface materials(TIMs)are crucial for addressing overheating issues in high-power electronics,especially in extreme temperature environments.However,solid TIMs often suffer from poor ...High-performance solid thermal interface materials(TIMs)are crucial for addressing overheating issues in high-power electronics,especially in extreme temperature environments.However,solid TIMs often suffer from poor topographical conformability to mating surfaces,limited deformability,large thickness,and low out-of-plane thermal conductivity,leading to high thermal resistance.Here,we fabricated a highly compressible 3D interconnected graphene lamellae network with abundant micro-bulges on its surface(SBGLN).The micro-bulges enable good topographical conformability to various solid substrates under pressure,and meanwhile,the lamellae can reconstruct the networks by deformation to enhance the out-of-plane thermal conductivity.Thus,the SBGLN achieves an ultra-low total thermal resistance of 0.081 cm^(2)K W^(−1)with a minimal bonding line thickness of 23μm,which are much better than those of previ-ously reported solid TIMs and state-of-the-art commercial TIMs.Moreover,it exhibits a negligible change in thermal resistance when subjected to heat shock at 160℃ for 80 h,in contrast to the 284%increase observed in thermal grease.These combined excellent properties,along with the ease of scaling up,establish the SBGLN as a highly reliable and high-performance solid TIMs for the thermal management of high-power electronics.展开更多
The total thermal resistance of bedding systems can be affected by environmental variables.A computational fluid dynamics(CFD)model of child manikin and duvet bedding system was developed to investigate the effects of...The total thermal resistance of bedding systems can be affected by environmental variables.A computational fluid dynamics(CFD)model of child manikin and duvet bedding system was developed to investigate the effects of air temperature(T_(air),5–25°C)and air velocity(V_(air),0.2–1.0 m/s)on the total thermal resistance(R_(t))of children’s bedding systems composed of duvet with different total filling weights(w,350–1000 g)in three sleep postures(P1,P2,and P3).Heat flux experiments were conducted to validate the CFD model.Results from the simulations indicated that a 1℃rise in T_(air)led to a reduction in R_(t)by 0.09–0.11 clo.Furthermore,R_(t)decreases with the increase in V_(air),and the reduction in R_(t)slows down as V_(air)increases.Variations in T_(air)and V_(air)had the most significant impact on R_(t)in the P2 sleep position and the least effect in the P3 sleep position.Based on the simulation results,a prediction equation for the R_(t)of the children’s bedding systems was established.These research findings offer valuable insights into the scientific selection and design of children’s bedding systems,which are crucial for improving children’s sleep quality.展开更多
Currently,chemical furnaces play an important role in the chemical industry.It is necessary to ensure their quality and operation performance,so as to guarantee the efficiency of chemical production.Compared with othe...Currently,chemical furnaces play an important role in the chemical industry.It is necessary to ensure their quality and operation performance,so as to guarantee the efficiency of chemical production.Compared with other furnaces,chemical furnaces have strong particularity,which puts forward higher requirements for the thermal shock resistance of the refractories of furnace linings.This paper studied the thermal shock resistance of the refractories for chemical furnace linings,and proposed measures for improvement,providing experience and technical support for the safe production of chemical enterprises.展开更多
This study proposes a general imperfect thermal contact model to predict the thermal contact resistance at the interface among multi-layered composite structures.Based on the Green-Lindsay(GL)thermoelastic theory,semi...This study proposes a general imperfect thermal contact model to predict the thermal contact resistance at the interface among multi-layered composite structures.Based on the Green-Lindsay(GL)thermoelastic theory,semi analytical solutions of temperature increment and displacement of multi-layered composite structures are obtained by using the Laplace transform method,upon which the effects of thermal resistance coefficient,partition coefficient,thermal conductivity ratio and heat capacity ratio on the responses are studied.The results show that the generalized imperfect thermal contact model can realistically describe the imperfect thermal contact problem.Accordingly,it may degenerate into other thermal contact models by adjusting the thermal resistance coefficient and partition coefficient.展开更多
This paper investigates interfacial heat transfer characteristics in amulti-layer structure under ultra-high heat flux conditions,focusing on thermal contact resistance(TCR)between adjacent layers.Athree-layer computa...This paper investigates interfacial heat transfer characteristics in amulti-layer structure under ultra-high heat flux conditions,focusing on thermal contact resistance(TCR)between adjacent layers.Athree-layer computational model with dual rough interfaces was developed to systematically analyze the synergistic effects of interfacial pressure,surface emissivity,and thermal interface materials(TIMs).Surface reconstruction using experimental measurement data generated two representative roughness models to quantify the impact of surface roughness on heat dissipation.Numerical simulations demonstrate that the absence of TIMs leads to insufficient thermal dissipation capacity under ultra-high heat flux conditions.Compared to TIMapplication,merely increasing the convective heat transfer coefficient shows limited effectiveness in enhancing heat dissipation efficiency.展开更多
基金supported by the National Natural Science Foundation of China(Grant No.52125307)the National Key R&D Program of China(Grant No.2021YFB3501500)the support from the New Cornerstone Science Foundation through the XPLORER PRIZE。
文摘Rapid technological advancements drive miniaturization and high energy density in devices,thereby increasing nanoscale thermal management demands and urging development of higher spatial resolution technologies for thermal imaging and transport research.Here,we introduce an approach to measure nanoscale thermal resistance using in situ inelastic scanning transmission electron microscopy.By constructing unidirectional heating flux with controlled temperature gradients and analyzing electron energy-loss/gain signals under optimized acquisition conditions,nanometer-resolution in mapping phonon apparent temperature is achieved.Thus,interfacial thermal resistance is determined by calculating the ratio of interfacial temperature difference to bulk temperature gradient.This methodology enables direct measurement of thermal transport properties for atomic-scale structural features(e.g.,defects and heterointerfaces),resolving critical structure-performance relationships,providing a useful tool for investigating thermal phenomena at the(sub-)nanoscale.
基金supported by the National Natural Science Foundation of China(Grant No.52206092)the National Key R&D Program of China(Grant No.2024YFF0508900)+1 种基金the Big Data Computing Center of Southeast Universitythe Center for Fundamental and Interdisciplinary Sciences of Southeast University。
文摘Efficient thermal management is critical to the reliability and performance of nanoscale electronic and photonic devices,particularly those incorporating multilayer structures.In this study,non-equilibrium molecular dynamics simulations were conducted to systematically investigate the effects of temperature,penetration depth,and Si layer thickness on the interfacial thermal resistance(ITR)in nanometer-scale Mo/Si multilayers,widely employed in extreme ultraviolet lithography.The results indicate that:(i)temperature variations exert a negligible influence on the ITR of amorphous Mo/Si interfaces,which remains stable across the range of 200-900 K;(ii)increasing penetration depth enhances the overlap of phonon density of states,thereby significantly reducing ITR;(iii)the ITR decreases with increasing Si thickness up to4.2 nm due to quasi-ballistic phonon transport,but rises again as phonon scattering becomes more pronounced at larger thicknesses.This study provides quantitative insights into heat transfer mechanisms at amorphous interfaces and also offers a feasible strategy for tailoring interfacial thermal transport through structural design.
基金National Natural Science Foundation of China(51773169 and 51973173)Guangdong Basic and Applied Basic Research Foundation(2019B1515120093)+2 种基金Technological Base Scientific Research ProjectsNatural Science Basic Research Plan for Distinguished Young Scholars in Shaanxi Province(2019JC-11)Polymer Electromagnetic Functional Materials Innovation Team of Shaanxi Sanqin Scholars.
文摘Rapid development of energy,electrical and electronic technologies has put forward higher requirements for the thermal conductivities of polymers and their composites.However,the thermal conductivity coefficient(λ)values of prepared thermally conductive polymer composites are still difficult to achieve expectations,which has become the bottleneck in the fields of thermally conductive polymer composites.Aimed at that,based on the accumulation of the previous research works by related researchers and our research group,this paper proposes three possible directions for breaking through the bottlenecks:(1)preparing and synthesizing intrinsically thermally conductive polymers,(2)reducing the interfacial thermal resistance in thermally conductive polymer composites,and(3)establishing suitable thermal conduction models and studying inner thermal conduction mechanism to guide experimental optimization.Also,the future development trends of the three above-mentioned directions are foreseen,hoping to provide certain basis and guidance for the preparation,researches and development of thermally conductive polymers and their composites.
基金supported by the National Natural Science Foundation of China(Grant Nos.30871473 and 31101116)the Project from the China National Rice Research Institute(Grant No.2009RG003-5)+1 种基金the Projects from local government of Zhejiang Province, China(Grant Nos.2008C22073,2009C32048 and SN200806)the Zhejiang Provincial Natural Science Foundation,China(Grant Nos.Y3100060 and Y3100090)
文摘Fifteen common rice maintainer lines and 26 high-yielding restorer lines were used to evaluate their thermal resistance and fertility during flowering and early grain filling stages. The rice plants were subjected to high temperature stress （39-43 ℃） for 1-15 d from main stem flowering. Based on the heat stress index, they were divided into thermal resistant lines, semi-thermal resistant lines, semi-thermal sensitive lines and thermal sensitive lines. Therefore, the maintainer lines K22B, Bobai B and V20B belonged to thermal resistant lines, whereas 11-32B, Zhongzhe B and Zhong 9B belonged to thermal sensitive lines. For rice restorer lines, Minghui 63 had the highest thermal resistance, followed by R207, P32, P929, and the lowest thermal resistant lines P62-2-2, R8006 and P51. The correlation analysis indicated that the heat stress index was significantly correlated with seed-setting rate and abortive grain rate under heat stress, but not under natural conditions. This indicated that heat stress occurred during flowering and early grain filling stages mainly decreased the seed- setting rate and significantly increased the abortive grain rate in both rice maintainer and restorer lines.
基金Sponsored by the National Natural Science Foundation of China(Grant No.50708028)the Postdoctoral Foundation of Heilongjiang Province(GrantNo.LBH-Q07048)
文摘To predicate the temperature distribution of concrete-filled steel tubes(CFSTs) being exposure to fire,a finite element analysis model was developed using a finite element package,ANSYS.A suggested value of contact thermal resistance was therefore proposed with the supporting of massive numbers of collected test data.Parametric analysis was conducted subsequently towards the cross-sectional temperature distribution of CFST columns in four-side fire,in which the exposure time,width of the cross section,steel ratio were taken into account with considering contact thermal resistance.It was found that contact thermal resistance has little effect on the overall temperature regulation with the exposure time,the width of cross-section or the change of steel ratio.However,great temperature dropping at the concrete adjacent to the contact interface,and gentle temperature increase at steel tube,exist if considering contact thermal resistance.The results of the study are expected to provide theoretical basis for the fire resistance behavior and design of the CFST columns being exposure to fire.
基金supported by the National Key Research and Development Program of China(Grant Nos.2016YFB0401803,2017YFE0131500,2017YFB0405000)National Natural Science Foundation of China(Grant Nos.61834008,61574160,61804164,and 61704184)+1 种基金Natural Science Foundation of Jiangsu province(BK20180254)China Postdoctoral Science Foundation(2018M630619)。
文摘Au80Sn20 alloy is a widely used solder for laser diode packaging.In this paper,the thermal resistance of Ga N-based blue laser diodes packaged in TO56 cans were measured by the forward voltage method.The microstructures of Au80Sn20 solder were then investigated to understand the reason for the difference in thermal resistance.It was found that the microstructure with a higher content of Au-rich phase in the center of the solder and a lower content of(Au,Ni)Sn phase at the interface of the solder/heat sink resulted in lower thermal resistance.This is attributed to the lower thermal resistance of Au-rich phase and higher thermal resistance of(Au,Ni)Sn phase.
基金supported by the National Natural Science Foundation of China (Grant Nos. 50730006,50976053,and 50906042)
文摘Using a transient thermoreflectance （TTR） technique, several Au films with different thicknesses on glass and SiC substrates are measured for thermal characterization of metMlic nano-films, including the electron phonon coupling factor G, interfazial thermal resistance R, and thermal conductivity Ks of the substrate. The rear heating-front detecting （RF） method is used to ensure the femtosecond temporal resolution. An intense laser beam is focused on the rear surface to heat the film, and another weak laser beam is focused on the very spot of the front surface to detect the change in the electron temperature. By varying the optical path delay between the two beams, a complete electron temperature profile can be scanned. Different from the normally used single-layer model, the double-layer model involving interfaciM thermal resistance is studied here. The electron temperature cooling profile can be affected by the electron energy transfer into the substrate or the electron-phonon interactions in the metallic films. For multiple-target optimization, the genetic algorithm （GA） is used to obtain both G and R. The experimental result gives a deep understanding of the mechanism of ultra-fast heat transfer in metals.
基金Project supported by the National Natural Science Foundation of China(Grant Nos.51373184 and 51206167)the National Plan for Science&Technology Support,China(Grant No.2014BAC03B05)the National Basic Research Program of China(Grant Nos.2014CB931803 and 2012CB933801)
文摘To improve the thermal conductivity of polymeric composites, the numerous interfacial thermal resistance （ITR） inside is usually considered as a bottle neck, but the direct measurement of the ITR is hardly reported. In this paper, a sandwich structure which consists of transducer/high density polyethylene （HDPE）/sapphire is prepared to study the interface characteristics. Then, the ITRs between HDPE and sapphire of two samples with different HDPE thickness values are measured by time-domain thermoreflectance （TDTR） method and the results are -- 2 × 10-7 m2.K.W-1. Furthermore, a model is used to evaluate the importance of ITR for the thermal conductivity of composites. The model＇s analysis indicates that reducing the ITR is an effective way of improving the thermal conductivity of composites. These results will provide valuable guidance for the design and manufacture of polymer-based thermally conductive materials.
基金Sponsored by the Heilongjiang Provincial Project(Grant No.12511121)the Harbin City Innovation Talent Project(Grant No.2011RFXXG019)the National Science and Technology Support Project(Grant No.2012BAH28F02)
文摘In this paper,high-power LED with many integrated chips is used as thermal resistance analysis research object, and we do thermal resistance testing technology research on it. We put forward the thermocouple point contact test method. According to the principle that LED forward voltage changes with temperature,LED heat sink to surface temperature distribution is studied directly in the test,and then we analyze the thermal resistance of high-power LED with many integrated chips when its secondary packaging is introduced. This method makes the measurement of thermal resistance of LED more rapid and convenient. It provides an effective assessment method for the analysis of high power LED device design and engineering application.
文摘Organic dust flames deal with a field of science in which many complicated phenomena like pyrolysis or devolatization of solid particles and combustion of volatile particles take place. One-dimensional flame propagation in cloud of fuel mixture is analyzed in which flame structure is divided into three zones. The first zone is preheat zone in which rate of the chemical reaction is small and transfer phenomena play significant role in temperature and mass distributions. In this model, it is assumed that particles pyrolyze first to yield a gaseous fuel mixture. The second zone is reaction zone where convection and vaporization rates of the particles are small. The third zone is convection zone where diffusive terms are negligible in comparison of other terms. Non-zero Biot number is used in order to study effect of particles thermal resistance on flame characteristics. Also, effect of particle size on combustion of micro organic dust is investigated. According to obtained results, it is understood that both flame temperature and burning velocity decrease with rise in the Biot number and particle size.
基金financially supported by the National Natural Science Foundation of China (Nos.11204097 and U1530120)。
文摘With the rapid increase in chip integration and power density,there is a growing need to develop advanced thermal interface materials for effective thermal management.Liquid metals with high thermal conductivity,excellent gap-filling capability and non-toxicity have received much attention.However,low-melting-point metals,such as galinstan and indium-bismuth-tin(EInBiSn) eutectic alloys,are prone to leaking,which limits their applications.In this study,In-Ga alloy composite thermal pads with a sandwich structure and a graphite film as an intermediate layer were prepared.The In-Ga alloy composition was adjusted so that these pads underwent partial phase change in the operating temperature range of the laptop CPU(50-100℃).This results in low thermal resistance and leakage prevention.The thermal resistance of the InGa5,InGa15 and InGa25 alloy thermal pads decreases to 7.3,4.1 and 2.66 K·mm^(2)·W^(-1),respectively,at a temperature and pressure of 100℃ and 50 psi.In a test measuring the actual cooling effect of the fabricated material on a CPU,the InGa 15 alloy thermal pad maintained the average CPU temperature at 90.1 ℃,significantly better than the EInBiSn thermal pad with an average CPU temperature of 94.1℃,and comparable to Galinstan,which had an average CPU temperature of 89.3℃.Due to their good heat dissipation and leak-proof properties,InGa alloy composite thermal pads are expected to become a new generation of thermal interface materials.
基金Project(NB-2020-JG-07)supported by the Research and Engineering Application of Key Technologies for New Building Industrialization Project of China Northwest Architectural Design and Research Institute Co.,Ltd.Project(2023-CXTD-29)supported by the Key Scientific and Technological Innovation Team of Shaanxi Province,ChinaProject supported by the K.C.Wong Education Foundation。
文摘The utilization of prefabricated light modular radiant heating system has demonstrated significant increases in heat transfer efficiency and energy conservation capabilities.Within prefabricated building construction,this new heating method presents an opportunity for the development of comprehensive facilities.The parameters for evaluating the effectiveness of such a system are the upper surface layer’s heat flux and temperature.In this paper,thermal resistance analysis calculation based on a simplified model for this unique radiant heating system analysis is presented with the heat transfer mechanism’s evaluation.The results obtained from thermal resistance analysis calculation and numerical simulation indicate that the thermal resistance analysis method is highly accurate with temperature discrepancies ranging from 0.44℃ to−0.44℃ and a heat flux discrepancy of less than 7.54%,which can meet the requirements of practical engineering applications,suggesting a foundation for the prefabricated radiant heating system.
基金Project supported by the National Natural Science Foundation of China (Grant Nos. 61006059, 60776051, and 61006044)the Beijing Municipal Natural Science Foundation of China (Grant No. 4082007)+3 种基金the Beijing Municipal Education Committee of China (Grant Nos. KM200710005015 and KM200910005001)the Beijing Municipal Trans-century Talent Project of China (Grant No. 67002013200301)the Beijing Innovatory Talent Training Program of China (Grant No. 00200054RA001)the Ph. D. Start Science Foundation of Beijing University of Technology of China (Grant No. X0002013201102)
文摘The thermal resistance matrix including self-heating thermal resistance and thermal coupling resistance is presented to describe the thermal effects of multi-finger power heterojunction bipolar transistors. The dependence of thermal resistance matrix on finger spacing is also investigated. It is shown that both self-heating thermal resistance and thermal coupling resistance are lowered by increasing the finger spacing, in which the downward dissipated heat path is widened and the heat flow from adjacent fingers is effectively suppressed. The decrease of self-heating thermal resistance and thermal coupling resistance is helpful for improving the thermal stability of power devices. Furthermore, with the aid of the thermal resistance matrix a 10-finger power heterojunction bipolar transistor （HBT） with non-uniform finger spacing is designed for high thermal stability. The optimized structure can effectively lower the peak temperature while maintaining a uniformity of the temperature profile at various biases and thus the device effectively may operate at a higher power level.
基金Supported by Foundation of Innovation Fund of Doctoral Thesis(No.107 06 0019015)
文摘A novel analytical method with the guarded-hot-box （GHB） in investigating the thermal resistance of heat-resistant fabrics is described and the analytical method is also presented in this paper. The new apparatus is capable of measure thermal resistance of the fabrics in high temperature up to an average applied temperature of 250~C. The maximum measurement error of the apparatus is 6.5% and relative error is less than 2.8% between the introduced method and standard given value. In the G/-IB method, air layer thickness is the most important factor that influences measurement value of thermal resistance of heat-resistant fabrics. Results show that the method is more accurate and efficient than GBl1048-89 one in measuring thermal resistance of heat-resistant fabrics.
文摘The paper compares clothing thermal resistance of the same ensemble tested by different thermal manikins in different laboratories. It also examines the consistence of the two groups of total thermal resistance by Paired-Sample T Test method, which proves that there is no remarkable difference in testing results under the same experiment method and requirement. It is of great significance in promoting the application of thermal manikin testing technology and academic exchange among different institutes.
基金financially supported by the Guangdong Basic and Applied Basic Research Foundation(No.2020B0301030002)the National Key R&D Program of China(Nos.2022YFA1205301 and 2022YFA1205300)+1 种基金the National Natural Science Foundation of China(Nos.52188101 and 52273240)the LiaoNing Revitalization Talents Program(No.XLYC2201003).
文摘High-performance solid thermal interface materials(TIMs)are crucial for addressing overheating issues in high-power electronics,especially in extreme temperature environments.However,solid TIMs often suffer from poor topographical conformability to mating surfaces,limited deformability,large thickness,and low out-of-plane thermal conductivity,leading to high thermal resistance.Here,we fabricated a highly compressible 3D interconnected graphene lamellae network with abundant micro-bulges on its surface(SBGLN).The micro-bulges enable good topographical conformability to various solid substrates under pressure,and meanwhile,the lamellae can reconstruct the networks by deformation to enhance the out-of-plane thermal conductivity.Thus,the SBGLN achieves an ultra-low total thermal resistance of 0.081 cm^(2)K W^(−1)with a minimal bonding line thickness of 23μm,which are much better than those of previ-ously reported solid TIMs and state-of-the-art commercial TIMs.Moreover,it exhibits a negligible change in thermal resistance when subjected to heat shock at 160℃ for 80 h,in contrast to the 284%increase observed in thermal grease.These combined excellent properties,along with the ease of scaling up,establish the SBGLN as a highly reliable and high-performance solid TIMs for the thermal management of high-power electronics.
基金supported by the National Natural Science Foundation of China(NSFC)(No.51506076).
文摘The total thermal resistance of bedding systems can be affected by environmental variables.A computational fluid dynamics(CFD)model of child manikin and duvet bedding system was developed to investigate the effects of air temperature(T_(air),5–25°C)and air velocity(V_(air),0.2–1.0 m/s)on the total thermal resistance(R_(t))of children’s bedding systems composed of duvet with different total filling weights(w,350–1000 g)in three sleep postures(P1,P2,and P3).Heat flux experiments were conducted to validate the CFD model.Results from the simulations indicated that a 1℃rise in T_(air)led to a reduction in R_(t)by 0.09–0.11 clo.Furthermore,R_(t)decreases with the increase in V_(air),and the reduction in R_(t)slows down as V_(air)increases.Variations in T_(air)and V_(air)had the most significant impact on R_(t)in the P2 sleep position and the least effect in the P3 sleep position.Based on the simulation results,a prediction equation for the R_(t)of the children’s bedding systems was established.These research findings offer valuable insights into the scientific selection and design of children’s bedding systems,which are crucial for improving children’s sleep quality.
文摘Currently,chemical furnaces play an important role in the chemical industry.It is necessary to ensure their quality and operation performance,so as to guarantee the efficiency of chemical production.Compared with other furnaces,chemical furnaces have strong particularity,which puts forward higher requirements for the thermal shock resistance of the refractories of furnace linings.This paper studied the thermal shock resistance of the refractories for chemical furnace linings,and proposed measures for improvement,providing experience and technical support for the safe production of chemical enterprises.
基金Projects(42477162,52108347,52178371,52168046,52178321,52308383)supported by the National Natural Science Foundation of ChinaProjects(2023C03143,2022C01099,2024C01219,2022C03151)supported by the Zhejiang Key Research and Development Plan,China+6 种基金Project(LQ22E080010)supported by the Exploring Youth Project of Zhejiang Natural Science Foundation,ChinaProject(LR21E080005)supported by the Outstanding Youth Project of Natural Science Foundation of Zhejiang Province,ChinaProject(2022M712964)supported by the Postdoctoral Science Foundation of ChinaProject(2023AFB008)supported by the Natural Science Foundation of Hubei Province for Youth,ChinaProject(202203)supported by Engineering Research Centre of Rock-Soil Drilling&Excavation and Protection,Ministry of Education,ChinaProject(202305-2)supported by the Science and Technology Project of Zhejiang Provincial Communication Department,ChinaProject(2021K256)supported by the Construction Research Founds of Department of Housing and Urban-Rural Development of Zhejiang Province,China。
文摘This study proposes a general imperfect thermal contact model to predict the thermal contact resistance at the interface among multi-layered composite structures.Based on the Green-Lindsay(GL)thermoelastic theory,semi analytical solutions of temperature increment and displacement of multi-layered composite structures are obtained by using the Laplace transform method,upon which the effects of thermal resistance coefficient,partition coefficient,thermal conductivity ratio and heat capacity ratio on the responses are studied.The results show that the generalized imperfect thermal contact model can realistically describe the imperfect thermal contact problem.Accordingly,it may degenerate into other thermal contact models by adjusting the thermal resistance coefficient and partition coefficient.
基金by the Natural Science Foundation of Shandong Province,China(No.ZR2023QE159).
文摘This paper investigates interfacial heat transfer characteristics in amulti-layer structure under ultra-high heat flux conditions,focusing on thermal contact resistance(TCR)between adjacent layers.Athree-layer computational model with dual rough interfaces was developed to systematically analyze the synergistic effects of interfacial pressure,surface emissivity,and thermal interface materials(TIMs).Surface reconstruction using experimental measurement data generated two representative roughness models to quantify the impact of surface roughness on heat dissipation.Numerical simulations demonstrate that the absence of TIMs leads to insufficient thermal dissipation capacity under ultra-high heat flux conditions.Compared to TIMapplication,merely increasing the convective heat transfer coefficient shows limited effectiveness in enhancing heat dissipation efficiency.
