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MHD Convective Flow of CNT/Water-Nanofluid in a 3D Cavity Incorporating Hot Cross-Shaped Obstacle
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作者 Faiza Benabdallah Kaouther Ghachem +3 位作者 Walid Hassen Haythem Baya Hind Albalawi Lioua Kolsi 《Computer Modeling in Engineering & Sciences》 2025年第11期1839-1861,共23页
Current developments in magnetohydrodynamic(MHD)convection and nanofluid engineering technology have have greatly enhanced heat transfer performance in process systems,particularly through the use of carbon nanotube(C... Current developments in magnetohydrodynamic(MHD)convection and nanofluid engineering technology have have greatly enhanced heat transfer performance in process systems,particularly through the use of carbon nanotube(CNT)–based fluids that offer exceptional thermal conductivity.Despite extensive research on MHD natural convection in enclosures,the combined effects of complex obstacle geometries,magnetic fields,and CNT nanofluids in three-dimensional configurations remain insufficiently explored.This research investigates MHD natural convection of carbon nanotube(CNT)-water nanofluid within a three-dimensional cavity.The study considers an inclined cross-shaped hot obstacle,a configuration not extensively explored in previous works.The work aims to elucidate the combined effects of CNT nanofluid concentration,magnetic field strength,and obstacle inclination on fluid flow patterns and heat transfer characteristics.Numerical simulations are performed using the finite element method(FEM)based on the Galerkin Weighted Residual approach.The analysis systematically considers variations in Rayleigh number(Ra),Hartmann number(Ha),nanoparticle volume fraction(Φ),and obstacle inclination angle(θ).Results show that increasing Ra from 103 to 106 enhances convective heat transfer by up to 228%,while raising the CNT volume fraction to 4.5%improves heat transfer by about 64%.In contrast,strengthening the magnetic field from Ha=0 to Ha=100 suppresses fluid motion and reduces heat transfer by nearly 67%,whereas varying the obstacle inclination from 0○to 45○leads to a 4.6%decrease in efficiency.The addition of nanoparticles slightly increases viscosity,reducing flow intensity by 8.3%when Ha=0.Furthermore,a novel multiparametric correlation is proposed,accurately predicting the average Nusselt number as a function of Ra,Ha,ϕ,andθ,with an R2 of 0.98.These findings provide new insights into the role of geometry,magnetic effects,and nanofluids in heat transfer enhancement,offering practical guidance for the design and optimization of advanced thermal systems. 展开更多
关键词 3D natural convection heat transfer enhancement obstacle inclination effect finite element method thermal management optimization
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System-level Pareto frontiers for on-chip thermoelectric coolers
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作者 Sevket U. YURUKER Michael C. FISH +4 位作者 Zhi YANG Nicholas BALDASARO Philip BARLETTA Avram BAR-COHEN Bao YANG 《Frontiers in Energy》 SCIE CSCD 2018年第1期109-120,共12页
The continuous rise in heat dissipation of integrated circuits necessitates advanced thermal solutions to ensure system reliability and efficiency. Thermoelectric coolers are among the most promising techniques for de... The continuous rise in heat dissipation of integrated circuits necessitates advanced thermal solutions to ensure system reliability and efficiency. Thermoelectric coolers are among the most promising techniques for dealing with localized on-chip hot spots. This study focuses on establishing a holistic optimization methodol- ogy for such thermoelectric coolers, in which a thermo- electric element's thickness and the electrical current are optimized to minimize source temperature with respect to ambient, when the thermal and electrical parasitic effects are considered. It is found that when element thickness and electrical current are optimized for a given system architecture, a "heat flux vs. temperature difference" Pareto frontier curve is obtained, indicating that there is an optimum thickness and a corresponding optimum current that maximize the achievable temperature reduc- tion while removing a particular heat flux. This methodol- ogy also provides the possible system level AT's that can be achieved for a range of heat fluxes, defining the upper limits of thermoelectric cooling for that architecture. In this study, use was made of an extensive analytical model, which was verified using commercially available finite element analysis software. Through the optimization process, 3 pairs of master curves were generated, which were then used to compose the Pareto frontier for any given system architecture. Finally, a case study wasperformed to provide an in-depth demonstration of the optimization procedure for an example application. 展开更多
关键词 thermoelectric cooling thermal management optimization high flux electronics
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