Based on current theories of diffusion and creep cavity closure at high temperature, a theoretical analysis of phase transformation diffusion bonding for T8/T8 eutectoid steel is carried out. The diffusion bonding is ...Based on current theories of diffusion and creep cavity closure at high temperature, a theoretical analysis of phase transformation diffusion bonding for T8/T8 eutectoid steel is carried out. The diffusion bonding is mainly described as two-stage process: Ⅰ The interfacial cavity with shape change from diamond to cylinder.Ⅱ The radius of the cylindrical cavity are reduced and eliminated gradually. A new theoretical model is established for the process of transformation superplastic diffusion bonding (TSDB) on the basis of a theoretical model for isothermal superplastic diffusion. The model can predict the bonding quality which is affected by technological parameters, such as limit cycling temperature, the compressive stress, the numbers of thermal cycles and temperature cycling through the phase transformation in the thermal cycling and so on. Results show that the maximum temperature, the compressive stress, the numbers of thermal cycles and the rate of temperature changing speed in the thermal cycling have an important influence on TSDB process. Meanwhile, reasonable technological parameters chosen from theoretical analysis is in good agreement with those obtained from experimental results.展开更多
文摘Based on current theories of diffusion and creep cavity closure at high temperature, a theoretical analysis of phase transformation diffusion bonding for T8/T8 eutectoid steel is carried out. The diffusion bonding is mainly described as two-stage process: Ⅰ The interfacial cavity with shape change from diamond to cylinder.Ⅱ The radius of the cylindrical cavity are reduced and eliminated gradually. A new theoretical model is established for the process of transformation superplastic diffusion bonding (TSDB) on the basis of a theoretical model for isothermal superplastic diffusion. The model can predict the bonding quality which is affected by technological parameters, such as limit cycling temperature, the compressive stress, the numbers of thermal cycles and temperature cycling through the phase transformation in the thermal cycling and so on. Results show that the maximum temperature, the compressive stress, the numbers of thermal cycles and the rate of temperature changing speed in the thermal cycling have an important influence on TSDB process. Meanwhile, reasonable technological parameters chosen from theoretical analysis is in good agreement with those obtained from experimental results.
