To improve the wettability of hypereutectic Al−60Si alloy and enhance the mechanical properties of the joints,Al−60Si alloy was joined by ultrasonic soldering with Sn-9Zn solder,and a sound joint with in-situ Si parti...To improve the wettability of hypereutectic Al−60Si alloy and enhance the mechanical properties of the joints,Al−60Si alloy was joined by ultrasonic soldering with Sn-9Zn solder,and a sound joint with in-situ Si particle reinforcement was obtained.The oxide film of Al−60Si alloy at the interface was identified by transmission electron microscopy(TEM)analysis as amorphous Al_(2)O_(3).The oxide of Si particles in the base metal was also alumina.The oxide film of Al−60Si alloy was observed to be removed by ultrasonic vibration instead of holding treatment.Si particle-reinforced joints(35.7 vol.%)were obtained by increasing the ultrasonication time.The maximum shear strength peaked at 99.5 MPa for soldering at 330℃with an ultrasonic vibration time of 50 s.A model of forming of Si particles reinforced joint under the ultrasound was proposed,and ultrasonic vibration was considered to promote the dissolution of Al and migration of Si particles.展开更多
Short process forming techniques for brazing and soldering materials can shorten the process,improve product quality,and increase production efficiency,which has received much attention from welding researchers.This r...Short process forming techniques for brazing and soldering materials can shorten the process,improve product quality,and increase production efficiency,which has received much attention from welding researchers.This review mainly summarized the research reports on short process forming techniques for brazing and soldering materials.Firstly,the traditional process and its shortcomings were presented.Secondly,the latest research of short process forming technologies,such as continuous casting technique,atomization powder technique,solder ball forming technique,and rapid solidification technique,was summarized,and the traditional forming performance of several brazing and soldering materials was introduced.Finally,the current restrictions and research trends of short process forming technique for brazing and solder materials were put forward,providing theoretical guidance and reference for related research and technique development in brazing and soldering field.展开更多
Flux-coated brazing and soldering material is a type of material-saving and emission-reducing composite material in recent years,which is the representative product of the development of brazing and soldering technolo...Flux-coated brazing and soldering material is a type of material-saving and emission-reducing composite material in recent years,which is the representative product of the development of brazing and soldering technology,which is highly concerned by welding researchers worldwide.This work mainly reviewed the research reports on the design,preparation technology,and application of flux-coated brazing and soldering materials,put forward the shortcomings of current research,and proposed the future research directions mainly focusing on the standards,the synergistic reaction mechanism between flux and metals,the alloying,and the morphology of flux-coated brazing and soldering materials in order to provide reference information and theoretical guidance for related research and technological development in the field of welding.展开更多
Ultrasonic-assisted soldering of 2024 aluminum alloys using a filler metal of Zn-5Al alloy was investigated at the temperature of 400 ℃,which is lower than the solution strengthening temperature of Al-Cu alloys.The u...Ultrasonic-assisted soldering of 2024 aluminum alloys using a filler metal of Zn-5Al alloy was investigated at the temperature of 400 ℃,which is lower than the solution strengthening temperature of Al-Cu alloys.The ultrasonic vibration with power of 200 W and vibration amplitude of 15 μm at the frequency of 21 kHz was applied on the top samples.The ultrasonic vibration promoted the dissolution of Al elements in the base metal.The reduction of volume fraction of the eutectic phases in the bonds was investigated by increasing ultrasonic vibration time.As the ultrasonic vibration time increased from 3 s to 30 s,the volume fraction of the eutectic phase in the bonds decreased from 12.9% to 0.9%,and the shear strength of the joints was up to 149-153 MPa,increased by 20%.The improvement of the mechanical properties of joints was discussed based on the modulus and hardness of the phases in the bonds and the fracture of the joints.展开更多
In recent years,the rapid development of the new energy industry has driven continuous upgrading of high-density and high-power devices.In the packaging and assembly process,the problem of differentiation of the therm...In recent years,the rapid development of the new energy industry has driven continuous upgrading of high-density and high-power devices.In the packaging and assembly process,the problem of differentiation of the thermal needs of different modules has become increasingly prominent,especially for small-size solder joints with high heat dissipation in high-power devices.Localized soldering is con-sidered a suitable choice to selectively heat the desired target while not affecting other heat-sensitive chips.This paper reviews several local-ized soldering processes,focusing on the size of solder joints,soldering materials,and current state of the technique.Each localized solder-ing process was discovered to have unique characteristics.The requirements for small-size solder joints are met by laser soldering,microres-istance soldering,and self-propagating soldering;however,laser soldering has difficulty meeting the requirements for large heat dissipation,microresistance soldering requires the application of pressure to joints,and self-propagating soldering requires ignition materials.However,for small-size solder junctions,selective wave soldering,microwave soldering,and ultrasonic soldering are not appropriate.Because the magnetic field can be focused on a tiny area and the output energy of induction heating is large,induction soldering can be employed as a significant trend in future research.展开更多
The laser provides a controllable means of supplying localized energy for solder joint formation and is a valuable tool in electronics manufacture.Diode laser soldering for fine pitch QFP devices were carried out with...The laser provides a controllable means of supplying localized energy for solder joint formation and is a valuable tool in electronics manufacture.Diode laser soldering for fine pitch QFP devices were carried out with Sn-Ag-Cu lead-free solder and Sn-Pb solder respectively,and the mechanical properties of micro-joints of the QFP devices were tested and studied by STR-1000 micro-joints tester.The results indicate that sound QFP micro-joints without bridging or solder ball are gained by means of diode laser soldering method with appropriate laser processing parameters,and the pitch of the QFP devices is as fine as to 0.4mm.Tensile strength of QFP micro-joints increases gradually with the increase of laser output power,the maximum tensile strength presents when the laser output power increase to a certain value.The results also indicate that the mechanical properties of QFP micro-joints soldered by diode laser soldering system are better than those of QFP micro-joints soldered by IR reflow soldering method.The experimental results may provide a theory guide for investigation of diode laser soldering.展开更多
Soldering aluminum alloys at low temperature have great potential to avoid softening of base metals.Pure Al was solderedwith pure tin assisted by ultrasound.The influence of primaryα(Al)on the microstructure of Al/Sn...Soldering aluminum alloys at low temperature have great potential to avoid softening of base metals.Pure Al was solderedwith pure tin assisted by ultrasound.The influence of primaryα(Al)on the microstructure of Al/Sn interface and its bonding strengthwas studied.It is found that the primaryα(Al)in liquid tin tends to be octahedron enclosed by Al{111}facet with the lowest surfacefree energy and growth rate.The ultrasonic action could increase the nucleation rate and refine the particles of primaryα(Al).For thelonger ultrasonic and holding time,a large amount of the octahedral primaryα(Al)particles crystallize at the Al/Sn interface.Thebonding interface exhibits the profile of rough dentation,resulting in an increment of bonding interface area and the effect ofmechanical occlusion.The bonding strength at interface could reach63MPa with ultrasonic time of40s and holding time of10min.展开更多
Al0.3CrFe1.5MnNi0.5 high entropy alloys(HEA)have special properties.The microstructures and shear strengths of HEA/HEA and HEA/6061-Al joints were determined after direct active soldering(DAS)in air with Sn3.5Ag4Ti ac...Al0.3CrFe1.5MnNi0.5 high entropy alloys(HEA)have special properties.The microstructures and shear strengths of HEA/HEA and HEA/6061-Al joints were determined after direct active soldering(DAS)in air with Sn3.5Ag4Ti active filler at 250°C for 60 s.The results showed that the diffusion of all alloying elements of the HEA alloy was sluggish in the joint area.The joint strengths of HEA/HEA and HEA/6061-Al samples,as analyzed by shear testing,were(14.20±1.63)and(15.70±1.35)MPa,respectively.Observation of the fracture section showed that the HEA/6061-Al soldered joints presented obvious semi-brittle fracture characteristics.展开更多
Hypereutectic Al -27Si alloys were joined without flux by ultrasonic-assisted soldering at 420 ℃ in air using Zn -5Al the filler alloys, and Si particulate-reinforced Zn - Al based composites filler joints were obtai...Hypereutectic Al -27Si alloys were joined without flux by ultrasonic-assisted soldering at 420 ℃ in air using Zn -5Al the filler alloys, and Si particulate-reinforced Zn - Al based composites filler joints were obtained. The ultrasonic vibration introduced into soldering could influence the migration of Si particles and the microstructure of solidified Zn - Al based alloys. Both the distribution of Si particles and microstructure of the solidified Zn - Al based alloys affected the shear strength of joints. The shear strength increased with the ultrasonic vibration time. The highest average shear strength of joints reached to -68.5 MPa. Transcrystalline rupture mode was observed on the fracture surface.展开更多
Zr-based bulk metallic glass and copper with different surface roughness were soldered using low temperature eutectic Au-12 Ge(wt%) solder on a thermomechanical simulator. The cross-sectional microstructures of the br...Zr-based bulk metallic glass and copper with different surface roughness were soldered using low temperature eutectic Au-12 Ge(wt%) solder on a thermomechanical simulator. The cross-sectional microstructures of the brazed joints were analyzed by scanning electron microscopy(SEM) and transmission electron microscope(TEM) in detail, and the compositional distribution along the interface was analyzed by energy-dispersive spectrometer(EDS). Results show that the surface roughness of base metals plays an important role in the quality of the brazed joint because the surface roughness can enlarge the effective contact area, which can improve the brazing surface quality between two materials. A moderate roughness of treated Zr-based metallic glass of 18 μm is shown to be the best for the soldering, while the surface roughness has a weak effect on the soldering behavior of Au-12 Ge solder on copper. After soldering, long-range diffusion of atoms occurs between the base metal and solder, and five distinct regions are formed at the joint region.展开更多
Soldering is a unique casting defect associated with die casting or metal mold casting of aluminum al oys. It occurs when molten aluminum sticks or solders the surface of the die steel and remains there after the ejec...Soldering is a unique casting defect associated with die casting or metal mold casting of aluminum al oys. It occurs when molten aluminum sticks or solders the surface of the die steel and remains there after the ejection of the casting, causing a surface defect and dimensional inaccuracy of the castings and increased machine downtime. Soldering occurs easily when a bare die steel mold is used for die casting of aluminum al oys. When molten aluminum comes in contact with the die steel at a temperature higher than a critical temperature, the iron and aluminum atoms diffuse into each other, forming a series of intermetallic phases and a liquid aluminum-rich fcc phase. This liquid phase exists between intermetal ic phases. On cooling, the liquid fcc phase solidiifes on the intermetal ic phases and grows into the casting, resulting in soldering. The critical temperature is the eutectic temperature near the aluminum corner of the phase diagram. If the die is protected using a nonreactive ceramic coating, soldering starts at locations where local coating failure occurs. Molten aluminum comes into contact with die steel through the coating failure locations and eats into the steel matrix, forming smal pits. As these smal pits grow, the coating is gradual y removed and soldering becomes more severe. Details of die soldering step on a bare steel die and on a coated die material are discussed.展开更多
A novel ultrasonic-assisted low-temperature soldering was developed to join AZ31B Mg alloy and 6061 Al alloy with a series of Sn–x Zn solders. The average maximum shear strength of the joints reaches up to 87.5 MPa a...A novel ultrasonic-assisted low-temperature soldering was developed to join AZ31B Mg alloy and 6061 Al alloy with a series of Sn–x Zn solders. The average maximum shear strength of the joints reaches up to 87.5 MPa at soldering temperature of 300 °C under ultrasonic assistance for only 5 s using Sn–20 Zn solder. The fracture path propagates completely in the soldering seam. The results indicate that the microjet generated by ultrasonic pressure in liquid solder could strike and splinter the Mg_2Sn intermetallic compounds into small pieces, which contributes to the enhancement of the joint strength. In addition, the primary Al(Zn) solid solution phase formed during cooling stage could also strengthen the joint due to the prevention of microcracks propagation.展开更多
Transient liquid phase(TLP)bonding is a potential high-temperature(HT)electron packaging technology that is used inthe interconnection of wide band-gap semiconductors.This study focused on the mechanism of intermetall...Transient liquid phase(TLP)bonding is a potential high-temperature(HT)electron packaging technology that is used inthe interconnection of wide band-gap semiconductors.This study focused on the mechanism of intermetallic compounds(IMCs)evolution in Ag/Sn TLP soldering at different temperatures.Experimental results indicated that morphologies of Ag3Sn grains mainlywere scallop-type,and some other shapes such as prism,needle,hollow column,sheet and wire of Ag3Sn grains were also observed,which was resulted from their anisotropic growths.However,the scallop-type Ag3Sn layer turned into more planar with prolongingsoldering time,due to grain coarsening and anisotropic mass flow of Ag atoms from substrate.Furthermore,a great amount ofnano-Ag3Sn particles were found on the surfaces of Ag3Sn grains,which were formed in Ag-rich areas of the molten Sn and adsorbedby the Ag3Sn grains during solidification process.Growth kinetics of the Ag3Sn IMCs in TLP soldering followed a parabolicrelationship with soldering time,and the growth rate constants of250,280and320°C were calculated as5.83×10-15m2/s,7.83×10-15m2/s and2.83×10-14m2/s,respectively.Accordingly,the activation energy of the reaction was estimated about58.89kJ/mol.展开更多
A double-layered W/Mg structure is expected to be a new generation of nuclear radiation shielding material.The tungsten heavy alloy(W90)and AZ31B Mg alloy were firstly bonded by ultrasonic-assisted soldering using pur...A double-layered W/Mg structure is expected to be a new generation of nuclear radiation shielding material.The tungsten heavy alloy(W90)and AZ31B Mg alloy were firstly bonded by ultrasonic-assisted soldering using pure Sn and Sn-Al filler metal in an atmospheric environment.The influence of ultrasonication time on the microstructure and mechanical properties of the joint was investigated.The typical microstructure of the W90/Sn/Mg joint was W90/Mg_(2)Sn+Sn/Mg_(2)Sn layer/Mg.As the ultrasonication time increased from 2 s to 10 s,the joint width reduced and the thickness of the Mg_(2)Sn layer increased.The shear strength of the joint firstly increased,then flattened,and finally decreased.The joint strength reached the maximum value of 10.5 MPa.The fracture position of the joint changed from the W90/filler metal interface to the Mg_(2)Sn layer.The addition of Al in Sn resulted in the formation of the Al4 W phase at the W/Sn-1Al interface.The W/filler metal interface changed from the semi-coherent interface to the coherent interface and the joint strength increased.As the ultrasonication time was 6 s,the shear strength W90/Sn-1Al/Mg joint reached the maximum value of 24.6 MPa and the joint fractured at two positions:W90/filler metal interface and filler metal.With the further increase of ultrasonication time,the joint strength decreased and the joint fractured in the Mg_(2)Sn layer.展开更多
The purpose of this paper is to investigate the effect of 2 wt%Ag addition in Sn-Pb eutectic solder on microstructure and mechanical properties of AgCu/solder/CuBe joint fabricated by vapor phase soldering.63Sn37Pb an...The purpose of this paper is to investigate the effect of 2 wt%Ag addition in Sn-Pb eutectic solder on microstructure and mechanical properties of AgCu/solder/CuBe joint fabricated by vapor phase soldering.63Sn37Pb and 62Sn36Pb2Ag solder pastes were used to join Cu(1.7 wt%-2.5 wt%)Be and Ag(2 wt%-5 wt%)Cu alloys.Two fracture modes are observed in 62Sn36Pb2Ag and 63Sn37Pb joints after lateral shear tests at room temperature or 120℃,and shear forces of 62Sn36Pb2Ag joints are far higher than those of 63Sn37Pb joints.No obvious difference is observed in morphology and thickness of intermetallic compounds(IMCs)at interfaces of the 63Sn37Pb and 62Sn36Pb2Ag joints.Within the two kinds of joints,for-mation of big blocky or plate-like Ag_(3)Sn is restrained.However,many Ag_(3)Sn IMCs particles(1-3 μm in width)in isolated and dispersed distribution are observed within 62Sn36Pb2Ag joints.The Ag3Sn particles are responsible for the better mechanical properties of 62Sn36Pb2 Ag joints than those of 63Sn37Pb joints.The results present in this paper may provide a guide for restraining formation of big blocky or plate-like Ag_(3) Sn in joints with Ag pads or thick Ag surface finish on pads by utilizing vapor phase soldering process,and improving mechanical properties of Cu/SnPb/Ag joints by adding Ag in SnPb eutectic solder.展开更多
Magnesium and aluminum alloys are widely used in various industries because of their excellent properties,and their reliable connection may increase application of materials.Intermetallic compounds(IMCs)affect the joi...Magnesium and aluminum alloys are widely used in various industries because of their excellent properties,and their reliable connection may increase application of materials.Intermetallic compounds(IMCs)affect the joint performance of Mg/Al.In this study,AZ31 Mg alloy with/without a nickel(Ni)coating layer and 6061 Al alloy were joined by ultrasonic-assisted soldering with Sn-3.0Ag-0.5Cu(SAC)filler.The effects of the Ni coating layer on the microstructure and mechanical properties of Mg/Al joints were systematically investigated.The Ni coating layer had a significant effect on formation of the Mg_(2)Sn IMC and the mechanical properties of Mg/Al joints.The blocky Mg_(2)Sn IMC formed in the Mg/SAC/Al joints without a Ni coating layer.The content of the Mg_(2)Sn IMC increased with increasing soldering temperature,but the joint strength decreased.The joint without a Ni coating layer fractured at the blocky Mg_(2)Sn IMC in the solder,and the maximum shear strength was 32.2 MPa.By pre-plating Ni on the Mg substrate,formation of the blocky Mg_(2)Sn IMC was inhibited in the soldering temperature range 240–280℃and the joint strength increased.However,when the soldering temperature increased to 310℃,the blocky Mg_(2)Sn IMC precipitated again in the solder.Transmission electron microscopy showed that some nano-sized Mg_(2)Sn IMC and the(Cu,Ni)_(6)Sn_(5)phase formed in the Mg(Ni)/SAC/Al joint soldered at 280℃,indicating that the Ni coating layer could no longer prevent diffusion of Mg into the solder when the soldering temperature was higher than 280℃.The maximum shear strength of the Mg(Ni)/SAC/Al joint was 58.2 MPa for a soldering temperature of 280℃,which was 80.7%higher than that of the Mg/SAC/Al joint,and the joint was broken at the Mg(Ni)/SAC interface.Pre-plating Ni is a feasible way to inhibit formation of IMCs when joining dissimilar metals.展开更多
Copper ion implantation and deposition technique was applied as a pretreatment method for low temperature joining of silica ceramic （ SiO2 ） and copper alloy. The effect of copper ion implantation and deposition par...Copper ion implantation and deposition technique was applied as a pretreatment method for low temperature joining of silica ceramic （ SiO2 ） and copper alloy. The effect of copper ion implantation and deposition parameters on the microstructures and mechanical behavior of the soldering joints was investigated by scanning electron microscope （SEM） , X- ray diffraction （ XRD ） and shearing test. The copper implantation depth was about 90 nm with peak concentration of 70% for the SiO2 sample implanted for 90 rain. If copper film was deposited for 4 rain using magnetron sputtering, copper layer with thickness of 150 nm and peak concentration of 80% was obtained. After pretreatment of ion implantation and deposition, SiO2 and copper were joined successfully at low temperature directly using SnPb solder. The SnPb solder filling ratio along joining seams was up to 100% without defects with smooth soldering toes. With the increase of implantation dose, the shear strength of the Si02/Cu joints increases accordingly. After a special pretreatment on SiO2 （ Cu implantation for 30min, following Cu deposition for 4 rain, then Cu implantation for 60 rain and finally Cu deposition for 120 min） , a maximum soldering strength of 22 MPa was achieved, and the soldering joints fractured at the SiO2 base material.展开更多
Fluxless soldering can solve a series of problems caused by side-effects afflux essentially. Feasibility research on vacuum fluxless laser soldering and mechanism analysis on fluxless action of vacuum were carried out...Fluxless soldering can solve a series of problems caused by side-effects afflux essentially. Feasibility research on vacuum fluxless laser soldering and mechanism analysis on fluxless action of vacuum were carried out. Fluxless soldering succeeded in spreading and wetting on Cu pad with laser heating source in vacuum surroundings. What' s more, this fluxless technology was applied in surface mounting of chip resistance successfully.展开更多
Laser and hot air reflow soldering of PBGA solder ball was investigated. Experimental results showed that surface quality and shear strength of solder bump reflowed by laser was superior than the solder bump by hot ai...Laser and hot air reflow soldering of PBGA solder ball was investigated. Experimental results showed that surface quality and shear strength of solder bump reflowed by laser was superior than the solder bump by hot air, and the microstructure within the solder bump reflowed by laser was much finer. Analysis on interfacial reaction showed that eutectic solder reacted with Au/Ni/Cu pad shortly after the solder was melted. Interface of solder bump reflowed by laser consists of a continuous AuSn 4 layer and remnant Au element. Needle like AuSn 4 grew sidewise from interface, and then spread out to the entire interface region. A thin layer of Ni 3Sn 4 intermetallic compound was found at the interface of solder bump reflowed by hot air, and AuSn 4 particles distributed within the whole solder bump randomly. The combination effect of the continuous AuSn 4 layer and finer eutectic microstructure contributes to the higher shear strength of solder bump reflowed by laser.展开更多
In order to study the mechanism of vacuum fluxless soldering on the conditions of laser heating, the method of measuring temperature by the thermocouple is used to analyze the spreading and wetting process of both flu...In order to study the mechanism of vacuum fluxless soldering on the conditions of laser heating, the method of measuring temperature by the thermocouple is used to analyze the spreading and wetting process of both fluxless Sn-Pb solder in the vacuum surroundings and flux Sn-Pb solder on Cu pad. Solder spreading and wetting affected by the soldering thermal process is also discussed according to the thermodynamics principle. Results show that vacuum fluxless soldering demands higher temperature, and the fall of the solder surface tension is the important factor achieving fluxless laser soldering.展开更多
基金financial support from the National Natural Science Foundation of China(Nos.52275385,U2167216)Sichuan Province Science and Technology Support Program,China(No.2022YFG0086).
文摘To improve the wettability of hypereutectic Al−60Si alloy and enhance the mechanical properties of the joints,Al−60Si alloy was joined by ultrasonic soldering with Sn-9Zn solder,and a sound joint with in-situ Si particle reinforcement was obtained.The oxide film of Al−60Si alloy at the interface was identified by transmission electron microscopy(TEM)analysis as amorphous Al_(2)O_(3).The oxide of Si particles in the base metal was also alumina.The oxide film of Al−60Si alloy was observed to be removed by ultrasonic vibration instead of holding treatment.Si particle-reinforced joints(35.7 vol.%)were obtained by increasing the ultrasonication time.The maximum shear strength peaked at 99.5 MPa for soldering at 330℃with an ultrasonic vibration time of 50 s.A model of forming of Si particles reinforced joint under the ultrasound was proposed,and ultrasonic vibration was considered to promote the dissolution of Al and migration of Si particles.
基金National Key Research and Development Program(2021YFB3401101)。
文摘Short process forming techniques for brazing and soldering materials can shorten the process,improve product quality,and increase production efficiency,which has received much attention from welding researchers.This review mainly summarized the research reports on short process forming techniques for brazing and soldering materials.Firstly,the traditional process and its shortcomings were presented.Secondly,the latest research of short process forming technologies,such as continuous casting technique,atomization powder technique,solder ball forming technique,and rapid solidification technique,was summarized,and the traditional forming performance of several brazing and soldering materials was introduced.Finally,the current restrictions and research trends of short process forming technique for brazing and solder materials were put forward,providing theoretical guidance and reference for related research and technique development in brazing and soldering field.
基金Henan Province Central Guiding Local Science and Technology Development Fund Project(Z20231811002)。
文摘Flux-coated brazing and soldering material is a type of material-saving and emission-reducing composite material in recent years,which is the representative product of the development of brazing and soldering technology,which is highly concerned by welding researchers worldwide.This work mainly reviewed the research reports on the design,preparation technology,and application of flux-coated brazing and soldering materials,put forward the shortcomings of current research,and proposed the future research directions mainly focusing on the standards,the synergistic reaction mechanism between flux and metals,the alloying,and the morphology of flux-coated brazing and soldering materials in order to provide reference information and theoretical guidance for related research and technological development in the field of welding.
基金Projects(51075104,50975054) supported by the National Natural Science Foundation of ChinaProject(2010RFQXG020) supported by the Harbin Excellence Talents Program,China
文摘Ultrasonic-assisted soldering of 2024 aluminum alloys using a filler metal of Zn-5Al alloy was investigated at the temperature of 400 ℃,which is lower than the solution strengthening temperature of Al-Cu alloys.The ultrasonic vibration with power of 200 W and vibration amplitude of 15 μm at the frequency of 21 kHz was applied on the top samples.The ultrasonic vibration promoted the dissolution of Al elements in the base metal.The reduction of volume fraction of the eutectic phases in the bonds was investigated by increasing ultrasonic vibration time.As the ultrasonic vibration time increased from 3 s to 30 s,the volume fraction of the eutectic phase in the bonds decreased from 12.9% to 0.9%,and the shear strength of the joints was up to 149-153 MPa,increased by 20%.The improvement of the mechanical properties of joints was discussed based on the modulus and hardness of the phases in the bonds and the fracture of the joints.
基金The research was supported by the National Natural Science Foundation of China(Grant No.52105331)the Shenzhen Science and Technology Innovation Committee(Grant No.JSGG20201102154600003,GXWD20220818163456002,JCYJ20210324124203009).
文摘In recent years,the rapid development of the new energy industry has driven continuous upgrading of high-density and high-power devices.In the packaging and assembly process,the problem of differentiation of the thermal needs of different modules has become increasingly prominent,especially for small-size solder joints with high heat dissipation in high-power devices.Localized soldering is con-sidered a suitable choice to selectively heat the desired target while not affecting other heat-sensitive chips.This paper reviews several local-ized soldering processes,focusing on the size of solder joints,soldering materials,and current state of the technique.Each localized solder-ing process was discovered to have unique characteristics.The requirements for small-size solder joints are met by laser soldering,microres-istance soldering,and self-propagating soldering;however,laser soldering has difficulty meeting the requirements for large heat dissipation,microresistance soldering requires the application of pressure to joints,and self-propagating soldering requires ignition materials.However,for small-size solder junctions,selective wave soldering,microwave soldering,and ultrasonic soldering are not appropriate.Because the magnetic field can be focused on a tiny area and the output energy of induction heating is large,induction soldering can be employed as a significant trend in future research.
基金supported by Nanjing University of Aeronautics and Astronautics Doctoral Dissertation Innovation and Excellence Producing Foundation of China (Grant No. BCXJ09-07)Jiangsu Provincial General Colleges and Universities Postgraduate Scientific Research Innovative Plan of China (Grant No. CX09B_074Z)the Six Kind Skilled Personnel Project of Jiangsu Province of China(Grant No. 06-E-020)
文摘The laser provides a controllable means of supplying localized energy for solder joint formation and is a valuable tool in electronics manufacture.Diode laser soldering for fine pitch QFP devices were carried out with Sn-Ag-Cu lead-free solder and Sn-Pb solder respectively,and the mechanical properties of micro-joints of the QFP devices were tested and studied by STR-1000 micro-joints tester.The results indicate that sound QFP micro-joints without bridging or solder ball are gained by means of diode laser soldering method with appropriate laser processing parameters,and the pitch of the QFP devices is as fine as to 0.4mm.Tensile strength of QFP micro-joints increases gradually with the increase of laser output power,the maximum tensile strength presents when the laser output power increase to a certain value.The results also indicate that the mechanical properties of QFP micro-joints soldered by diode laser soldering system are better than those of QFP micro-joints soldered by IR reflow soldering method.The experimental results may provide a theory guide for investigation of diode laser soldering.
基金Project(51435004)supported by the National Natural Science Foundation of China
文摘Soldering aluminum alloys at low temperature have great potential to avoid softening of base metals.Pure Al was solderedwith pure tin assisted by ultrasound.The influence of primaryα(Al)on the microstructure of Al/Sn interface and its bonding strengthwas studied.It is found that the primaryα(Al)in liquid tin tends to be octahedron enclosed by Al{111}facet with the lowest surfacefree energy and growth rate.The ultrasonic action could increase the nucleation rate and refine the particles of primaryα(Al).For thelonger ultrasonic and holding time,a large amount of the octahedral primaryα(Al)particles crystallize at the Al/Sn interface.Thebonding interface exhibits the profile of rough dentation,resulting in an increment of bonding interface area and the effect ofmechanical occlusion.The bonding strength at interface could reach63MPa with ultrasonic time of40s and holding time of10min.
基金financial support of this work from the Ministry of Science and Technology, Taibei, China, under Projects No. MOST 105-ET-E-020002-ET, 105-2622-E-020-003-CC3
文摘Al0.3CrFe1.5MnNi0.5 high entropy alloys(HEA)have special properties.The microstructures and shear strengths of HEA/HEA and HEA/6061-Al joints were determined after direct active soldering(DAS)in air with Sn3.5Ag4Ti active filler at 250°C for 60 s.The results showed that the diffusion of all alloying elements of the HEA alloy was sluggish in the joint area.The joint strengths of HEA/HEA and HEA/6061-Al samples,as analyzed by shear testing,were(14.20±1.63)and(15.70±1.35)MPa,respectively.Observation of the fracture section showed that the HEA/6061-Al soldered joints presented obvious semi-brittle fracture characteristics.
基金sponsored by the National Natural Science Foundation of China(Grant No.51504165)the Project funded by the China Postdoctoral Science Foundation(Grant No.2016M601271)Tianjin Scince&Technology Project(Grant No.16JCQNJC02600)
文摘Hypereutectic Al -27Si alloys were joined without flux by ultrasonic-assisted soldering at 420 ℃ in air using Zn -5Al the filler alloys, and Si particulate-reinforced Zn - Al based composites filler joints were obtained. The ultrasonic vibration introduced into soldering could influence the migration of Si particles and the microstructure of solidified Zn - Al based alloys. Both the distribution of Si particles and microstructure of the solidified Zn - Al based alloys affected the shear strength of joints. The shear strength increased with the ultrasonic vibration time. The highest average shear strength of joints reached to -68.5 MPa. Transcrystalline rupture mode was observed on the fracture surface.
基金financially supported by the Natural Science Basic Research Plan in Shaanxi Province of China (No. 2014JM6234)the Specialized Research Fund for Doctoral Program of Higher Education (No. 20136102120007)the Program of Introducing Talents of Discipline to Universities (No. B08040)
文摘Zr-based bulk metallic glass and copper with different surface roughness were soldered using low temperature eutectic Au-12 Ge(wt%) solder on a thermomechanical simulator. The cross-sectional microstructures of the brazed joints were analyzed by scanning electron microscopy(SEM) and transmission electron microscope(TEM) in detail, and the compositional distribution along the interface was analyzed by energy-dispersive spectrometer(EDS). Results show that the surface roughness of base metals plays an important role in the quality of the brazed joint because the surface roughness can enlarge the effective contact area, which can improve the brazing surface quality between two materials. A moderate roughness of treated Zr-based metallic glass of 18 μm is shown to be the best for the soldering, while the surface roughness has a weak effect on the soldering behavior of Au-12 Ge solder on copper. After soldering, long-range diffusion of atoms occurs between the base metal and solder, and five distinct regions are formed at the joint region.
基金sponsored by the North American Diecasting Association (NADCA) and the U.S.Department of Energy,Assistant Secretary for Energy Efficiency and Renewable Energy,Office of Transportation Technologies,Lightweight Vehicle Materials Program,under contract DE-AC05-00OR22725 with UT-Battele,LLC
文摘Soldering is a unique casting defect associated with die casting or metal mold casting of aluminum al oys. It occurs when molten aluminum sticks or solders the surface of the die steel and remains there after the ejection of the casting, causing a surface defect and dimensional inaccuracy of the castings and increased machine downtime. Soldering occurs easily when a bare die steel mold is used for die casting of aluminum al oys. When molten aluminum comes in contact with the die steel at a temperature higher than a critical temperature, the iron and aluminum atoms diffuse into each other, forming a series of intermetallic phases and a liquid aluminum-rich fcc phase. This liquid phase exists between intermetal ic phases. On cooling, the liquid fcc phase solidiifes on the intermetal ic phases and grows into the casting, resulting in soldering. The critical temperature is the eutectic temperature near the aluminum corner of the phase diagram. If the die is protected using a nonreactive ceramic coating, soldering starts at locations where local coating failure occurs. Molten aluminum comes into contact with die steel through the coating failure locations and eats into the steel matrix, forming smal pits. As these smal pits grow, the coating is gradual y removed and soldering becomes more severe. Details of die soldering step on a bare steel die and on a coated die material are discussed.
基金supported financially by the State Key Laboratory of Advanced Brazing Filler Metals & Technology (No. SKLABFMT-2016-02)the CAST Innovation Fund Key Project and the National Natural Science Foundation of China (Nos. 51775299 and 51520105007)
文摘A novel ultrasonic-assisted low-temperature soldering was developed to join AZ31B Mg alloy and 6061 Al alloy with a series of Sn–x Zn solders. The average maximum shear strength of the joints reaches up to 87.5 MPa at soldering temperature of 300 °C under ultrasonic assistance for only 5 s using Sn–20 Zn solder. The fracture path propagates completely in the soldering seam. The results indicate that the microjet generated by ultrasonic pressure in liquid solder could strike and splinter the Mg_2Sn intermetallic compounds into small pieces, which contributes to the enhancement of the joint strength. In addition, the primary Al(Zn) solid solution phase formed during cooling stage could also strengthen the joint due to the prevention of microcracks propagation.
基金Project(51375260) supported by the National Natural Science Foundation of China
文摘Transient liquid phase(TLP)bonding is a potential high-temperature(HT)electron packaging technology that is used inthe interconnection of wide band-gap semiconductors.This study focused on the mechanism of intermetallic compounds(IMCs)evolution in Ag/Sn TLP soldering at different temperatures.Experimental results indicated that morphologies of Ag3Sn grains mainlywere scallop-type,and some other shapes such as prism,needle,hollow column,sheet and wire of Ag3Sn grains were also observed,which was resulted from their anisotropic growths.However,the scallop-type Ag3Sn layer turned into more planar with prolongingsoldering time,due to grain coarsening and anisotropic mass flow of Ag atoms from substrate.Furthermore,a great amount ofnano-Ag3Sn particles were found on the surfaces of Ag3Sn grains,which were formed in Ag-rich areas of the molten Sn and adsorbedby the Ag3Sn grains during solidification process.Growth kinetics of the Ag3Sn IMCs in TLP soldering followed a parabolicrelationship with soldering time,and the growth rate constants of250,280and320°C were calculated as5.83×10-15m2/s,7.83×10-15m2/s and2.83×10-14m2/s,respectively.Accordingly,the activation energy of the reaction was estimated about58.89kJ/mol.
基金supported by the National Natural Science Foundation of China(nos.52105330 and 52175307)the Natural Science Foundation of Shandong Province(no.ZR2020QE175)the Taishan Scholars Foundation of Shandong Province(no.tsqn201812128).
文摘A double-layered W/Mg structure is expected to be a new generation of nuclear radiation shielding material.The tungsten heavy alloy(W90)and AZ31B Mg alloy were firstly bonded by ultrasonic-assisted soldering using pure Sn and Sn-Al filler metal in an atmospheric environment.The influence of ultrasonication time on the microstructure and mechanical properties of the joint was investigated.The typical microstructure of the W90/Sn/Mg joint was W90/Mg_(2)Sn+Sn/Mg_(2)Sn layer/Mg.As the ultrasonication time increased from 2 s to 10 s,the joint width reduced and the thickness of the Mg_(2)Sn layer increased.The shear strength of the joint firstly increased,then flattened,and finally decreased.The joint strength reached the maximum value of 10.5 MPa.The fracture position of the joint changed from the W90/filler metal interface to the Mg_(2)Sn layer.The addition of Al in Sn resulted in the formation of the Al4 W phase at the W/Sn-1Al interface.The W/filler metal interface changed from the semi-coherent interface to the coherent interface and the joint strength increased.As the ultrasonication time was 6 s,the shear strength W90/Sn-1Al/Mg joint reached the maximum value of 24.6 MPa and the joint fractured at two positions:W90/filler metal interface and filler metal.With the further increase of ultrasonication time,the joint strength decreased and the joint fractured in the Mg_(2)Sn layer.
基金financially supported by the National Natural Science Foundation of China (No.51375003)
文摘The purpose of this paper is to investigate the effect of 2 wt%Ag addition in Sn-Pb eutectic solder on microstructure and mechanical properties of AgCu/solder/CuBe joint fabricated by vapor phase soldering.63Sn37Pb and 62Sn36Pb2Ag solder pastes were used to join Cu(1.7 wt%-2.5 wt%)Be and Ag(2 wt%-5 wt%)Cu alloys.Two fracture modes are observed in 62Sn36Pb2Ag and 63Sn37Pb joints after lateral shear tests at room temperature or 120℃,and shear forces of 62Sn36Pb2Ag joints are far higher than those of 63Sn37Pb joints.No obvious difference is observed in morphology and thickness of intermetallic compounds(IMCs)at interfaces of the 63Sn37Pb and 62Sn36Pb2Ag joints.Within the two kinds of joints,for-mation of big blocky or plate-like Ag_(3)Sn is restrained.However,many Ag_(3)Sn IMCs particles(1-3 μm in width)in isolated and dispersed distribution are observed within 62Sn36Pb2Ag joints.The Ag3Sn particles are responsible for the better mechanical properties of 62Sn36Pb2 Ag joints than those of 63Sn37Pb joints.The results present in this paper may provide a guide for restraining formation of big blocky or plate-like Ag_(3) Sn in joints with Ag pads or thick Ag surface finish on pads by utilizing vapor phase soldering process,and improving mechanical properties of Cu/SnPb/Ag joints by adding Ag in SnPb eutectic solder.
基金financial support from the National Natural Science Foundation of China(grant numbers 52275385 and U2167216)the Sichuan Province Science and Technology Support Program(grant number 2022YFG0086)。
文摘Magnesium and aluminum alloys are widely used in various industries because of their excellent properties,and their reliable connection may increase application of materials.Intermetallic compounds(IMCs)affect the joint performance of Mg/Al.In this study,AZ31 Mg alloy with/without a nickel(Ni)coating layer and 6061 Al alloy were joined by ultrasonic-assisted soldering with Sn-3.0Ag-0.5Cu(SAC)filler.The effects of the Ni coating layer on the microstructure and mechanical properties of Mg/Al joints were systematically investigated.The Ni coating layer had a significant effect on formation of the Mg_(2)Sn IMC and the mechanical properties of Mg/Al joints.The blocky Mg_(2)Sn IMC formed in the Mg/SAC/Al joints without a Ni coating layer.The content of the Mg_(2)Sn IMC increased with increasing soldering temperature,but the joint strength decreased.The joint without a Ni coating layer fractured at the blocky Mg_(2)Sn IMC in the solder,and the maximum shear strength was 32.2 MPa.By pre-plating Ni on the Mg substrate,formation of the blocky Mg_(2)Sn IMC was inhibited in the soldering temperature range 240–280℃and the joint strength increased.However,when the soldering temperature increased to 310℃,the blocky Mg_(2)Sn IMC precipitated again in the solder.Transmission electron microscopy showed that some nano-sized Mg_(2)Sn IMC and the(Cu,Ni)_(6)Sn_(5)phase formed in the Mg(Ni)/SAC/Al joint soldered at 280℃,indicating that the Ni coating layer could no longer prevent diffusion of Mg into the solder when the soldering temperature was higher than 280℃.The maximum shear strength of the Mg(Ni)/SAC/Al joint was 58.2 MPa for a soldering temperature of 280℃,which was 80.7%higher than that of the Mg/SAC/Al joint,and the joint was broken at the Mg(Ni)/SAC interface.Pre-plating Ni is a feasible way to inhibit formation of IMCs when joining dissimilar metals.
文摘Copper ion implantation and deposition technique was applied as a pretreatment method for low temperature joining of silica ceramic （ SiO2 ） and copper alloy. The effect of copper ion implantation and deposition parameters on the microstructures and mechanical behavior of the soldering joints was investigated by scanning electron microscope （SEM） , X- ray diffraction （ XRD ） and shearing test. The copper implantation depth was about 90 nm with peak concentration of 70% for the SiO2 sample implanted for 90 rain. If copper film was deposited for 4 rain using magnetron sputtering, copper layer with thickness of 150 nm and peak concentration of 80% was obtained. After pretreatment of ion implantation and deposition, SiO2 and copper were joined successfully at low temperature directly using SnPb solder. The SnPb solder filling ratio along joining seams was up to 100% without defects with smooth soldering toes. With the increase of implantation dose, the shear strength of the Si02/Cu joints increases accordingly. After a special pretreatment on SiO2 （ Cu implantation for 30min, following Cu deposition for 4 rain, then Cu implantation for 60 rain and finally Cu deposition for 120 min） , a maximum soldering strength of 22 MPa was achieved, and the soldering joints fractured at the SiO2 base material.
基金This project is subsidized by Natural Science Funds of Naion.The authorized number is 59671063.
文摘Fluxless soldering can solve a series of problems caused by side-effects afflux essentially. Feasibility research on vacuum fluxless laser soldering and mechanism analysis on fluxless action of vacuum were carried out. Fluxless soldering succeeded in spreading and wetting on Cu pad with laser heating source in vacuum surroundings. What' s more, this fluxless technology was applied in surface mounting of chip resistance successfully.
文摘Laser and hot air reflow soldering of PBGA solder ball was investigated. Experimental results showed that surface quality and shear strength of solder bump reflowed by laser was superior than the solder bump by hot air, and the microstructure within the solder bump reflowed by laser was much finer. Analysis on interfacial reaction showed that eutectic solder reacted with Au/Ni/Cu pad shortly after the solder was melted. Interface of solder bump reflowed by laser consists of a continuous AuSn 4 layer and remnant Au element. Needle like AuSn 4 grew sidewise from interface, and then spread out to the entire interface region. A thin layer of Ni 3Sn 4 intermetallic compound was found at the interface of solder bump reflowed by hot air, and AuSn 4 particles distributed within the whole solder bump randomly. The combination effect of the continuous AuSn 4 layer and finer eutectic microstructure contributes to the higher shear strength of solder bump reflowed by laser.
基金This project is supported by National Natural Science Foundation of China !(59671063)
文摘In order to study the mechanism of vacuum fluxless soldering on the conditions of laser heating, the method of measuring temperature by the thermocouple is used to analyze the spreading and wetting process of both fluxless Sn-Pb solder in the vacuum surroundings and flux Sn-Pb solder on Cu pad. Solder spreading and wetting affected by the soldering thermal process is also discussed according to the thermodynamics principle. Results show that vacuum fluxless soldering demands higher temperature, and the fall of the solder surface tension is the important factor achieving fluxless laser soldering.
