Solderabilities of electrodeposited Fe-Ni alloys with SnAgCu solder were examined by wetting balance measurements and compared to those of pure Ni and pure Fe platings. Excellent solderability was found on the Ni-52Fe...Solderabilities of electrodeposited Fe-Ni alloys with SnAgCu solder were examined by wetting balance measurements and compared to those of pure Ni and pure Fe platings. Excellent solderability was found on the Ni-52Fe plating as both the wetting force and kinetics approached or exceeded those on the pure Ni. However, upon further increase in Fe content to 75 at. pct, the solderability of the alloy was severely degraded even though it was still better than that of the pure Fe plating. X-ray photoelectron spectroscopy showed that such a strong dependence of solderability on Fe content is related to the much thinner, incomplete oxide coverage of Ni-rich plating surface.展开更多
Abstract A small amount of rare earth Ce was added to Sn-Cu-Ni solder alloy, and the solderability of Sn-0. 5Cu-0. 05Ni- xCe solders on Cu and Au/Ni/Cu substrates was determined by the wetting balance method. The effe...Abstract A small amount of rare earth Ce was added to Sn-Cu-Ni solder alloy, and the solderability of Sn-0. 5Cu-0. 05Ni- xCe solders on Cu and Au/Ni/Cu substrates was determined by the wetting balance method. The effects of atmosphere, temperature, substrate, and Ce addition on the solderability of Sn-Cu-Ni-xCe solder were studied, respectively, and Auger electron spectroscopy （ AES） analysis in the depth direction of the alloy was carried out to discuss the effect of Ce addition on the solderability. The results indicate that the greatest improvement on the solderability of Sn-Cu-Ni-xCe is obtai^d with around O. 05wt. % -0. 07wt. % Ce addition, for Ce element keeps high content in a specific area in the depth direction from the surface of Sn-Cu-Ni alloy, which decreases the surface tension of molten solder. It is also found that the solderability of Sn-Cu-Ni-xCe solder on Au/Ni/ Cu substrate is better than that on Cu substrate. In N2 atmosphere, the wetting times of Sn- Ca-Ni-xCe alloys are reduced by 10% - 35% , below 1 s at 260 ℃ on Ca substrate, and about 1s at 250 ℃ on Au/Ni/Ca substrate.展开更多
To improve the properties of Sn10Sb8Cu solder alloy, two new solders （SnSbCuAg and SnSbCuNi） were formed by adding small amounts of Ag or Ni into the solder alloy. The results show that the melting point of the SnSb...To improve the properties of Sn10Sb8Cu solder alloy, two new solders （SnSbCuAg and SnSbCuNi） were formed by adding small amounts of Ag or Ni into the solder alloy. The results show that the melting point of the SnSbCuAg solder alloy decreases by 14.1℃ and the spreading area increases by 16.5% compared to the matrix solder. The melting point of the SnSbCuNi solder alloy decreases by 5.4℃ and the spreading area is slightly less than that of the matrix solder. Microstructure analysis shows that adding trace Ag makes the melting point decline due to the dispersed distribution of SnAg phase with low melting point. Adding trace Ni, Cu6Sn5 and （Cu, Ni）6Sn5 with polyhedron shape on the copper substrate can be easily seen in the SnSbCuNi solder alloy, which makes the viscosity of the melting solder increase and the spreading property of the solder decline.展开更多
Al 1060/pure iron clad materials were produced by vacuum roll bonding. The effects of preheating temperature, vacuum roll reduction and initial thickness of the A11060 sheet on the metal interface and bonding strength...Al 1060/pure iron clad materials were produced by vacuum roll bonding. The effects of preheating temperature, vacuum roll reduction and initial thickness of the A11060 sheet on the metal interface and bonding strength were investigated. The interfacial microstructure was investigated and the mechanical properties of the joint were evaluated by shear testing. The bonding strength of the clad materials was generally enhanced by increasing the total reduction or preheating temperature, which caused the metal interface to flatten. No obvious reaction or diffusion layer was observed at the interface between Al 1060 and pure iron. The bonding strength increased with decreasing the initial thickness of the Al 1060 sheets. The Al 1060/pure iron clad materials were soldered with Zn-Al alloy by using an ultrasonic-assisted method. Strong bonding of the Al 1060 layer and Al 7N01 was realized without obvious Al 1060 dissolution or effect on the initial interface of Al 1060/pure iron clad materials by soldering at relatively low temperature.展开更多
The eutectic Sn-9Zn alloy was doped with Ag （0 wt.%-1 wt.%） to form Sn-9Zn-xAg lead-free solder alloys. The effect of the addition of Ag on the microstructure and solderability of this alloy was investigated and int...The eutectic Sn-9Zn alloy was doped with Ag （0 wt.%-1 wt.%） to form Sn-9Zn-xAg lead-free solder alloys. The effect of the addition of Ag on the microstructure and solderability of this alloy was investigated and intermetallic compounds （IMCs） formed at the solder/Cu interface were also examined in this study. The results show that, due to the addition of Ag, the microstructure of the solder changes. When the quantity of Ag is lower than 0.3 wt.%, the needle-like Zn-rich phase decreases gradually. However, when the quantity of Ag is 0.5 wt.%-1 wt.%, Ag-Zn intermetallic compounds appear in the solder. In particular, adding 0.3 wt.% Ag improves the wetting behavior due to the better oxidation resistance of the Sn-9Zn solder. The addition of an excessive amount of Ag will deteriorate the wetting property because the gluti- nosity and fluidity of Sn-9Zn-（0.5, 1）Ag solder decrease. The results also indicate that the addition of Ag to the Sn-Zn solder leads to the precipitation of ε-AgZn3 from the liquid solder on preformed interracial intermetallics （CusZn8）. The peripheral AgZn3, nodular on the Cu5Zn8 IMCs layer, is likely to be generated by a peritectic reaction L ＋ γ-Ag5Zns→AgZn3 and the following crystallization of AgZn3.展开更多
To improve the wettability of hypereutectic Al−60Si alloy and enhance the mechanical properties of the joints,Al−60Si alloy was joined by ultrasonic soldering with Sn-9Zn solder,and a sound joint with in-situ Si parti...To improve the wettability of hypereutectic Al−60Si alloy and enhance the mechanical properties of the joints,Al−60Si alloy was joined by ultrasonic soldering with Sn-9Zn solder,and a sound joint with in-situ Si particle reinforcement was obtained.The oxide film of Al−60Si alloy at the interface was identified by transmission electron microscopy(TEM)analysis as amorphous Al_(2)O_(3).The oxide of Si particles in the base metal was also alumina.The oxide film of Al−60Si alloy was observed to be removed by ultrasonic vibration instead of holding treatment.Si particle-reinforced joints(35.7 vol.%)were obtained by increasing the ultrasonication time.The maximum shear strength peaked at 99.5 MPa for soldering at 330℃with an ultrasonic vibration time of 50 s.A model of forming of Si particles reinforced joint under the ultrasound was proposed,and ultrasonic vibration was considered to promote the dissolution of Al and migration of Si particles.展开更多
Dopamine polymerization reaction and hydrothermal method were used to prepare nickel coated Al_(2)O_(3)reinforcement phase(Ni/Al_(2)O_(3)).Ni/Al_(2)O_(3)reinforced Sn_(1.0)Ag_(0.5)Cu(SAC105)composite solder was prepar...Dopamine polymerization reaction and hydrothermal method were used to prepare nickel coated Al_(2)O_(3)reinforcement phase(Ni/Al_(2)O_(3)).Ni/Al_(2)O_(3)reinforced Sn_(1.0)Ag_(0.5)Cu(SAC105)composite solder was prepared using traditional casting method.The result shows that the nickel coating layer is continuous with uneven thickness.The interface between nickel and aluminum oxide exhibits a metallurgical bonding with coherent interface relationship.The strength,toughness and wettability of the SAC105 solder on the substrate are improved,while the conductivity is not decreased significantly.The fracture mode of composites transitions from a mixed toughness-brittleness mode to a purely toughness-dominated mode,characterized by many dimples.The prepared composite brazing material was made into solder paste for copper plate lap joint experiments.The maximum shear strength is achieved when the doping amount was 0.3wt%.The growth index of intermetallic compound at the brazing interface of Ni/Al_(2)O_(3)reinforced SAC105 composite solder is linearly fitted to n=0.39,demonstrating that the growth of intermetallic compound at the interface is a combined effect of grain boundary diffusion and bulk diffusion.展开更多
Short process forming techniques for brazing and soldering materials can shorten the process,improve product quality,and increase production efficiency,which has received much attention from welding researchers.This r...Short process forming techniques for brazing and soldering materials can shorten the process,improve product quality,and increase production efficiency,which has received much attention from welding researchers.This review mainly summarized the research reports on short process forming techniques for brazing and soldering materials.Firstly,the traditional process and its shortcomings were presented.Secondly,the latest research of short process forming technologies,such as continuous casting technique,atomization powder technique,solder ball forming technique,and rapid solidification technique,was summarized,and the traditional forming performance of several brazing and soldering materials was introduced.Finally,the current restrictions and research trends of short process forming technique for brazing and solder materials were put forward,providing theoretical guidance and reference for related research and technique development in brazing and soldering field.展开更多
The vacuum volatilization kinetics of Pb in In-Pb solder was investigated.The results indicate a significant increase in the vacuum volatilization rates of Pb,25In-75Pb,40In-60Pb,and In with increasing temperatures fr...The vacuum volatilization kinetics of Pb in In-Pb solder was investigated.The results indicate a significant increase in the vacuum volatilization rates of Pb,25In-75Pb,40In-60Pb,and In with increasing temperatures from 923 to 1123 K,system pressure of 3 Pa and holding time of 30 min.The mass transfer coefficients and apparent activation energies of Pb and its alloys were determined at various temperatures.Additionally,a kinetics model was developed to describe Pb vacuum volatilization in high-temperature melts.It is obtained that the vapor mass transfer is the factor limiting the vacuum volatilization rates of Pb and In-Pb alloys under the above specified conditions.展开更多
Sn-based solder is a widely used interconnection material in the field of electronic packaging;however,the performance requirements for these solders are becoming increasingly demanding owing to the rapid development ...Sn-based solder is a widely used interconnection material in the field of electronic packaging;however,the performance requirements for these solders are becoming increasingly demanding owing to the rapid development in this area.In recent years,the addition of micro/nanoreinforcement phases to Sn-based solders has provided a solution to improve the intrinsic properties of the solders.This paper reviews the progress in Sn-based micro/nanoreinforced composite solders over the past decade.The types of reinforcement particles,preparation methods of the composite solders,and strengthening effects on the microstructure,wettability,melting point,mechanical properties,and corrosion resistance under different particle-addition levels are discussed and summarized.The mechanisms of performance enhancement are summarized based on material-strengthening effects such as grain refinement and second-phase dispersion strengthening.In addition,we discuss the current shortcomings of such composite solders and possible future improvements,thereby establishing a theoretical foundation for the future development of Sn-based solders.展开更多
The construction of intermetallic compounds(IMCs)connection layers with special compositions by adding small amounts of alloying elements has been proven to be an effective strategy for improving the reliability of el...The construction of intermetallic compounds(IMCs)connection layers with special compositions by adding small amounts of alloying elements has been proven to be an effective strategy for improving the reliability of electronic component interconnect.However,the synergistic effect mechanism of multi-component alloy compositions on the growth behavior of IMCs is not clear.Herein,we successfully prepared a new quaternary alloy solder with a composition of Sn-0.7Cu-0.175Pt-0.025Al(wt%)using the high-throughput screening(HTS)method.The results showed that it possesses excellent welding performance with an inhibition rate over 40%on the growth of IMCs layers.For Cu_(6)Sn_(5),the co-doping of Al and Pt not only greatly improves its thermodynamic stability,but also effectively suppresses the phase transition.Meanwhile,the co-doping of Al and Pt also significantly delays the generation time of Kirkendall defects.The substitution sites of Al and Pt in Cu_(6)Sn_(5)have been explored using atomic resolution imaging and advanced data informatics,indicating that Al and Pt preferentially substitute Sn and Cu atoms,respectively,to generate(Cu,Pt)_(6)(Sn,Al)_(5).A one-dimensional(1D)kinetic model of the IMCs layer growth at the Sn solder/Cu substrate interface was derived and validated,and the results showed that the error of the derived mathematical model is less than 5%.Finally,the synergistic mechanism of Al and Pt co-doping on the growth rate of Cu_(6)Sn_(5)was further elucidated.This work provides a feasible route for the design and development of multi-component alloy solders.展开更多
The corrosion behavior and life of Sn−3.0Ag−0.5Cu solder joints were investigated through fire smoke exposure experiments within the temperature range of 45−80℃.The nonlinear Wiener process and Arrhenius equation wer...The corrosion behavior and life of Sn−3.0Ag−0.5Cu solder joints were investigated through fire smoke exposure experiments within the temperature range of 45−80℃.The nonlinear Wiener process and Arrhenius equation were used to establish the probability distribution function and prediction model of the solder joint’s average life and individual remaining useful life.The results indicate that solder joint resistance shows a nonlinear growth trend with time increasing.After 24 h,the solder joint transforms from spherical to rose-like shapes.Higher temperatures accelerate solder joint failure,and the relationship between failure time and temperature conforms to the Arrhenius equation.The predicted life of the model is in good agreement with experimental results,demonstrating the effectiveness and accuracy of the model.展开更多
Combining Mg and Al dissimilar metals further reduces structural weight,but the formation of intermetallic compounds(IMCs)affectsAl/Mg joint properties.To prevent IMCs,a Ni-Al_(2)O_(3)composite coating was pre-plated ...Combining Mg and Al dissimilar metals further reduces structural weight,but the formation of intermetallic compounds(IMCs)affectsAl/Mg joint properties.To prevent IMCs,a Ni-Al_(2)O_(3)composite coating was pre-plated on the Mg alloy substrate,and then Sn_(3.0)Ag_(0.5)Cu(SAC 305)solder was utilized to facilitate the joining of AZ31 Mg/6061 Al through ultrasonic-assisted soldering.We investigated the impactof Al_(2)O_(3)nano sol content in the coating on microstructure evolution,IMCs formation,and mechanical properties.Results indicated that theNi-Al_(2)O_(3)composite coating effectively suppressed the Mg-Sn reaction,thereby preventing the formation of Mg_(2)Sn IMC and significantlyenhancing joint strength.In joints with a Ni-Al_(2)O_(3)composite coating containing 50 mL/L Al_(2)O_(3)nano sol,no Mg_(2)Sn IMC was detectedafter 50 min of holding at 260℃,achieving a maximum shear strength of approximately 67.2 MPa.Increasing the Al_(2)O_(3)concentrationfurther expanded the soldering process window.For the joint with Ni-Al_(2)O_(3)(100 mL/L Al_(2)O_(3)nano sol)composite coating held at 260℃for 70 min,the coating was dissolved to a thickness of about 5.8μm,but no Mg_(2)Sn IMC was observed.The Ni-based solid solution formednear the coating/solder interface was strengthened,leading to fractures occurring within the SAC solder,and the maximum shear strengthfurther increased to 73.9 MPa.The strengthening mechanism of the joints facilitated by using the Ni-Al_(2)O_(3)composite coating was revealedby comparing with pure Ni-assisted joints.Therefore,employing a Ni-Al_(2)O_(3)composite coating as a barrier layer represents a promisingstrategy for inhibiting IMC formation during the joining of dissimilar metals.展开更多
Solder joint,crucial component in electronic systems,face significant challenges when exposed to extreme conditions during applications.The solder joint reliability involving microstructure and mechanical properties w...Solder joint,crucial component in electronic systems,face significant challenges when exposed to extreme conditions during applications.The solder joint reliability involving microstructure and mechanical properties will be affected by extreme conditions.Understanding the behaviour of solder joints under extreme conditions is vital to determine the durability and reliability of solder joint.This review paper aims to comprehensively explore the underlying failure mechanism affecting solder joint reliability under extreme conditions.This study covers an in-depth analysis of effect extreme temperature,mechanical stress,and radiation conditions towards solder joint.Impact of each condition to the microstructure including solder matrix and intermetallic compound layer,and mechanical properties such as fatigue,shear strength,creep,and hardness was thoroughly discussed.The failure mechanisms were illustrated in graphical diagrams to ensure clarity and understanding.Furthermore,the paper highlighted mitigation strategies that enhancing solder joint reliability under challenging operating conditions.The findings offer valuable guidance for researchers,engineers,and practitioners involved in electronics,engineering,and related fields,fostering advancements in solder joint reliability and performance.展开更多
Lead-free low melting glasses,ZnO-CuO-Bi_(2)O_(3)-B_(2)O_(3)-SiO_(2)system,with fixed contents of 15 mol%CuO and 20 mol%Bi_(2)O_(3),were prepared by using melt cooling method.Structure and thermal properties of the gl...Lead-free low melting glasses,ZnO-CuO-Bi_(2)O_(3)-B_(2)O_(3)-SiO_(2)system,with fixed contents of 15 mol%CuO and 20 mol%Bi_(2)O_(3),were prepared by using melt cooling method.Structure and thermal properties of the glasses were studied by using X-ray diffractometer(XRD),infrared spectrometer(FIT-IR),thermal dilatometer and differential thermal analyzer(DTA).Chemical durability of the glasses was studied by using dissolution rate method.Wettability of glasses on substrate was tested by using button sintering experiment.It is found that alkaline resistance of the glass solders is lower than that of plate glass and the water resistance is comparable with that of plate glass.The sealing temperatures are Ts=445-490℃,while the average thermal expansion coefficient from room temperature to 300℃is in the range of(65-82)×10^(−7)℃^(−1).At sealing temperature,the glass solders have good wettability on plate glass or alumina substrate.They are not crystallized even sintered at the sealing temperature for 30 min.The solder glasses are suitable for sealing plate glass,alumina and other inorganic non-metallic materials.展开更多
Sn/ENIG has recently been used in flexible interconnects to form a more stable micron-sized metallurgical joint,due to high power capability which causes solder joints to heat up to 200℃.However,Cu_(6)Sn_(5)which is ...Sn/ENIG has recently been used in flexible interconnects to form a more stable micron-sized metallurgical joint,due to high power capability which causes solder joints to heat up to 200℃.However,Cu_(6)Sn_(5)which is critical for a microelectronic interconnection,will go through a phase transition at temperatures between 186 and 189℃.This research conducted an in-situ TEM study of a micro Cu/ENIG/Sn solder joint under isothermal aging test and proposed a model to illustrate the mechanism of the microstructural evolution.The results showed that part of the Sn solder reacted with Cu diffused from the electrode to formη´-Cu_(6)Sn_(5)during the ultrasonic bonding process,while the rest of Sn was left and enriched in a region in the solder joint.But the enriched Sn quickly diffused to both sides when the temperature reached 100℃,reacting with the ENIG coating and Cu to form(Ni_(x)Cu_(1-x))_(3)Sn_(4),AuSn_(4),and Cu_(6)Sn_(5)IMCs.After entering the heat preservation process,the diffusion of Cu from the electrode to the joint became more intense,resulting in the formation of Cu_(3)Sn.The scallop-type Cu_(6)Sn_(5)and the seahorse-type Cu_(3)Sn constituted a typical two-layered structure in the solder joint.Most importantly,the transition betweenηandη’was captured near the phase transition temperature for Cu_(6)Sn_(5)during both the heating and cooling process,which was accompanied by a volume shifting,and the transition process was further studied.This research is expected to serve as a reference for the service of micro Cu/ENIG/Sn solder joints in the electronic industry.展开更多
The void defect in intermetallic compounds(IMCs)layer at the joints caused by inhomogeneous atomic diffusion is one of the most important factors limiting the further development of Sn-based solders.In this work,the t...The void defect in intermetallic compounds(IMCs)layer at the joints caused by inhomogeneous atomic diffusion is one of the most important factors limiting the further development of Sn-based solders.In this work,the thermodynamic stability of IMCs(high-temperatureη-Cu_(6)Sn_(5)and o-Cu_(3)Sn phases)was improved by adding small amounts of indium(In),and the IMCs layers with moderate thickness,low defect concentrations and stable interface bonding were successfully obtained.The formation order of compounds and the interfacial orientation relationships in IMCs layers,the atomic diffusion mechanism,and the growth tuning mechanism of In onη-Cu_(6)Sn_(5)and Cu_(3)Sn,after In adding,were discussed com-prehensively by combining calculations and experiments.It is the first time that the classic heteroge-neous nucleation theory and CALPHAD data were used to obtain the critical nucleus radius ofη-Cu_(6)Sn_(5)and Cu_(3)Sn,and to explain in detail the main factors affecting the formation order and location of IMCs at joints during the welding process.A novel and systematic growth model about IMCs layers in the case of doping with alloying elements was proposed.The growth tuning mechanism of In doping onη-Cu_(6)Sn_(5)and Cu_(3)Sn was further clarified based on the proposed model using first-principles calculations.The growth model used in this study can provide insights into the development and design of multiele-ment Sn-based solders.展开更多
Different amounts of Fe(0.005,0.01,0.03,0.05,and 0.07 wt%)were added to SAC305 to study the shear behavior damage of Fe-doped SAC solder joints under thermal loading(170℃,holding time of 0,250,500,and 750 h).The resu...Different amounts of Fe(0.005,0.01,0.03,0.05,and 0.07 wt%)were added to SAC305 to study the shear behavior damage of Fe-doped SAC solder joints under thermal loading(170℃,holding time of 0,250,500,and 750 h).The results show that during isothermal aging at 170℃,the average shear force of all solder joints decreases with increasing aging time,while the average fracture energy first increases and then decreases,reaching a maximum at 500 h.Minor Fe doping could both increase shear forces and related fracture energy,with the optimum Fe doping amount being 0.03 wt%within the entire aging range.This is because the doping Fe reduces the undercooling of the SAC305 alloy,resulting in the microstructure refining of solder joints.This in turn causes the microstructure changing from network structure(SAC305 joint:eutectic network+β-Sn)to a single matrix structure(0.03Fe-doped SAC305 joint:β-Sn matrix+small compound particles).Specifically,Fe atoms can replace some Cu in Cu_(6)Sn_(5)(both inside the solder joint and at the interface),and then form(Cu,Fe)_(6)Sn_(5) compounds,resulting in an increase in the elastic modulus and nanohardness of the compounds.Moreover,the growth of Cu_(6)Sn_(5) and Cu_(3)Sn intermetallic compounds(IMC)layer are inhibited by Fe doping even after the aging time prolonging,and Fe aggregates near the interface compound to form FeSn_(2).This study is of great significance for controlling the growth of interfacial compounds,stabilizing the microstructures,and providing strengthening strategy for solder joint alloy design.展开更多
In the realm of military and defence applications, exposure to radiation significantly challenges the performance and reliability of solder alloys and joints in electronic systems. This comprehensive review examines r...In the realm of military and defence applications, exposure to radiation significantly challenges the performance and reliability of solder alloys and joints in electronic systems. This comprehensive review examines radiation-induced effects on solder alloys and solder joints in terms of microstructure and mechanical properties. In this paper, we evaluate the existing literature, including experimental studies and fundamental theory, to provide a comprehensive overview of the behavior of solder materials under radiation. A review of the literature highlights key mechanisms that contribute to radiation-induced changes in the microstructure, such as the formation of intermetallic compounds, grain growth,micro-voids and micro-cracks. Radiation is explored as a factor influencing solder alloy hardness,strength, fatigue and ductility. Moreover, the review addresses the challenges and limitations inherent in studying the effects of radiation on solder materials and offers recommendations for future research. It is crucial to understand radiation-induced effects on solder performance to design robust and radiationresistant electronic systems. A review of radiation effects on solder materials and their applications in electronics serves as a valuable resource for researchers, engineers, and practitioners in that field.展开更多
文摘Solderabilities of electrodeposited Fe-Ni alloys with SnAgCu solder were examined by wetting balance measurements and compared to those of pure Ni and pure Fe platings. Excellent solderability was found on the Ni-52Fe plating as both the wetting force and kinetics approached or exceeded those on the pure Ni. However, upon further increase in Fe content to 75 at. pct, the solderability of the alloy was severely degraded even though it was still better than that of the pure Fe plating. X-ray photoelectron spectroscopy showed that such a strong dependence of solderability on Fe content is related to the much thinner, incomplete oxide coverage of Ni-rich plating surface.
文摘Abstract A small amount of rare earth Ce was added to Sn-Cu-Ni solder alloy, and the solderability of Sn-0. 5Cu-0. 05Ni- xCe solders on Cu and Au/Ni/Cu substrates was determined by the wetting balance method. The effects of atmosphere, temperature, substrate, and Ce addition on the solderability of Sn-Cu-Ni-xCe solder were studied, respectively, and Auger electron spectroscopy （ AES） analysis in the depth direction of the alloy was carried out to discuss the effect of Ce addition on the solderability. The results indicate that the greatest improvement on the solderability of Sn-Cu-Ni-xCe is obtai^d with around O. 05wt. % -0. 07wt. % Ce addition, for Ce element keeps high content in a specific area in the depth direction from the surface of Sn-Cu-Ni alloy, which decreases the surface tension of molten solder. It is also found that the solderability of Sn-Cu-Ni-xCe solder on Au/Ni/ Cu substrate is better than that on Cu substrate. In N2 atmosphere, the wetting times of Sn- Ca-Ni-xCe alloys are reduced by 10% - 35% , below 1 s at 260 ℃ on Ca substrate, and about 1s at 250 ℃ on Au/Ni/Ca substrate.
基金supported by the Program for Science & Technology Innovation Talents in Universities of Henan Province (No.2010HASTIT032)the City Key Technologies R & D Program of Luoyang (No.0801038A), China
文摘To improve the properties of Sn10Sb8Cu solder alloy, two new solders （SnSbCuAg and SnSbCuNi） were formed by adding small amounts of Ag or Ni into the solder alloy. The results show that the melting point of the SnSbCuAg solder alloy decreases by 14.1℃ and the spreading area increases by 16.5% compared to the matrix solder. The melting point of the SnSbCuNi solder alloy decreases by 5.4℃ and the spreading area is slightly less than that of the matrix solder. Microstructure analysis shows that adding trace Ag makes the melting point decline due to the dispersed distribution of SnAg phase with low melting point. Adding trace Ni, Cu6Sn5 and （Cu, Ni）6Sn5 with polyhedron shape on the copper substrate can be easily seen in the SnSbCuNi solder alloy, which makes the viscosity of the melting solder increase and the spreading property of the solder decline.
基金the project from the International S&T Cooperation (No.2011DFR 50630)Special Research Program for Innovation Talents from Harbin Municipality of Science and Technology (2012RFXXG071,2010RFQXG020)Harbin Science and Technology Innovation Youth Talents Fund (No.2010RFQXG003)
文摘Al 1060/pure iron clad materials were produced by vacuum roll bonding. The effects of preheating temperature, vacuum roll reduction and initial thickness of the A11060 sheet on the metal interface and bonding strength were investigated. The interfacial microstructure was investigated and the mechanical properties of the joint were evaluated by shear testing. The bonding strength of the clad materials was generally enhanced by increasing the total reduction or preheating temperature, which caused the metal interface to flatten. No obvious reaction or diffusion layer was observed at the interface between Al 1060 and pure iron. The bonding strength increased with decreasing the initial thickness of the Al 1060 sheets. The Al 1060/pure iron clad materials were soldered with Zn-Al alloy by using an ultrasonic-assisted method. Strong bonding of the Al 1060 layer and Al 7N01 was realized without obvious Al 1060 dissolution or effect on the initial interface of Al 1060/pure iron clad materials by soldering at relatively low temperature.
基金supported by the Jiangsu Six-kind Skilled Personnel Project,China (No.06-E-020)
文摘The eutectic Sn-9Zn alloy was doped with Ag （0 wt.%-1 wt.%） to form Sn-9Zn-xAg lead-free solder alloys. The effect of the addition of Ag on the microstructure and solderability of this alloy was investigated and intermetallic compounds （IMCs） formed at the solder/Cu interface were also examined in this study. The results show that, due to the addition of Ag, the microstructure of the solder changes. When the quantity of Ag is lower than 0.3 wt.%, the needle-like Zn-rich phase decreases gradually. However, when the quantity of Ag is 0.5 wt.%-1 wt.%, Ag-Zn intermetallic compounds appear in the solder. In particular, adding 0.3 wt.% Ag improves the wetting behavior due to the better oxidation resistance of the Sn-9Zn solder. The addition of an excessive amount of Ag will deteriorate the wetting property because the gluti- nosity and fluidity of Sn-9Zn-（0.5, 1）Ag solder decrease. The results also indicate that the addition of Ag to the Sn-Zn solder leads to the precipitation of ε-AgZn3 from the liquid solder on preformed interracial intermetallics （CusZn8）. The peripheral AgZn3, nodular on the Cu5Zn8 IMCs layer, is likely to be generated by a peritectic reaction L ＋ γ-Ag5Zns→AgZn3 and the following crystallization of AgZn3.
基金financial support from the National Natural Science Foundation of China(Nos.52275385,U2167216)Sichuan Province Science and Technology Support Program,China(No.2022YFG0086).
文摘To improve the wettability of hypereutectic Al−60Si alloy and enhance the mechanical properties of the joints,Al−60Si alloy was joined by ultrasonic soldering with Sn-9Zn solder,and a sound joint with in-situ Si particle reinforcement was obtained.The oxide film of Al−60Si alloy at the interface was identified by transmission electron microscopy(TEM)analysis as amorphous Al_(2)O_(3).The oxide of Si particles in the base metal was also alumina.The oxide film of Al−60Si alloy was observed to be removed by ultrasonic vibration instead of holding treatment.Si particle-reinforced joints(35.7 vol.%)were obtained by increasing the ultrasonication time.The maximum shear strength peaked at 99.5 MPa for soldering at 330℃with an ultrasonic vibration time of 50 s.A model of forming of Si particles reinforced joint under the ultrasound was proposed,and ultrasonic vibration was considered to promote the dissolution of Al and migration of Si particles.
基金ational Natural Science Foundation of China(U1604132)Central Plains Talents Program-Fund of Central Plains Leading Talents(ZYYCYU002130)+1 种基金Key Technology Research and Development Program of Henan Province(222102230114)Major Scientific Research Foundation of Higher Education of Henan Province(23B430003)。
文摘Dopamine polymerization reaction and hydrothermal method were used to prepare nickel coated Al_(2)O_(3)reinforcement phase(Ni/Al_(2)O_(3)).Ni/Al_(2)O_(3)reinforced Sn_(1.0)Ag_(0.5)Cu(SAC105)composite solder was prepared using traditional casting method.The result shows that the nickel coating layer is continuous with uneven thickness.The interface between nickel and aluminum oxide exhibits a metallurgical bonding with coherent interface relationship.The strength,toughness and wettability of the SAC105 solder on the substrate are improved,while the conductivity is not decreased significantly.The fracture mode of composites transitions from a mixed toughness-brittleness mode to a purely toughness-dominated mode,characterized by many dimples.The prepared composite brazing material was made into solder paste for copper plate lap joint experiments.The maximum shear strength is achieved when the doping amount was 0.3wt%.The growth index of intermetallic compound at the brazing interface of Ni/Al_(2)O_(3)reinforced SAC105 composite solder is linearly fitted to n=0.39,demonstrating that the growth of intermetallic compound at the interface is a combined effect of grain boundary diffusion and bulk diffusion.
基金National Key Research and Development Program(2021YFB3401101)。
文摘Short process forming techniques for brazing and soldering materials can shorten the process,improve product quality,and increase production efficiency,which has received much attention from welding researchers.This review mainly summarized the research reports on short process forming techniques for brazing and soldering materials.Firstly,the traditional process and its shortcomings were presented.Secondly,the latest research of short process forming technologies,such as continuous casting technique,atomization powder technique,solder ball forming technique,and rapid solidification technique,was summarized,and the traditional forming performance of several brazing and soldering materials was introduced.Finally,the current restrictions and research trends of short process forming technique for brazing and solder materials were put forward,providing theoretical guidance and reference for related research and technique development in brazing and soldering field.
基金financially supported by the Fundamental Research Project of Yunnan Province,China(Nos.202301AW070020,202201AT070229,202105AC160091,202202AB080018).
文摘The vacuum volatilization kinetics of Pb in In-Pb solder was investigated.The results indicate a significant increase in the vacuum volatilization rates of Pb,25In-75Pb,40In-60Pb,and In with increasing temperatures from 923 to 1123 K,system pressure of 3 Pa and holding time of 30 min.The mass transfer coefficients and apparent activation energies of Pb and its alloys were determined at various temperatures.Additionally,a kinetics model was developed to describe Pb vacuum volatilization in high-temperature melts.It is obtained that the vapor mass transfer is the factor limiting the vacuum volatilization rates of Pb and In-Pb alloys under the above specified conditions.
基金financially supported by the State Key Laboratory for Mechanical Behavior of Materials,China(No.202325012)the National Natural Science Foundation of China(No.U21A20128).
文摘Sn-based solder is a widely used interconnection material in the field of electronic packaging;however,the performance requirements for these solders are becoming increasingly demanding owing to the rapid development in this area.In recent years,the addition of micro/nanoreinforcement phases to Sn-based solders has provided a solution to improve the intrinsic properties of the solders.This paper reviews the progress in Sn-based micro/nanoreinforced composite solders over the past decade.The types of reinforcement particles,preparation methods of the composite solders,and strengthening effects on the microstructure,wettability,melting point,mechanical properties,and corrosion resistance under different particle-addition levels are discussed and summarized.The mechanisms of performance enhancement are summarized based on material-strengthening effects such as grain refinement and second-phase dispersion strengthening.In addition,we discuss the current shortcomings of such composite solders and possible future improvements,thereby establishing a theoretical foundation for the future development of Sn-based solders.
基金financially supported by the Innovation Team Cultivation Project of Yunnan Province(No.202005AE160016)the Key Research&Development Program of Yunnan Province(No.202103AA080017)Yunnan Ten Thousand Talents Plan Young&Elite Talents Project(No.YNWR-QNBJ2018-044)。
文摘The construction of intermetallic compounds(IMCs)connection layers with special compositions by adding small amounts of alloying elements has been proven to be an effective strategy for improving the reliability of electronic component interconnect.However,the synergistic effect mechanism of multi-component alloy compositions on the growth behavior of IMCs is not clear.Herein,we successfully prepared a new quaternary alloy solder with a composition of Sn-0.7Cu-0.175Pt-0.025Al(wt%)using the high-throughput screening(HTS)method.The results showed that it possesses excellent welding performance with an inhibition rate over 40%on the growth of IMCs layers.For Cu_(6)Sn_(5),the co-doping of Al and Pt not only greatly improves its thermodynamic stability,but also effectively suppresses the phase transition.Meanwhile,the co-doping of Al and Pt also significantly delays the generation time of Kirkendall defects.The substitution sites of Al and Pt in Cu_(6)Sn_(5)have been explored using atomic resolution imaging and advanced data informatics,indicating that Al and Pt preferentially substitute Sn and Cu atoms,respectively,to generate(Cu,Pt)_(6)(Sn,Al)_(5).A one-dimensional(1D)kinetic model of the IMCs layer growth at the Sn solder/Cu substrate interface was derived and validated,and the results showed that the error of the derived mathematical model is less than 5%.Finally,the synergistic mechanism of Al and Pt co-doping on the growth rate of Cu_(6)Sn_(5)was further elucidated.This work provides a feasible route for the design and development of multi-component alloy solders.
基金National Natural Science Foundation of China (No. 52206180)Fundamental Research Funds for the Central Universities,China (No. WK2320000050)。
文摘The corrosion behavior and life of Sn−3.0Ag−0.5Cu solder joints were investigated through fire smoke exposure experiments within the temperature range of 45−80℃.The nonlinear Wiener process and Arrhenius equation were used to establish the probability distribution function and prediction model of the solder joint’s average life and individual remaining useful life.The results indicate that solder joint resistance shows a nonlinear growth trend with time increasing.After 24 h,the solder joint transforms from spherical to rose-like shapes.Higher temperatures accelerate solder joint failure,and the relationship between failure time and temperature conforms to the Arrhenius equation.The predicted life of the model is in good agreement with experimental results,demonstrating the effectiveness and accuracy of the model.
基金support from the National Natural Science Foundation of China(grant numbers 52275385 and U2167216).
文摘Combining Mg and Al dissimilar metals further reduces structural weight,but the formation of intermetallic compounds(IMCs)affectsAl/Mg joint properties.To prevent IMCs,a Ni-Al_(2)O_(3)composite coating was pre-plated on the Mg alloy substrate,and then Sn_(3.0)Ag_(0.5)Cu(SAC 305)solder was utilized to facilitate the joining of AZ31 Mg/6061 Al through ultrasonic-assisted soldering.We investigated the impactof Al_(2)O_(3)nano sol content in the coating on microstructure evolution,IMCs formation,and mechanical properties.Results indicated that theNi-Al_(2)O_(3)composite coating effectively suppressed the Mg-Sn reaction,thereby preventing the formation of Mg_(2)Sn IMC and significantlyenhancing joint strength.In joints with a Ni-Al_(2)O_(3)composite coating containing 50 mL/L Al_(2)O_(3)nano sol,no Mg_(2)Sn IMC was detectedafter 50 min of holding at 260℃,achieving a maximum shear strength of approximately 67.2 MPa.Increasing the Al_(2)O_(3)concentrationfurther expanded the soldering process window.For the joint with Ni-Al_(2)O_(3)(100 mL/L Al_(2)O_(3)nano sol)composite coating held at 260℃for 70 min,the coating was dissolved to a thickness of about 5.8μm,but no Mg_(2)Sn IMC was observed.The Ni-based solid solution formednear the coating/solder interface was strengthened,leading to fractures occurring within the SAC solder,and the maximum shear strengthfurther increased to 73.9 MPa.The strengthening mechanism of the joints facilitated by using the Ni-Al_(2)O_(3)composite coating was revealedby comparing with pure Ni-assisted joints.Therefore,employing a Ni-Al_(2)O_(3)composite coating as a barrier layer represents a promisingstrategy for inhibiting IMC formation during the joining of dissimilar metals.
基金fully supported by a Tabung Amanah Pusat Pengurusan Penyelidikan&Inovasi(PPPI)(Grant No.PS060-UPNM/2023/GPPP/SG/1)Universiti Pertahanan Nasional Malaysia(UPNM)for funding this study。
文摘Solder joint,crucial component in electronic systems,face significant challenges when exposed to extreme conditions during applications.The solder joint reliability involving microstructure and mechanical properties will be affected by extreme conditions.Understanding the behaviour of solder joints under extreme conditions is vital to determine the durability and reliability of solder joint.This review paper aims to comprehensively explore the underlying failure mechanism affecting solder joint reliability under extreme conditions.This study covers an in-depth analysis of effect extreme temperature,mechanical stress,and radiation conditions towards solder joint.Impact of each condition to the microstructure including solder matrix and intermetallic compound layer,and mechanical properties such as fatigue,shear strength,creep,and hardness was thoroughly discussed.The failure mechanisms were illustrated in graphical diagrams to ensure clarity and understanding.Furthermore,the paper highlighted mitigation strategies that enhancing solder joint reliability under challenging operating conditions.The findings offer valuable guidance for researchers,engineers,and practitioners involved in electronics,engineering,and related fields,fostering advancements in solder joint reliability and performance.
基金National Natural Science Foundation of China(52172070)Jiangxi Provincial Natural Science Foundation(20242BAB25222)Jiangxi Provincial Graduate Innovation Special Fund Project(YC2022-S882 and YC2023-S808).
文摘Lead-free low melting glasses,ZnO-CuO-Bi_(2)O_(3)-B_(2)O_(3)-SiO_(2)system,with fixed contents of 15 mol%CuO and 20 mol%Bi_(2)O_(3),were prepared by using melt cooling method.Structure and thermal properties of the glasses were studied by using X-ray diffractometer(XRD),infrared spectrometer(FIT-IR),thermal dilatometer and differential thermal analyzer(DTA).Chemical durability of the glasses was studied by using dissolution rate method.Wettability of glasses on substrate was tested by using button sintering experiment.It is found that alkaline resistance of the glass solders is lower than that of plate glass and the water resistance is comparable with that of plate glass.The sealing temperatures are Ts=445-490℃,while the average thermal expansion coefficient from room temperature to 300℃is in the range of(65-82)×10^(−7)℃^(−1).At sealing temperature,the glass solders have good wettability on plate glass or alumina substrate.They are not crystallized even sintered at the sealing temperature for 30 min.The solder glasses are suitable for sealing plate glass,alumina and other inorganic non-metallic materials.
基金supported by the opening fund of National Key Research and Development Program of China(No.2020YFE0205300)Key Laboratory of Science and Technology on Silicon Devices,Chinese Academy of Sciences(No.KLSDTJJ2022-5)+1 种基金Chongqing Natural Science Foundation of China(No.cstc2021jcyj-msxmX1002)the Fundamental Research Funds for the Central Universities(No.AUGA5710051221).
文摘Sn/ENIG has recently been used in flexible interconnects to form a more stable micron-sized metallurgical joint,due to high power capability which causes solder joints to heat up to 200℃.However,Cu_(6)Sn_(5)which is critical for a microelectronic interconnection,will go through a phase transition at temperatures between 186 and 189℃.This research conducted an in-situ TEM study of a micro Cu/ENIG/Sn solder joint under isothermal aging test and proposed a model to illustrate the mechanism of the microstructural evolution.The results showed that part of the Sn solder reacted with Cu diffused from the electrode to formη´-Cu_(6)Sn_(5)during the ultrasonic bonding process,while the rest of Sn was left and enriched in a region in the solder joint.But the enriched Sn quickly diffused to both sides when the temperature reached 100℃,reacting with the ENIG coating and Cu to form(Ni_(x)Cu_(1-x))_(3)Sn_(4),AuSn_(4),and Cu_(6)Sn_(5)IMCs.After entering the heat preservation process,the diffusion of Cu from the electrode to the joint became more intense,resulting in the formation of Cu_(3)Sn.The scallop-type Cu_(6)Sn_(5)and the seahorse-type Cu_(3)Sn constituted a typical two-layered structure in the solder joint.Most importantly,the transition betweenηandη’was captured near the phase transition temperature for Cu_(6)Sn_(5)during both the heating and cooling process,which was accompanied by a volume shifting,and the transition process was further studied.This research is expected to serve as a reference for the service of micro Cu/ENIG/Sn solder joints in the electronic industry.
基金supported by the Innovation Team Cultivation Project of Yunnan Province(No.202005AE160016)Key Research&Development Program of Yunnan Province(No.202103AA080017)Yunnan Ten Thousand Talents Plan Young&Elite Talents Project(No.YNWR-QNBJ-2018-044).
文摘The void defect in intermetallic compounds(IMCs)layer at the joints caused by inhomogeneous atomic diffusion is one of the most important factors limiting the further development of Sn-based solders.In this work,the thermodynamic stability of IMCs(high-temperatureη-Cu_(6)Sn_(5)and o-Cu_(3)Sn phases)was improved by adding small amounts of indium(In),and the IMCs layers with moderate thickness,low defect concentrations and stable interface bonding were successfully obtained.The formation order of compounds and the interfacial orientation relationships in IMCs layers,the atomic diffusion mechanism,and the growth tuning mechanism of In onη-Cu_(6)Sn_(5)and Cu_(3)Sn,after In adding,were discussed com-prehensively by combining calculations and experiments.It is the first time that the classic heteroge-neous nucleation theory and CALPHAD data were used to obtain the critical nucleus radius ofη-Cu_(6)Sn_(5)and Cu_(3)Sn,and to explain in detail the main factors affecting the formation order and location of IMCs at joints during the welding process.A novel and systematic growth model about IMCs layers in the case of doping with alloying elements was proposed.The growth tuning mechanism of In doping onη-Cu_(6)Sn_(5)and Cu_(3)Sn was further clarified based on the proposed model using first-principles calculations.The growth model used in this study can provide insights into the development and design of multiele-ment Sn-based solders.
基金supported by the Yunnan Fundamental Research Projects(No.202301BC070001-001)funded by the Yunnan Provincial Department of Science and Technologythe Yunnan Provincial Science and Technology Plan Project(No.202005AF150045)+1 种基金the Jiangsu Province Industry-University-Research Cooperation Project(No.BY2022832)funded by the Jiangsu Provincial Department of Science and Technologythe National Natural Science Foundation of China(No.52275339).
文摘Different amounts of Fe(0.005,0.01,0.03,0.05,and 0.07 wt%)were added to SAC305 to study the shear behavior damage of Fe-doped SAC solder joints under thermal loading(170℃,holding time of 0,250,500,and 750 h).The results show that during isothermal aging at 170℃,the average shear force of all solder joints decreases with increasing aging time,while the average fracture energy first increases and then decreases,reaching a maximum at 500 h.Minor Fe doping could both increase shear forces and related fracture energy,with the optimum Fe doping amount being 0.03 wt%within the entire aging range.This is because the doping Fe reduces the undercooling of the SAC305 alloy,resulting in the microstructure refining of solder joints.This in turn causes the microstructure changing from network structure(SAC305 joint:eutectic network+β-Sn)to a single matrix structure(0.03Fe-doped SAC305 joint:β-Sn matrix+small compound particles).Specifically,Fe atoms can replace some Cu in Cu_(6)Sn_(5)(both inside the solder joint and at the interface),and then form(Cu,Fe)_(6)Sn_(5) compounds,resulting in an increase in the elastic modulus and nanohardness of the compounds.Moreover,the growth of Cu_(6)Sn_(5) and Cu_(3)Sn intermetallic compounds(IMC)layer are inhibited by Fe doping even after the aging time prolonging,and Fe aggregates near the interface compound to form FeSn_(2).This study is of great significance for controlling the growth of interfacial compounds,stabilizing the microstructures,and providing strengthening strategy for solder joint alloy design.
基金fully supported by a Tabung Amanah Pusat Pengurusan Penyelidikan dan Inovasi (PPPI) grant (UPNM/2023/GPPP/SG/1)Universiti Pertahanan Nasional Malaysia (UPNM) for funding this study。
文摘In the realm of military and defence applications, exposure to radiation significantly challenges the performance and reliability of solder alloys and joints in electronic systems. This comprehensive review examines radiation-induced effects on solder alloys and solder joints in terms of microstructure and mechanical properties. In this paper, we evaluate the existing literature, including experimental studies and fundamental theory, to provide a comprehensive overview of the behavior of solder materials under radiation. A review of the literature highlights key mechanisms that contribute to radiation-induced changes in the microstructure, such as the formation of intermetallic compounds, grain growth,micro-voids and micro-cracks. Radiation is explored as a factor influencing solder alloy hardness,strength, fatigue and ductility. Moreover, the review addresses the challenges and limitations inherent in studying the effects of radiation on solder materials and offers recommendations for future research. It is crucial to understand radiation-induced effects on solder performance to design robust and radiationresistant electronic systems. A review of radiation effects on solder materials and their applications in electronics serves as a valuable resource for researchers, engineers, and practitioners in that field.
