To improve the wettability of hypereutectic Al−60Si alloy and enhance the mechanical properties of the joints,Al−60Si alloy was joined by ultrasonic soldering with Sn-9Zn solder,and a sound joint with in-situ Si parti...To improve the wettability of hypereutectic Al−60Si alloy and enhance the mechanical properties of the joints,Al−60Si alloy was joined by ultrasonic soldering with Sn-9Zn solder,and a sound joint with in-situ Si particle reinforcement was obtained.The oxide film of Al−60Si alloy at the interface was identified by transmission electron microscopy(TEM)analysis as amorphous Al_(2)O_(3).The oxide of Si particles in the base metal was also alumina.The oxide film of Al−60Si alloy was observed to be removed by ultrasonic vibration instead of holding treatment.Si particle-reinforced joints(35.7 vol.%)were obtained by increasing the ultrasonication time.The maximum shear strength peaked at 99.5 MPa for soldering at 330℃with an ultrasonic vibration time of 50 s.A model of forming of Si particles reinforced joint under the ultrasound was proposed,and ultrasonic vibration was considered to promote the dissolution of Al and migration of Si particles.展开更多
基金financial support from the National Natural Science Foundation of China(Nos.52275385,U2167216)Sichuan Province Science and Technology Support Program,China(No.2022YFG0086).
文摘To improve the wettability of hypereutectic Al−60Si alloy and enhance the mechanical properties of the joints,Al−60Si alloy was joined by ultrasonic soldering with Sn-9Zn solder,and a sound joint with in-situ Si particle reinforcement was obtained.The oxide film of Al−60Si alloy at the interface was identified by transmission electron microscopy(TEM)analysis as amorphous Al_(2)O_(3).The oxide of Si particles in the base metal was also alumina.The oxide film of Al−60Si alloy was observed to be removed by ultrasonic vibration instead of holding treatment.Si particle-reinforced joints(35.7 vol.%)were obtained by increasing the ultrasonication time.The maximum shear strength peaked at 99.5 MPa for soldering at 330℃with an ultrasonic vibration time of 50 s.A model of forming of Si particles reinforced joint under the ultrasound was proposed,and ultrasonic vibration was considered to promote the dissolution of Al and migration of Si particles.
