期刊文献+
共找到263篇文章
< 1 2 14 >
每页显示 20 50 100
Recycled micron-sized silicon anode for fast and highly stable lithium-ion storage via interface design engineering
1
作者 Dandan Luo Yongjun Lu +3 位作者 Guanjia Zhu Jihao Li Xiuyan Liu Haijiao Zhang 《Journal of Energy Chemistry》 2025年第8期63-73,共11页
Micron-sized silicon anodes offer significant industrial advantages over nanoscale counterparts due to their cost-effectiveness and scalability.However,their practical applications are significantly hindered by severe... Micron-sized silicon anodes offer significant industrial advantages over nanoscale counterparts due to their cost-effectiveness and scalability.However,their practical applications are significantly hindered by severe stress-induced fragmentation,leading to rapid capacity decay.Addressing this challenge,we introduce a novel dual-conformal encapsulated micron-sized porous Si(μm-pSi)anode by utilizingμm-Si recycled from the photovoltaic industry as the Si precursor.This encapsulation design of the internal conformal SiO_(x)/C layer and external Ti_(3)C_(2)Tx MXene layer forms intergranular and intragranular protective skins onμm-pSi,ensuring simultaneous mechanical and electrochemical stability for efficient Li+storage.As a result,the fabricated WpSi@SiO_(x)/C@MXene anode demonstrates an exceptional cycling performance,delivering 535.1 mA h g^(−1)after 1500 cycles at 5 A g^(−1)with a minimal capacity decay of 0.003%per cycle.Chemo-mechanical modeling and SEI analysis reveal that the dual-conformal coating achieves exceptional mechanical and electrochemical stability through robust mechanical confinement and ultra-fast Li+diffusion kinetics during lithiation,coupled with a Li_(2)CO_(3)/LiF-rich hybrid SEI that facilitates Li+transport,collectively enabling rate-insensitive stress evolution,long-term structural durability,and stable cycling under high-rate conditions.This work provides a compelling design strategy for leveraging sustainableμm-Si to achieve high-rate and long-life lithium-ion batteries. 展开更多
关键词 Micron-sized si Dual-conformal coating interface engineering ANODE Lithium-ion batteries
在线阅读 下载PDF
Physical Properties of CrSb/InP(001): Effect of Interface in Half-Metallic
2
作者 Arash Boochani Shahram Solymani +3 位作者 Sahar Rezaee Negin Beryani Nezafat Sara Fakhrai Tadayon Amin Aminian 《World Journal of Nano Science and Engineering》 2013年第3期79-86,共8页
In this study, density functional theory in improved flat waves’ framework has been used. First of all, characterization, elastic and half-metallic properties of the CrSb-ZB compound at (GGA & LDA) and GGA + U ap... In this study, density functional theory in improved flat waves’ framework has been used. First of all, characterization, elastic and half-metallic properties of the CrSb-ZB compound at (GGA & LDA) and GGA + U approximation are calculated. The elastic calculations indicate that the CrSb-ZB is a ductile material. However, the calculation of Deby temperature indicates that the CrSb-ZB is meta-stable. The half-metallicity character is also preserved at CrSb/InP (001) interface by GGA + U. The conduction band minimum (CBM) of CrSb in the minority spin case lies about 1.26 eV above that of GaSb, suggesting that the major spin can be injected into GaSb without being flipped to the conduction bands of the minor spin. 展开更多
关键词 SPINTRONIC interface Crsb-inp Density FUNCTIONAL Theory GGA + U
在线阅读 下载PDF
Theoretical Studies on the Si(001)-SiO_2 Interface Structure 被引量:1
3
作者 ZHOU Ming-Xiu YANG Chun +2 位作者 DENG Xiao-Yan YU Wei-Fei LI Jin-Shan 《Chinese Journal of Structural Chemistry》 SCIE CAS CSCD 北大核心 2006年第6期647-652,共6页
Novel models (2× 1) of Si(001)-SiO2 interface structure have been established. The method of the first-principle General Gradient Approximation (GGA) is employed to structurally optimize the established the... Novel models (2× 1) of Si(001)-SiO2 interface structure have been established. The method of the first-principle General Gradient Approximation (GGA) is employed to structurally optimize the established theoretical models under the K-point space of periodic boundary condition. The structures after optimization have been analyzed, and the results show that the interfaces present in disordered state and both Si-O-Si and Si=O structures exist. Meanwhile, the bonding of surface structure is analyzed via the graphics of electron localization function(ELF). 展开更多
关键词 si/siO2 DFT interface structure
在线阅读 下载PDF
Preparation and interface modification of Si3N4f/SiO2 composites 被引量:1
4
作者 Yubo Houa Xuejin Yang +3 位作者 Bin Li Duan Li Shitao Gao Zhongshuai Wu 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 2019年第12期2767-2771,共5页
In order to modify the interface, Si ON coating was introduced on the surface of silicon nitride fiber by perhydropolysilazane conversion method. Si-3N4f/SiO2 and Si-3N4f/Si ONc/SiO2 composites were prepared by sol-ge... In order to modify the interface, Si ON coating was introduced on the surface of silicon nitride fiber by perhydropolysilazane conversion method. Si-3N4f/SiO2 and Si-3N4f/Si ONc/SiO2 composites were prepared by sol-gel method to explore the influence of Si ON coating on the mechanical properties of composites.The results show that with the protection of Si ON coating, Si-3N4fiber enjoys a strength increase of up to 24.1% and Si-3N4f/Si ONc/SiO2 composites have a tensile strength of 170.5 MPa and a modulus of26.9 GPa, respectively. After 1000℃ annealing in air for 1 h, Si-3N4f/Si ONc/SiO2 composites retain 65.0%of their original strength and show a better toughness than Si-3N4f/SiO2 composites. The improvement of mechanical properties is attributing to the healing effect of Si ON coating as well as its intermediate coefficient of thermal expansion between Si-3N4fiber and SiO2 matrix. 展开更多
关键词 si3N4 fiber Perhydropolysilazane siON coating interface Mechanical properties
原文传递
Primary Mg_(2)Si phase and Mg_(2)Si/α-Mg interface modified by Sn and Sb elements in a Mg-5Sn-2Si-1.5Al-1Zn-0.8Sb alloy 被引量:1
5
作者 Wenpeng Yang Ying Wang +2 位作者 Hongbao Cui Guangxin Fan Xuefeng Guo 《Journal of Magnesium and Alloys》 SCIE EI CAS CSCD 2022年第11期3234-3249,共16页
The microstructure of primary Mg_(2)Si and the interface of Mg_(2)Si/α-Mg modified by Sn and Sb elements in an as-cast Mg-5Sn-2Si-1.5Al-1Zn-0.8Sb(wt.%) alloy were investigated.In the primary Mg_(2)Si phase not only t... The microstructure of primary Mg_(2)Si and the interface of Mg_(2)Si/α-Mg modified by Sn and Sb elements in an as-cast Mg-5Sn-2Si-1.5Al-1Zn-0.8Sb(wt.%) alloy were investigated.In the primary Mg_(2)Si phase not only the Si atoms but also the Mg atoms could be substituted by Sn and Sb atoms,resulting in the slightly reduced lattice constant a of 0.627 nm.An OR of Mg_(2)Si phase and α-Mg in the form of[001]Mg_(2)Si‖[01■1]α,(220)Mg_(2)Si‖(0■12)αwas discovered.Between primary Mg_(2)Si phase and α-Mg matrix two transitional nano-particle layers were formed.In the rim region of primary Mg_(2)Si particle,Mg_(2)Sn precipitates sizing from 5 nm to 50 nm were observed.Adjacent to the boundary of primary Mg_(2)Si particle,luxuriant columnar crystals of primary Mg_(2)Sn phase with width of about 25 nm and length of about100 nm were distributed on the α-Mg matrix.The lattice constant of the Mg_(2)Sn precipitate in primary Mg_(2)Si particle was about 0.756 nm.Three ORs between Mg_(2)Sn and Mg_(2)Si were found,in which the Mg_(2)Sn precipitates had strong bonding interfaces with Mg_(2)Si phase.Three new minor ORs between Mg_(2)Sn phase and α-Mg were found.The lattice constant of primary Mg_(2)Sn phase was enlarged to 0.813 nm owing to the solution of Sn and Sb atoms.Primary Mg_(2)Sn had edge-to-edge interfaces with α-Mg.Therefore,the primary Mg_(2)Si particle and α-Mg were united and the interfacial adhesion was improved by the two nano-particles layers of Mg_(2)Sn phase. 展开更多
关键词 Mg_(2)si Mg_(2)Sn MODIFICATION interface HRTEM
在线阅读 下载PDF
Microstructure evolution and interface structure of Al-40 wt% Si composites produced by high-energy ball milling 被引量:3
6
作者 Yuanyuan Chen Zhangping Hu +5 位作者 Yifei Xu Jiangyong Wang Peter Schützendübe Yuan Huang Yongchang Liu Zumin Wang 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 2019年第4期512-519,共8页
High silicon content Al-Si composites with a composition of Al-40 wt% Si were fabricated via a highenergy ball milling method. The microstructure evolution of Al-40 wt% Si milled powders and sintered composites has be... High silicon content Al-Si composites with a composition of Al-40 wt% Si were fabricated via a highenergy ball milling method. The microstructure evolution of Al-40 wt% Si milled powders and sintered composites has been thoroughly studied by scanning electron microscopy, X-ray diffraction, energydispersive spectrometry and high-resolution transmission electron microscopy. The mechanism of ball milling Al-40 wt% Si powders has been disclosed in detail: fracture mechanism dominating in the early stages, followed by the agglomeration mechanism, finally reaching the balance between the fragments and the agglomerates. It has been found that the average particle sizes of mixed Al-Si powders can be refined to the nanoscale, and the crystallite sizes of Al and Si have been reduced to 10nm and 62nm upon milling for 2h–50h, respectively. The finally formed Al-Si interfaces after ball milling for 50h are wellcohesive. A dense and homogenous Al-40 wt% Si composite have been achieved by solid-state sintering at550?C. The results thus provide an effective support for producing bulk nanostructured Al-Si composites. 展开更多
关键词 AL-si COMPOsiTES interface structure HIGH-ENERGY ball MILLING NANOCRYSTALLINE powders
原文传递
Forward and reverse electron transport properties across a CdS/Si multi-interface nanoheterojunction 被引量:2
7
作者 李勇 王伶俐 +4 位作者 王小波 闫玲玲 苏丽霞 田永涛 李新建 《Chinese Physics B》 SCIE EI CAS CSCD 2014年第8期502-507,共6页
The electron transport behavior across the interface plays an important role in determining the performance of op- toelectronic devices based on heterojunctions. Here through growing CdS thin film on silicon nanoporou... The electron transport behavior across the interface plays an important role in determining the performance of op- toelectronic devices based on heterojunctions. Here through growing CdS thin film on silicon nanoporous pillar array, an untraditional, nonplanar, and multi-interface CdS/Si nanoheterojunction is prepared. The current density versus voltage curve is measured and an obvious rectification effect is observed. Based on the fitting results and model analyses on the forward and reverse conduction characteristics, the electron transport mechanism under low forward bias, high forward bias, and reverse bias are attributed to the Ohmic regime, space-charge-limited current regime, and modified Poole-Frenkel regime respectively. The forward and reverse electrical behaviors are found to be highly related to the distribution of inter- facial trap states and the existence of localized electric field respectively. These results might be helpful for optimizing the preparing procedures to realize high-performance silicon-based CdS optoelectronic devices. 展开更多
关键词 HETEROJUNCTION multi-interface nanoheterojunction electron transport silicon nanoporous pillararray si-NPA) CdS/si-NPA
原文传递
Interfacial thermal resistance in amorphous Mo/Si structures:A molecular dynamics study
8
作者 Weiwu Miao Hongyu He +3 位作者 Yi Tao Qiong Wu Chao Wu Chenhan Liu 《Chinese Physics B》 2025年第10期228-234,共7页
Efficient thermal management is critical to the reliability and performance of nanoscale electronic and photonic devices,particularly those incorporating multilayer structures.In this study,non-equilibrium molecular d... Efficient thermal management is critical to the reliability and performance of nanoscale electronic and photonic devices,particularly those incorporating multilayer structures.In this study,non-equilibrium molecular dynamics simulations were conducted to systematically investigate the effects of temperature,penetration depth,and Si layer thickness on the interfacial thermal resistance(ITR)in nanometer-scale Mo/Si multilayers,widely employed in extreme ultraviolet lithography.The results indicate that:(i)temperature variations exert a negligible influence on the ITR of amorphous Mo/Si interfaces,which remains stable across the range of 200-900 K;(ii)increasing penetration depth enhances the overlap of phonon density of states,thereby significantly reducing ITR;(iii)the ITR decreases with increasing Si thickness up to4.2 nm due to quasi-ballistic phonon transport,but rises again as phonon scattering becomes more pronounced at larger thicknesses.This study provides quantitative insights into heat transfer mechanisms at amorphous interfaces and also offers a feasible strategy for tailoring interfacial thermal transport through structural design. 展开更多
关键词 thermal management Mo/si structure interface thermal resistance molecular dynamics simulation
原文传递
First-principles calculations of the hole-induced depassivation of SiO2/Si interface defects
9
作者 Zhuo-Cheng Hong Pei Yao +1 位作者 Yang Liu Xu Zuo 《Chinese Physics B》 SCIE EI CAS CSCD 2022年第5期575-581,共7页
The holes induced by ionizing radiation or carrier injection can depassivate saturated interface defects.The depassivation of these defects suggests that the deep levels associated with the defects are reactivated,aff... The holes induced by ionizing radiation or carrier injection can depassivate saturated interface defects.The depassivation of these defects suggests that the deep levels associated with the defects are reactivated,affecting the performance of devices.This work simulates the depassivation reactions between holes and passivated amorphous-SiO_(2)/Si interface defects(HP_(b)+h→P_(b)+H^(+)).The climbing image nudged elastic band method is used to calculate the reaction curves and the barriers.In addition,the atomic charges of the initial and final structures are analyzed by the Bader charge method.It is shown that more than one hole is trapped by the defects,which is implied by the reduction in the total number of valence electrons on the active atoms.The results indicate that the depassivation of the defects by the holes actually occurs in three steps.In the first step,a hole is captured by the passivated defect,resulting in the stretching of the Si-H bond.In the second step,the defect captures one more hole,which may contribute to the breaking of the Si-H bond.The H atom is released as a proton and the Si atom is three-coordinated and positively charged.In the third step,an electron is captured by the Si atom,and the Si atom becomes neutral.In this step,a Pb-type defect is reactivated. 展开更多
关键词 a-siO_(2)/si interface HOLE depassivation first-principles calculation
原文传递
Passivation and dissociation of P_(b)-type defects at a-SiO_(2)/Si interface
10
作者 Xue-Hua Liu Wei-Feng Xie +1 位作者 Yang Liu Xu Zuo 《Chinese Physics B》 SCIE EI CAS CSCD 2021年第9期49-55,共7页
It is well known that in the process of thermal oxidation of silicon,there are P_(b)-type defects at amorphous silicon dioxide/silicon(a-SiO_(2)/Si)interface due to strain.These defects have a very important impact on... It is well known that in the process of thermal oxidation of silicon,there are P_(b)-type defects at amorphous silicon dioxide/silicon(a-SiO_(2)/Si)interface due to strain.These defects have a very important impact on the performance and reliability of semiconductor devices.In the process of passivation,hydrogen is usually used to inactivate P_(b)-type defects by the reaction P_(b)+H_(2)→P_(b)H+H.At the same time,P_(b)H centers dissociate according to the chemical reaction P_(b)H→P_(b)+H.Therefore,it is of great significance to study the balance of the passivation and dissociation.In this work,the reaction mechanisms of passivation and dissociation of the P_(b)-type defects are investigated by first-principles calculations.The reaction rates of the passivation and dissociation are calculated by the climbing image-nudged elastic band(CI-NEB)method and harmonic transition state theory(HTST).By coupling the rate equations of the passivation and dissociation reactions,the equilibrium density ratio of the saturated interfacial dangling bonds and interfacial defects(P_(b),P_(b)0,and P_(b)1)at different temperatures is calculated. 展开更多
关键词 first-principles calculation a-siO_(2)/si interface P_(b)-type defects equilibrium density
原文传递
Effect of Metallurgical Behaviour at the Interface between Ceramic and Interlayer on the Si_3N_4/1.25Cr-0.5Mo Steel Joint Strength
11
作者 Huaping XIONG (Dept. of Materials Science and Engineering, Jilin University of Technology, Changchun 130025, China) 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 1998年第1期20-24,共5页
By using newly developed CuNi5~25Ti16~28 B rapldly solidifled brazing filler the joining of Si3 N4/1.25Cr-0.5Mo steel has been carried out with interlayer method. If employing the interlayer structure of steel (0.2 mm... By using newly developed CuNi5~25Ti16~28 B rapldly solidifled brazing filler the joining of Si3 N4/1.25Cr-0.5Mo steel has been carried out with interlayer method. If employing the interlayer structure of steel (0.2 mm)/W (2.0 mm)/Ni(0.2 mm), the joint strength can be increased greatly compared with employing that of Ni/W/Ni, and the three point bend strength of the Joint shows the value of 261 MPa. The metallurgical behaviour at the interface between Si3N4 and the interlayer has been studied. It is found that Fe participated in the interfacial reactions between Si3N4 and the brazing filler at the Si3N4/steel (0.2 mm) interface and the compound Fe5Si3 was produced. However, since the reactions of Fe with the active Ti are weaker than those of Ni with Ti, the normal inter facial reactions were still assured at the interface of Si3N4/steel (0.2 mm) instead of Si3N4/Ni (0.2 mm), resulting in the improvement of the joint strength. The mechanism of the formation of Fe5Si3 is also discussed. Finally, some ideas to further ameliorate and simplify the interlayer structure are put forward. 展开更多
关键词 si Effect of Metallurgical Behaviour at the interface between Ceramic and Interlayer on the si3N4/1.25Cr-0.5Mo Steel Joint Strength Ni Cr Mo
在线阅读 下载PDF
Interface reaction of high-strength low-alloy steel with Al-43.4Zn-1.6Si(wt.%)metallic coating
12
作者 Wang-jun Peng Guang-xin Wu +1 位作者 Yi Cheng Jie-yu Zhang 《Journal of Iron and Steel Research International》 SCIE EI CAS CSCD 2019年第12期1304-1314,共11页
The microstructure,elemental distribution,phase composition,and thickness of intermetallic layers between high-strength low-alloy steel(H420)/mild carbon steel(DC51)and Al–43.4Zn–1.6Si(wt.%)(galvalume,GL)alloy were ... The microstructure,elemental distribution,phase composition,and thickness of intermetallic layers between high-strength low-alloy steel(H420)/mild carbon steel(DC51)and Al–43.4Zn–1.6Si(wt.%)(galvalume,GL)alloy were comparatively investigated.The experimental results reveal that the interfacial reaction layer was composed of Fe2Al5,Fe4Al13,and Al8Fe2Si intermetallic compounds.Moreover,the growth curves of the Fe2Al5 and Fe4Al13 intermetallic layers fit the parabolic law well,and the total thickness of the intermetallic layers of H420+GL was almost the same as that of DC51+GL.However,the thickness of the Fe2Al5 layer in H420+GL was thinner than that in DC51+GL.In addition,first-principle calculations were performed to explore the effect of Mn on the growth of the Fe2Al5 intermetallic phase,and the results indicate that Mn substitution in Fe2Al5 removes electronic charge from the Al atoms,thus decreasing the thickness of the Fe2Al5 interface layer. 展开更多
关键词 High-strength low-alloy steel Mild carbon steel Al–43.4Zn–1.6si(wt.%)alloy interface reaction
原文传递
Microstructure of interaction interface between Al-Si,Zn-Al alloys and Al_2O_(3p)/6061Al composite
13
作者 许志武 闫久春 +1 位作者 吕世雄 杨士勤 《中国有色金属学会会刊:英文版》 CSCD 2004年第2期351-355,共5页
Interaction behaviors between Al-Si, Zn-Al alloys and Al2O)3p)/6061Al composite at different heating temperatures were investigated. It is found that Al2O)3p)/6061Al composite can be wetted well by AlSi-1, AlSi-4 and ... Interaction behaviors between Al-Si, Zn-Al alloys and Al2O)3p)/6061Al composite at different heating temperatures were investigated. It is found that Al2O)3p)/6061Al composite can be wetted well by AlSi-1, AlSi-4 and Zn-Al alloys and an interaction layer forms between the alloy and composite during interaction. Little Al-Si alloys remain on the surface when they fully wet the composite and Si element in Al-Si alloy diffuses into composite entirely and assembles in the composite near the interface of Al-Si alloy/composite to form a Si-rich zone. The microstructure in interaction layer with Si penetration is still dense. Much more residual Zn-Al alloy exists on the surface of composite when it wets the composite, and porosities appear at the interface of Zn-Al alloy/composite. The penetration of elements Zn, Cu of Zn-Al alloy into composite leads to the generation of shrinkage cavities in the interaction layer and makes the microstructure of Al2O)3p)/6061Al composite loose. 展开更多
关键词 AL-si合金 ZN-AL合金 Al2O3p/6061Al复合材料 显微结构 湿润性 TLP 压力焊接
在线阅读 下载PDF
InP/Si键合界面热应力分析 被引量:2
14
作者 刘志强 王良臣 +5 位作者 于丽娟 郭金霞 伊晓燕 马龙 王立彬 陈宇 《半导体光电》 CAS CSCD 北大核心 2006年第4期429-433,共5页
从理论上分析了键合热应力产生的原因,在此基础上,采用双层务状金属热应力模型讨论InP/Si键合过程中应力的大小及分布情况。结果表明。由剪切应力和晶片弯矩决定的界面正应力是晶片中心区域大面积键合失败的主要原因,同时InP/Si键... 从理论上分析了键合热应力产生的原因,在此基础上,采用双层务状金属热应力模型讨论InP/Si键合过程中应力的大小及分布情况。结果表明。由剪切应力和晶片弯矩决定的界面正应力是晶片中心区域大面积键合失败的主要原因,同时InP/Si键合合适的退火温度应该在250~300℃。最后在300℃退火条件下很好地实现了InP/Si键合,界面几乎没有气泡。有效键合面积超过90%。 展开更多
关键词 inp/si 键合 热应力 退火温度
在线阅读 下载PDF
Si/InP键合界面的研究 被引量:3
15
作者 陈松岩 何国荣 谢生 《半导体光电》 CAS CSCD 北大核心 2004年第2期139-142,共4页
应用疏水处理方法成功实现了Si/InP的键合,然后通过对InP和Si的表面XPS能谱分析得到界面信息,从而了解键合机理。I-V曲线也反应了键合界面的性质,通过450、550℃退火样品的伏安特性可知道,对于InP/Si键合结构而言,退火温度与界面特性应... 应用疏水处理方法成功实现了Si/InP的键合,然后通过对InP和Si的表面XPS能谱分析得到界面信息,从而了解键合机理。I-V曲线也反应了键合界面的性质,通过450、550℃退火样品的伏安特性可知道,对于InP/Si键合结构而言,退火温度与界面特性应该存在最佳值。 展开更多
关键词 键合 X射线光电子能谱 si/inp界面
在线阅读 下载PDF
InP HBT/Si CMOS 13 GSps 1:16异构集成量化降速芯片 被引量:3
16
作者 吴立枢 程伟 +3 位作者 张有涛 王元 李晓鹏 陈堂胜 《固体电子学研究与进展》 CAS CSCD 北大核心 2018年第1期F0003-F0003,共1页
南京电子器件研究所通过外延层转移的方法在国内首次实现了InPHBT与Si MOSFET两种晶体管的单片异构集成,突破了InP HBT外延层转移、三维高密度异构互联、异构集成电路设计等关键技术,研制出13GSps 1:16异构集成量化降速芯片,如图1... 南京电子器件研究所通过外延层转移的方法在国内首次实现了InPHBT与Si MOSFET两种晶体管的单片异构集成,突破了InP HBT外延层转移、三维高密度异构互联、异构集成电路设计等关键技术,研制出13GSps 1:16异构集成量化降速芯片,如图1所示,共包含453个0.7μm InP HBT器件与1036个0.18μm Si MOSFET器件。 展开更多
关键词 HBT器件 异构集成 inp si CMOS 芯片 降速 量化
原文传递
界面热应力对InP/Si键合质量的影响 被引量:1
17
作者 刘志强 王良臣 +5 位作者 于丽娟 郭金霞 伊晓燕 王立彬 陈宇 马龙 《固体电子学研究与进展》 CAS CSCD 北大核心 2008年第2期172-175,共4页
通过实验和理论计算,分析了InP/Si键合过程中,界面热应力的分布情况、影响键合结果的关键应力因素及退火温度的允许范围。分析结果表明,由剪切应力和晶片弯矩决定的界面正应力是晶片中心区域大面积键合失败的主要原因,为保证良好的键合... 通过实验和理论计算,分析了InP/Si键合过程中,界面热应力的分布情况、影响键合结果的关键应力因素及退火温度的允许范围。分析结果表明,由剪切应力和晶片弯矩决定的界面正应力是晶片中心区域大面积键合失败的主要原因,为保证良好的键合质量,InP/Si键合退火温度应该在300~350℃范围内选取。具体实验验证表明,该理论计算值与实验结果相一致。最后,在300℃退火条件下,很好地实现了2inInP/Si晶片键合,红外图像显示,界面几乎没有空洞和裂隙存在,有效键合面积超过90%。 展开更多
关键词 磷化铟/硅 键合 界面热应力 退火温度
在线阅读 下载PDF
InP/Si键合技术研究进展 被引量:3
18
作者 刘邦武 李超波 +1 位作者 李勇涛 夏洋 《电子工艺技术》 2010年第1期12-15,共4页
InP材料及其器件的研制是近年来研究热点之一,而键合技术又是光电子集成研究领域内一项新的制作工艺。利用键合技术结合离子注入技术可以InP薄膜及器件集成到Si衬底上,改善机械强度,降低成本,具有非常诱人的应用前景。概括地介绍了近年... InP材料及其器件的研制是近年来研究热点之一,而键合技术又是光电子集成研究领域内一项新的制作工艺。利用键合技术结合离子注入技术可以InP薄膜及器件集成到Si衬底上,改善机械强度,降低成本,具有非常诱人的应用前景。概括地介绍了近年来InP在Si上的键合工艺及层转移技术研究进展,并对InP和Si的几种键合工艺进行了分析。降低InP和Si键合温度,进行低温键合是其发展趋势。比较几种键合技术,利用等离子活化辅助键合是降低键合温度的有效途径。 展开更多
关键词 si inp 键合 层转移
在线阅读 下载PDF
Si/InP材料的应力转化特性分析
19
作者 王瑞荣 《电子测试》 2013年第11期35-39,共5页
InP材料被广泛的应用于光电子领域,但其材料脆、工艺不成熟、成本高,而Si基外延InP材料能良好的改善该技术瓶颈。论文中对不同介质、不同厚度的介质键合制备Si/InP材料进行了分析。其中以SiO2键合制备的Si/InP材料应力转化率最高,且SiO... InP材料被广泛的应用于光电子领域,但其材料脆、工艺不成熟、成本高,而Si基外延InP材料能良好的改善该技术瓶颈。论文中对不同介质、不同厚度的介质键合制备Si/InP材料进行了分析。其中以SiO2键合制备的Si/InP材料应力转化率最高,且SiO2制备工艺简单、亲水,材料键合强度大,机械特性好,是键合制备Si/InP材料的首选。而且,SiO2键合介质越薄,其应力转化率越高,材料对力学信号就越敏感,制备的Si/InP材料的机械性能越好。 展开更多
关键词 si基外延inp 应力转化 键合 MEMS 光电子
在线阅读 下载PDF
半绝缘衬底上Si掺杂InP的纳米孔腐蚀与电学性质研究
20
作者 沈秋石 李林 +4 位作者 苑汇帛 乔忠良 张晶 曲轶 刘国军 《长春理工大学学报(自然科学版)》 2017年第2期17-20,23,共5页
利用MOCVD在InP半绝缘衬底上生长N型InP,在KOH溶液中电化学腐蚀形成纳米多孔结构的。通过实验证实在半绝缘衬底上的InP纳米孔腐蚀具有可行性,并且得到了腐蚀质量较好、图形清晰、结构规整的纳米孔材料。在对其进行霍尔测试,得到了腐蚀... 利用MOCVD在InP半绝缘衬底上生长N型InP,在KOH溶液中电化学腐蚀形成纳米多孔结构的。通过实验证实在半绝缘衬底上的InP纳米孔腐蚀具有可行性,并且得到了腐蚀质量较好、图形清晰、结构规整的纳米孔材料。在对其进行霍尔测试,得到了腐蚀孔对于n型InP材料表面电学性质的改变,实现了低掺杂浓度(10^(18)cm^(-3))的InP通过表面纳米孔腐蚀的方式提高载流子浓度,改善n型InP层表面电学性能。 展开更多
关键词 inp 纳米孔 si掺杂 MOCVD 电化学腐蚀
在线阅读 下载PDF
上一页 1 2 14 下一页 到第
使用帮助 返回顶部