By means of analyzing theⅠ-Ⅴcharacteristic curve of NiSi/n-Si Schottkyjunction diodes（NiSi/n-Si SJDs）, abstracting the effective Schottky barrier height（φ_（B,eff）） and the idealfactor ofNiSi/n-Si SJDs and mea...By means of analyzing theⅠ-Ⅴcharacteristic curve of NiSi/n-Si Schottkyjunction diodes（NiSi/n-Si SJDs）, abstracting the effective Schottky barrier height（φ_（B,eff）） and the idealfactor ofNiSi/n-Si SJDs and measuring the sheet resistance of NiSi films（R_（NiSi））,we study the effects of different dopant segregation process parameters,including impurity implantation dose,segregation annealing temperature and segregation annealing time,on theφ_（B,eff） of NiSi/ n-Si SJDs and the resistance characteristic of NiSi films.In addition,the changing rules ofφ_（B,eff） and R_（NiSi） are discussed.展开更多
The post-silicide of dopant segregation process for adjusting NiSi/n-Si SBH（Schottky barrier height）is described.Adopting the analysis of the I–V characteristic curve and extrapolating the SBH of NiSi/n-Si Schottky...The post-silicide of dopant segregation process for adjusting NiSi/n-Si SBH（Schottky barrier height）is described.Adopting the analysis of the I–V characteristic curve and extrapolating the SBH of NiSi/n-Si Schottky junction diodes（NiSi/n-Si SJDs）,the effects of different of process parameters dopant segregation,including segregation anneal temperature and dopant implant dose,on the properties of the NiSi/n-Si SJDs have been studied,and the corresponding mechanisms are discussed.展开更多
文摘By means of analyzing theⅠ-Ⅴcharacteristic curve of NiSi/n-Si Schottkyjunction diodes（NiSi/n-Si SJDs）, abstracting the effective Schottky barrier height（φ_（B,eff）） and the idealfactor ofNiSi/n-Si SJDs and measuring the sheet resistance of NiSi films（R_（NiSi））,we study the effects of different dopant segregation process parameters,including impurity implantation dose,segregation annealing temperature and segregation annealing time,on theφ_（B,eff） of NiSi/ n-Si SJDs and the resistance characteristic of NiSi films.In addition,the changing rules ofφ_（B,eff） and R_（NiSi） are discussed.
文摘The post-silicide of dopant segregation process for adjusting NiSi/n-Si SBH（Schottky barrier height）is described.Adopting the analysis of the I–V characteristic curve and extrapolating the SBH of NiSi/n-Si Schottky junction diodes（NiSi/n-Si SJDs）,the effects of different of process parameters dopant segregation,including segregation anneal temperature and dopant implant dose,on the properties of the NiSi/n-Si SJDs have been studied,and the corresponding mechanisms are discussed.
