Power Supply on Chip（以下简称Pwrsoc）是将厄源磁性器件，如电感、变压器等和功率IC芯片集成为一块体积小、重量轻的功率供应系统的技术目前陔技术仍处于试验阶段PwrSoC不同于以前的系统集成技术，其磁性器件采用徽电子工艺进行集成...Power Supply on Chip（以下简称Pwrsoc）是将厄源磁性器件，如电感、变压器等和功率IC芯片集成为一块体积小、重量轻的功率供应系统的技术目前陔技术仍处于试验阶段PwrSoC不同于以前的系统集成技术，其磁性器件采用徽电子工艺进行集成，取代了之前采用分离无器件进行外部连接或者系统集成的技术本文主要介绍PwrSoC的发展简史、遇到的问题及未来趋势，并着重介绍了其对磁性材料与器件的要求。展开更多
We report a fabrication technology for 3D air-core inductors for small footprint and very-high-frequency power conversions.Our process is scalable and highly generic for fabricating inductors with a wide range of geom...We report a fabrication technology for 3D air-core inductors for small footprint and very-high-frequency power conversions.Our process is scalable and highly generic for fabricating inductors with a wide range of geometries and core shapes.We demonstrate spiral,solenoid,and toroidal inductors,a toroidal transformer and inductor with advanced geometries that cannot be produced by wire winding technology.The inductors are embedded in a silicon substrate and consist of through-silicon vias and suspended windings.The inductors fabricated with 20 and 25 turns and 280-350μm heights on 4-16 mm2 footprints have an inductance from 34.2 to 44.6 nH and a quality factor from 10 to 13 at frequencies ranging from 30 to 72 MHz.The air-core inductors show threefold lower parasitic capacitance and up to a 140% higher-quality factor and a 230% higher-operation frequency than silicon-core inductors.A 33 MHz boost converter mounted with an air-core toroidal inductor achieves an efficiency of 68.2%,which is better than converters mounted with a Si-core inductor(64.1%).Our inductors show good thermal cycling stability,and they are mechanically stable after vibration and 2-m-drop tests.展开更多
文摘Power Supply on Chip（以下简称Pwrsoc）是将厄源磁性器件，如电感、变压器等和功率IC芯片集成为一块体积小、重量轻的功率供应系统的技术目前陔技术仍处于试验阶段PwrSoC不同于以前的系统集成技术，其磁性器件采用徽电子工艺进行集成，取代了之前采用分离无器件进行外部连接或者系统集成的技术本文主要介绍PwrSoC的发展简史、遇到的问题及未来趋势，并着重介绍了其对磁性材料与器件的要求。
基金This project is a part of the TinyPower project,which is funded by the Innovation Foundation(No.67-2014-1).
文摘We report a fabrication technology for 3D air-core inductors for small footprint and very-high-frequency power conversions.Our process is scalable and highly generic for fabricating inductors with a wide range of geometries and core shapes.We demonstrate spiral,solenoid,and toroidal inductors,a toroidal transformer and inductor with advanced geometries that cannot be produced by wire winding technology.The inductors are embedded in a silicon substrate and consist of through-silicon vias and suspended windings.The inductors fabricated with 20 and 25 turns and 280-350μm heights on 4-16 mm2 footprints have an inductance from 34.2 to 44.6 nH and a quality factor from 10 to 13 at frequencies ranging from 30 to 72 MHz.The air-core inductors show threefold lower parasitic capacitance and up to a 140% higher-quality factor and a 230% higher-operation frequency than silicon-core inductors.A 33 MHz boost converter mounted with an air-core toroidal inductor achieves an efficiency of 68.2%,which is better than converters mounted with a Si-core inductor(64.1%).Our inductors show good thermal cycling stability,and they are mechanically stable after vibration and 2-m-drop tests.
