The thermal conduction behavior of the three-dimensional axisymmetric functionally graded circular plate was studied under thermal loads on its top and bottom surfaces. Material properties were taken to be arbitrary d...The thermal conduction behavior of the three-dimensional axisymmetric functionally graded circular plate was studied under thermal loads on its top and bottom surfaces. Material properties were taken to be arbitrary distribution functions of the thickness. A temperature function that satisfies thermal boundary conditions at the edges and the variable separation method were used to reduce equation governing the steady state heat conduction to an ordinary differential equation （ODE） in the thickness coordinate which was solved analytically. Next, resulting variable coefficients ODE due to arbitrary distribution of material properties along thickness coordinate was also solved by the Peano-Baker series. Some numerical examples were given to demonstrate the accuracy, efficiency of the present model, mad to investigate the influence of different distributions of material properties on the temperature field. The numerical results confirm that the influence of different material distributions, gradient indices and thickness of plate to temperature field in plate can not be ignored.展开更多
Three-dimensional thermoelastic analysis is presented for an orthotropic functionally graded rectangular plate, which is simply supported and isothermal on its four lateral edges. With the assumption that material pro...Three-dimensional thermoelastic analysis is presented for an orthotropic functionally graded rectangular plate, which is simply supported and isothermal on its four lateral edges. With the assumption that material properties have arbitrary dependence on the thickness-coordinate a Peano-Baker series solution is obtained for the thermoelastic fields of the functionally graded plate subjected to mechanical[ and thermal loads on its upper and lower surfaces by means of state space method. The correctness of the obtained series solution is validated through numerical examples. The influence of different material properties distributions on the structural response of the plate is also studied.展开更多
An orthotropic functionally graded piezoelectric rectangular plate with arbitrarily distributed material properties was studied, which is simply supported and grounded（electrically） on its four lateral edges. The st...An orthotropic functionally graded piezoelectric rectangular plate with arbitrarily distributed material properties was studied, which is simply supported and grounded（electrically） on its four lateral edges. The state equations of the functionally graded piezoelectric material were obtained using the state-space approach, and a Peano-Baker series solution was obtained for the coupled electroelastic fi elds of the functionally graded piezoelectric plate subjected to mechanical and electric loading on its upper and lower surfaces. The influence of different distributions of material properties on the structural response of the plate was studied using the obtained solutions.展开更多
基金Project(11102136)supported by the National Natural Science Foundation of ChinaProject(2012ZDK04)supported by the Open Project of Guangxi Key Laboratory of Disaster Prevention and Structural Safety,China
文摘The thermal conduction behavior of the three-dimensional axisymmetric functionally graded circular plate was studied under thermal loads on its top and bottom surfaces. Material properties were taken to be arbitrary distribution functions of the thickness. A temperature function that satisfies thermal boundary conditions at the edges and the variable separation method were used to reduce equation governing the steady state heat conduction to an ordinary differential equation （ODE） in the thickness coordinate which was solved analytically. Next, resulting variable coefficients ODE due to arbitrary distribution of material properties along thickness coordinate was also solved by the Peano-Baker series. Some numerical examples were given to demonstrate the accuracy, efficiency of the present model, mad to investigate the influence of different distributions of material properties on the temperature field. The numerical results confirm that the influence of different material distributions, gradient indices and thickness of plate to temperature field in plate can not be ignored.
基金Project supported by the Program for Young Excellent Talents in Tongji University (No. 2009KJ047)the National Natural Science Foundation of China (Nos. 10872150 and 11090334)
文摘Three-dimensional thermoelastic analysis is presented for an orthotropic functionally graded rectangular plate, which is simply supported and isothermal on its four lateral edges. With the assumption that material properties have arbitrary dependence on the thickness-coordinate a Peano-Baker series solution is obtained for the thermoelastic fields of the functionally graded plate subjected to mechanical[ and thermal loads on its upper and lower surfaces by means of state space method. The correctness of the obtained series solution is validated through numerical examples. The influence of different material properties distributions on the structural response of the plate is also studied.
基金Funded by the National Natural Science Foundation of China(Nos.11102136 and 41362016)the Open Project of Guangxi Key Laboratory of Disaster Prevention and Structural Safety(No.2013ZDK09)
文摘An orthotropic functionally graded piezoelectric rectangular plate with arbitrarily distributed material properties was studied, which is simply supported and grounded（electrically） on its four lateral edges. The state equations of the functionally graded piezoelectric material were obtained using the state-space approach, and a Peano-Baker series solution was obtained for the coupled electroelastic fi elds of the functionally graded piezoelectric plate subjected to mechanical and electric loading on its upper and lower surfaces. The influence of different distributions of material properties on the structural response of the plate was studied using the obtained solutions.
