The machinability tests were conducted by using various process parameters on a CA6164 lathe with a dynamometer. The metallurgical properties, machinability and mechanical properties of the developed alloy were compar...The machinability tests were conducted by using various process parameters on a CA6164 lathe with a dynamometer. The metallurgical properties, machinability and mechanical properties of the developed alloy were compared with those of an austenite stainless steel 1Cr18Ni9Ti. The results show that the machinability of the austenitic stainless steels with free cutting additives is much better than that of 1Cr18Ni9Ti. This is attributed to the existence of machinable additives. The inclusions might be composed of MnS. Sulfur and copper addition contributes to the improvement of the machinability of austenitic stainless steel. Bismuth is an important factor to improve the machinability of austenitic stainless steel, and it has a distinct advantage over lead. The mechanical properties of the free cutting austenitic stainless steel are similar to those of 1Cr18Ni9Ti. A new Pb-free austenitic stainless steel with high machinability as well as satisfactory mechanical properties has been developed.展开更多
Computational thermodynamics and kinetics were used to design the Pb-free micro-solders for replacing the conventional Sn-Pb solders because of the health and environmental safety problem. On the basis of CALPHAD (Cal...Computational thermodynamics and kinetics were used to design the Pb-free micro-solders for replacing the conventional Sn-Pb solders because of the health and environmental safety problem. On the basis of CALPHAD (Calculation of Phase Diagrams) method we can easily calculate properties such as the liquidus projection, isothermal and vertical sectional diagrams and phase fraction in multi-component system including Ag, Bi, Cu, In, Sb, Sn, Zn and Pb elements. In addition, other related information such as the surface tension, viscosity of the liquid phase and solidification simulation can also be obtained. DICTRA (Diffusion Controlled Transformation) software was used to simulate the interfacial reactions between substrate and Pb-free solders, which can easily give the information on the growth of intermetallic compounds and moving speed of interface between substrate and solders etc.展开更多
The Indium Corporation of America has introduced 1075-EXR 46 wave solder flux specifically designed to meet the process demands of Pb-Free manufacturing. 1075-EXR 46 is a VOC-Free material formulated for Pb-Free wave ...The Indium Corporation of America has introduced 1075-EXR 46 wave solder flux specifically designed to meet the process demands of Pb-Free manufacturing. 1075-EXR 46 is a VOC-Free material formulated for Pb-Free wave soldering of surface-mount, mixed-technology and through-hole electronics assemblies.展开更多
The effects of Bi addition on the growth of intermetallic compound (IMC) formation in Sn-3.8Ag-0.7Cu solder joints were investigated. The test samples were prepared by conventional surface mounting technology. To inve...The effects of Bi addition on the growth of intermetallic compound (IMC) formation in Sn-3.8Ag-0.7Cu solder joints were investigated. The test samples were prepared by conventional surface mounting technology. To investigate the element diffusion and the growth kinetics of intermetallics formation in solder joint, isothermal aging test was performed at temperatures of 100, 150, and 190℃, respectively. The optical microscope (OM) and scanning electron microscope (SEM) were used to observe microstructure evolution of solder joint and to estimate the thickness and the grain size of the intermetallic layers. The IMC phases were identified by energy dispersive X-ray (EDX) and X-ray diffractometer (XRD). The results clearly show that adding about 1.0% Bi in Sn-Ag-Cu solder alloy system can refine the grain size of the IMC and inhibit the excessive IMC growth in solder joints, and therefore improve the reliability of the Pb-free solder joints. Through observation of the microstructural evolution of the solder joints, the mechanism of inhibition of IMC growth due to Bi addition was proposed.展开更多
Although the power conversion efficiency（PCE） of CH3 NH3 PbI3-based solar cells has achieved 22.1%,which is comparable to commercialized thin-film CdTe and Cu（In,Ga）Se2 solar cells, the long-term stability is the ...Although the power conversion efficiency（PCE） of CH3 NH3 PbI3-based solar cells has achieved 22.1%,which is comparable to commercialized thin-film CdTe and Cu（In,Ga）Se2 solar cells, the long-term stability is the main obstacle for the commercialization of perovskite solar cells. Recent efforts have been made to explore alternative inorganic perovskites, which were assumed to have better stability than organic-inorganic hybrid CH3 NH3 PbI3. In this short review, we will keep up with experiments and summarize recent progresses of inorganic double halide perovskite, in particular to Cs2 AgBiBr6, Cs2 AgInCl6, Cs2 InBiBr6 and their family members. We will also share our opinions on the promise of such class of materials.展开更多
A materials design tool for developing Pb-free soldering alloys in electronic package was developed based on comprehensive experimental data of phase equilibria and thermodynamic properties data accumulated with the C...A materials design tool for developing Pb-free soldering alloys in electronic package was developed based on comprehensive experimental data of phase equilibria and thermodynamic properties data accumulated with the CALPHAD (calculation of phase diagrams) method and contains 10 elements,namely,Ag,Au,Bi,Cu,In,Ni,Sb,Sn,Zn and Pb.It can handle the calculation of phase diagrams in all combinations of these elements and all composition ranges.In addition,based on this tool,the liquidus,solidus,phase fractions and constitutions,equilibrium and non-equilibrium solidification behavior,surface tension and viscosity of liquid,diffusion reactions and microstructural evolution,etc.can be predicted.Typical examples of the calculation and application of this tool are presented.The design tool is expected to be a powerful tool for the development of Pb-free solders,as well as for promoting the understanding of the interfacial phenomena between Cu substrate and Pb-free solders in electronic packaging technology.展开更多
Technological advancements and the emphasis on reducing the use of hazardous materials,such as Pb,have led to the widely use of Sn-based Pb-free solder in advanced packaging technology.With the miniaturization of sold...Technological advancements and the emphasis on reducing the use of hazardous materials,such as Pb,have led to the widely use of Sn-based Pb-free solder in advanced packaging technology.With the miniaturization of solder joints,Sn-based micro solder joints often contain single or limitedβ-Sn grains.The strong anisotropy ofβ-Sn,which is significantly correlated with the reliability of the micro solder joints during service,requires the development of methods for controlling the orientations of theseβ-Sn grains.In this review,we focus on the anisotropy of theβ-Sn grains in micro solder joints and the interactions betweenβ-Sn grain orientation and reliability issues concerning electromigration(EM),thermomigration(TM),EM+TM,corrosion process,tensile and shear creep behavior,thermal cycling(TC)and cryogenic temperature.Furthermore,we summarize the strategies for controlling theβ-Sn orientation in micro solder joints.The methods include changing the solder joint size and composition,adding additives,nucleating on specific substrates and interfacial intermetallic compounds,with the aid of external loads during solidification process and introducing heredity effect of theβ-Sn texture during multi-reflow.Finally,the{101}and{301}twinning models with∼60°rotations about a common〈100〉are adopted to explain the mechanism ofβ-Sn grain nucleation and morphology.The shortcomings of the existing methods and the further potential for the development in the field are discussed to promote the application of Pb-free solders in advanced packaging.展开更多
基金Item Sponsored by National Natural Science Foundation of China (50334010)
文摘The machinability tests were conducted by using various process parameters on a CA6164 lathe with a dynamometer. The metallurgical properties, machinability and mechanical properties of the developed alloy were compared with those of an austenite stainless steel 1Cr18Ni9Ti. The results show that the machinability of the austenitic stainless steels with free cutting additives is much better than that of 1Cr18Ni9Ti. This is attributed to the existence of machinable additives. The inclusions might be composed of MnS. Sulfur and copper addition contributes to the improvement of the machinability of austenitic stainless steel. Bismuth is an important factor to improve the machinability of austenitic stainless steel, and it has a distinct advantage over lead. The mechanical properties of the free cutting austenitic stainless steel are similar to those of 1Cr18Ni9Ti. A new Pb-free austenitic stainless steel with high machinability as well as satisfactory mechanical properties has been developed.
文摘Computational thermodynamics and kinetics were used to design the Pb-free micro-solders for replacing the conventional Sn-Pb solders because of the health and environmental safety problem. On the basis of CALPHAD (Calculation of Phase Diagrams) method we can easily calculate properties such as the liquidus projection, isothermal and vertical sectional diagrams and phase fraction in multi-component system including Ag, Bi, Cu, In, Sb, Sn, Zn and Pb elements. In addition, other related information such as the surface tension, viscosity of the liquid phase and solidification simulation can also be obtained. DICTRA (Diffusion Controlled Transformation) software was used to simulate the interfacial reactions between substrate and Pb-free solders, which can easily give the information on the growth of intermetallic compounds and moving speed of interface between substrate and solders etc.
文摘The Indium Corporation of America has introduced 1075-EXR 46 wave solder flux specifically designed to meet the process demands of Pb-Free manufacturing. 1075-EXR 46 is a VOC-Free material formulated for Pb-Free wave soldering of surface-mount, mixed-technology and through-hole electronics assemblies.
文摘The effects of Bi addition on the growth of intermetallic compound (IMC) formation in Sn-3.8Ag-0.7Cu solder joints were investigated. The test samples were prepared by conventional surface mounting technology. To investigate the element diffusion and the growth kinetics of intermetallics formation in solder joint, isothermal aging test was performed at temperatures of 100, 150, and 190℃, respectively. The optical microscope (OM) and scanning electron microscope (SEM) were used to observe microstructure evolution of solder joint and to estimate the thickness and the grain size of the intermetallic layers. The IMC phases were identified by energy dispersive X-ray (EDX) and X-ray diffractometer (XRD). The results clearly show that adding about 1.0% Bi in Sn-Ag-Cu solder alloy system can refine the grain size of the IMC and inhibit the excessive IMC growth in solder joints, and therefore improve the reliability of the Pb-free solder joints. Through observation of the microstructural evolution of the solder joints, the mechanism of inhibition of IMC growth due to Bi addition was proposed.
文摘Although the power conversion efficiency（PCE） of CH3 NH3 PbI3-based solar cells has achieved 22.1%,which is comparable to commercialized thin-film CdTe and Cu（In,Ga）Se2 solar cells, the long-term stability is the main obstacle for the commercialization of perovskite solar cells. Recent efforts have been made to explore alternative inorganic perovskites, which were assumed to have better stability than organic-inorganic hybrid CH3 NH3 PbI3. In this short review, we will keep up with experiments and summarize recent progresses of inorganic double halide perovskite, in particular to Cs2 AgBiBr6, Cs2 AgInCl6, Cs2 InBiBr6 and their family members. We will also share our opinions on the promise of such class of materials.
基金supported by the National Natural Science Foundation of China (Grant No.50425101)the Ministry of Science and Technology,P.R.China (Grant No.2009DFA52170)+1 种基金the National High-Tech Research and Development Program of China ("863" Project) (Grant No.2009AA03Z101)the Ministry of Education,P.R.China (Grant No.707037)
文摘A materials design tool for developing Pb-free soldering alloys in electronic package was developed based on comprehensive experimental data of phase equilibria and thermodynamic properties data accumulated with the CALPHAD (calculation of phase diagrams) method and contains 10 elements,namely,Ag,Au,Bi,Cu,In,Ni,Sb,Sn,Zn and Pb.It can handle the calculation of phase diagrams in all combinations of these elements and all composition ranges.In addition,based on this tool,the liquidus,solidus,phase fractions and constitutions,equilibrium and non-equilibrium solidification behavior,surface tension and viscosity of liquid,diffusion reactions and microstructural evolution,etc.can be predicted.Typical examples of the calculation and application of this tool are presented.The design tool is expected to be a powerful tool for the development of Pb-free solders,as well as for promoting the understanding of the interfacial phenomena between Cu substrate and Pb-free solders in electronic packaging technology.
基金financially supported by the National Natural Science Foundation of China(No.52075072)the Provincial Applied Basic Research Program of Liaoning Provincial Department of Science and Technology(No.2023JH2/101300181)the Key R&D Program of Shandong Province,China(No.2022CXGC020408)。
文摘Technological advancements and the emphasis on reducing the use of hazardous materials,such as Pb,have led to the widely use of Sn-based Pb-free solder in advanced packaging technology.With the miniaturization of solder joints,Sn-based micro solder joints often contain single or limitedβ-Sn grains.The strong anisotropy ofβ-Sn,which is significantly correlated with the reliability of the micro solder joints during service,requires the development of methods for controlling the orientations of theseβ-Sn grains.In this review,we focus on the anisotropy of theβ-Sn grains in micro solder joints and the interactions betweenβ-Sn grain orientation and reliability issues concerning electromigration(EM),thermomigration(TM),EM+TM,corrosion process,tensile and shear creep behavior,thermal cycling(TC)and cryogenic temperature.Furthermore,we summarize the strategies for controlling theβ-Sn orientation in micro solder joints.The methods include changing the solder joint size and composition,adding additives,nucleating on specific substrates and interfacial intermetallic compounds,with the aid of external loads during solidification process and introducing heredity effect of theβ-Sn texture during multi-reflow.Finally,the{101}and{301}twinning models with∼60°rotations about a common〈100〉are adopted to explain the mechanism ofβ-Sn grain nucleation and morphology.The shortcomings of the existing methods and the further potential for the development in the field are discussed to promote the application of Pb-free solders in advanced packaging.
文摘阐述了无铅钎料合金设计的原则,讨论了合金相图及其计算在无铅锡基钎料合金设计中的作用。利用相图计算技术筛选了可能代替Pb Sn共晶钎料合金的Sn Zn In三元(x(Zn)<0.11,x(In)=0.10～0.14)和Sn Zn In Ag四元(x(Sn)=0.800,x(In)=0.090,x(Zn)=0.075,x(Ag)<0.049)无铅锡基钎料合金。初步讨论了用相图计算技术在富Sn四元Sn Zn In Ag无铅钎料合金基础上,添加Bi,Sb等低熔点金属和微量Ce,La等稀土元素以降低贵金属In和Ag的含量,进一步提高无铅锡基多元合金钎料的综合性能和性能价格比。
