Effect of flip chip bonding parameters on microstructure at the interconnect interface and shear properties of 64.8Sn35.2Pb microbumps were investigated in this work.Results show that the main intermetallic compound(I...Effect of flip chip bonding parameters on microstructure at the interconnect interface and shear properties of 64.8Sn35.2Pb microbumps were investigated in this work.Results show that the main intermetallic compound(IMC)at the interconnect interface is(Ni,Cu)_(3)Sn_(4)phase,and meanwhile a small amount of(Cu,Ni)_(6)Sn_(5)phase with a size of 50−100 nm is formed around(Ni,Cu)_(3)Sn_(4)phase.The orientation relationship of[-1-56](Ni,Cu)_(3)Sn_(4)//[152](Cu,Ni)_(6)Sn_(5)and(601)(Ni,Cu)_(3)Sn_(4)//(-201)(Cu,Ni)_(6)Sn_(5)is found between these two phases,and the atomic matching at the interface of the two phases is low.The highest shear force of 77.3 gf is achieved in the 64.8Sn35.2Pb microbump at the peak temperature of 250℃and parameter V1 because dense IMCs and no cracks form at the interconnect interface.Two typical fracture modes of microbumps are determined as solder fracture and mixed fracture.The high thermal stress presenting in the thick IMCs layer induces crack initiation,and cracks propagate along theα/βphase boundaries in the Sn-Pb solder under shear force,leading to a mixed fracture mode in the microbumps.展开更多
通过机械合金化制备了 Al-15%Pb-4%Si-1%Sn-1.5%Cu(质量分数)纳米晶粉末。采用 X 射线衍射(XRD),扫描电镜(SEM)和透射电镜(TEM)对不同球磨时间的混合粉末的组织结构、晶粒大小、微观形貌以及颗粒中化学成分分布情况进行了研究。结果表...通过机械合金化制备了 Al-15%Pb-4%Si-1%Sn-1.5%Cu(质量分数)纳米晶粉末。采用 X 射线衍射(XRD),扫描电镜(SEM)和透射电镜(TEM)对不同球磨时间的混合粉末的组织结构、晶粒大小、微观形貌以及颗粒中化学成分分布情况进行了研究。结果表明混合粉末经过球磨后形成了纳米晶,其组织非常均匀。球磨对 Pb 的作用效果明显大于对 Al 的作用效果,经过 40 h 球磨后 Pb 粒子达到 40 nm,而 Al 在球磨 60 h 后晶粒为 65 nm;经球磨后,Cu 和 Si 固溶于 Al 的晶格中,而 Sn 则固溶于 Pb 晶格中,并且 Al 和 Pb 发生了互溶,形成了 Pb(Al)超饱和固溶体;在球磨过程中硬度高的脆性粒子 Si 难于完全实现合金化。展开更多
基金Project(U2341254)supported by Ye Qisun Science Foundation of National Natural Science Foundation of ChinaProject(52475406)supported by the National Nature Science Foundation of ChinaProject(2024CY2-GJHX-32)supported by the Key R&D Program of Shaanxi Province,China。
文摘Effect of flip chip bonding parameters on microstructure at the interconnect interface and shear properties of 64.8Sn35.2Pb microbumps were investigated in this work.Results show that the main intermetallic compound(IMC)at the interconnect interface is(Ni,Cu)_(3)Sn_(4)phase,and meanwhile a small amount of(Cu,Ni)_(6)Sn_(5)phase with a size of 50−100 nm is formed around(Ni,Cu)_(3)Sn_(4)phase.The orientation relationship of[-1-56](Ni,Cu)_(3)Sn_(4)//[152](Cu,Ni)_(6)Sn_(5)and(601)(Ni,Cu)_(3)Sn_(4)//(-201)(Cu,Ni)_(6)Sn_(5)is found between these two phases,and the atomic matching at the interface of the two phases is low.The highest shear force of 77.3 gf is achieved in the 64.8Sn35.2Pb microbump at the peak temperature of 250℃and parameter V1 because dense IMCs and no cracks form at the interconnect interface.Two typical fracture modes of microbumps are determined as solder fracture and mixed fracture.The high thermal stress presenting in the thick IMCs layer induces crack initiation,and cracks propagate along theα/βphase boundaries in the Sn-Pb solder under shear force,leading to a mixed fracture mode in the microbumps.
文摘通过机械合金化制备了 Al-15%Pb-4%Si-1%Sn-1.5%Cu(质量分数)纳米晶粉末。采用 X 射线衍射(XRD),扫描电镜(SEM)和透射电镜(TEM)对不同球磨时间的混合粉末的组织结构、晶粒大小、微观形貌以及颗粒中化学成分分布情况进行了研究。结果表明混合粉末经过球磨后形成了纳米晶,其组织非常均匀。球磨对 Pb 的作用效果明显大于对 Al 的作用效果,经过 40 h 球磨后 Pb 粒子达到 40 nm,而 Al 在球磨 60 h 后晶粒为 65 nm;经球磨后,Cu 和 Si 固溶于 Al 的晶格中,而 Sn 则固溶于 Pb 晶格中,并且 Al 和 Pb 发生了互溶,形成了 Pb(Al)超饱和固溶体;在球磨过程中硬度高的脆性粒子 Si 难于完全实现合金化。
