当前美国国家标准与技术研究院(National Institute of Standards and Technology,NIST)对后量子密码(Post-Quantum Cryptography,PQC)标准化方案的评估已进入第四轮,位翻转密钥封装(Bit Flipping Key Encapsulation,BIKE)协议是目前被...当前美国国家标准与技术研究院(National Institute of Standards and Technology,NIST)对后量子密码(Post-Quantum Cryptography,PQC)标准化方案的评估已进入第四轮,位翻转密钥封装(Bit Flipping Key Encapsulation,BIKE)协议是目前被评估的四个候选方案之一.在BIKE的密钥生成算法中,多项式乘法作为众多密码系统中特别耗时的操作之一,耗费了大量的时间和面积资源.针对此问题,本文设计了一种基于Karatsuba算法(Karatsuba Algorithm,KA)的无交叠多项式乘法器,可高效实现万级比特位宽的多项式乘法,具有低时延、高性能和面积小的特点.同时,本文将该优化乘法器应用于BIKE密钥生成算法中,并基于现场可编程门阵列(Field Programmable Gate Array,FPGA)对其进行硬件架构实现,改进了原有的紧凑多项式乘法和多项式求逆算法.本文提出的乘法器通过采用不同的操作数位宽,可适应对面积和延时的不同需求.与BIKE原本的设计相比,改进的设计使密钥生成模块的延时减小了36.54%,面积延迟积(Area Delay Production,ADP)减小了10.4%.展开更多
In this paper,the mechanical response of a one-dimensional(1D)hexagonal piezoelectric quasicrystal(PQC)thin film is analyzed under electric and temperature loads.Based on the Euler-Bernoulli beam theory,a theoretical ...In this paper,the mechanical response of a one-dimensional(1D)hexagonal piezoelectric quasicrystal(PQC)thin film is analyzed under electric and temperature loads.Based on the Euler-Bernoulli beam theory,a theoretical model is proposed,resulting in coupled governing integral equations that account for interfacial normal and shear stresses.To numerically solve these integral equations,an expansion method using orthogonal Chebyshev polynomials is employed.The results provide insights into the interfacial stresses,axial force,as well as axial and vertical deformations of the PQC film.Additionally,fracture criteria,including stress intensity factors,mode angles,and the J-integral,are evaluated.The solution is compared with the membrane theory,neglecting the normal stress and bending deformation.Finally,the effects of stiffness and aspect ratio on the PQC film are thoroughly discussed.This study serves as a valuable guide for controlling the mechanical response and conducting safety assessments of PQC film systems.展开更多
In this paper,we investigate the interfacial behavior of a thin,penny-shaped,one-dimensional(1D)hexagonal functionally graded(FG)piezoelectric quasicrystal(PQC)film bonded on a temperature-dependent elastic substrate ...In this paper,we investigate the interfacial behavior of a thin,penny-shaped,one-dimensional(1D)hexagonal functionally graded(FG)piezoelectric quasicrystal(PQC)film bonded on a temperature-dependent elastic substrate under thermal and electrical loads.The problem is modeled as axisymmetric based on the membrane theory,with the peeling stress and bending moment being disregarded.A potential theory method,combined with the Hankel transform technique,is utilized to derive the displacement field on the substrate surface.With perfect interfacial bonding assumption,an integral equation governing the phonon interfacial shear stress is formulated and numerically solved by the Chebyshev polynomials.Explicit expressions are derived for the interfacial shear stress,the internal stresses within the PQC film and the substrate,the axial strain,and the stress intensity factors(SIFs).Numerical simulations are conducted to investigate the effects of the film's aspect ratio,material inhomogeneity,material mismatch,and temperature-dependent material properties on its mechanical response.The results provide insights for the functional design and reliability assessment of FG PQC film/substrate systems.展开更多
基金Supported by the National Natural Science Foundation of China (Nos. 11902293 and 12272353)。
文摘In this paper,the mechanical response of a one-dimensional(1D)hexagonal piezoelectric quasicrystal(PQC)thin film is analyzed under electric and temperature loads.Based on the Euler-Bernoulli beam theory,a theoretical model is proposed,resulting in coupled governing integral equations that account for interfacial normal and shear stresses.To numerically solve these integral equations,an expansion method using orthogonal Chebyshev polynomials is employed.The results provide insights into the interfacial stresses,axial force,as well as axial and vertical deformations of the PQC film.Additionally,fracture criteria,including stress intensity factors,mode angles,and the J-integral,are evaluated.The solution is compared with the membrane theory,neglecting the normal stress and bending deformation.Finally,the effects of stiffness and aspect ratio on the PQC film are thoroughly discussed.This study serves as a valuable guide for controlling the mechanical response and conducting safety assessments of PQC film systems.
基金Project supported by the National Natural Science Foundation of China(Nos.11902293 and 12272353)。
文摘In this paper,we investigate the interfacial behavior of a thin,penny-shaped,one-dimensional(1D)hexagonal functionally graded(FG)piezoelectric quasicrystal(PQC)film bonded on a temperature-dependent elastic substrate under thermal and electrical loads.The problem is modeled as axisymmetric based on the membrane theory,with the peeling stress and bending moment being disregarded.A potential theory method,combined with the Hankel transform technique,is utilized to derive the displacement field on the substrate surface.With perfect interfacial bonding assumption,an integral equation governing the phonon interfacial shear stress is formulated and numerically solved by the Chebyshev polynomials.Explicit expressions are derived for the interfacial shear stress,the internal stresses within the PQC film and the substrate,the axial strain,and the stress intensity factors(SIFs).Numerical simulations are conducted to investigate the effects of the film's aspect ratio,material inhomogeneity,material mismatch,and temperature-dependent material properties on its mechanical response.The results provide insights for the functional design and reliability assessment of FG PQC film/substrate systems.
