Lithography is a Key enabling technique in modern micro/nano scale technology.Achieving the optimal trade-off between resolution,throughput,and cost remains a central focus in the ongoing development.However,current l...Lithography is a Key enabling technique in modern micro/nano scale technology.Achieving the optimal trade-off between resolution,throughput,and cost remains a central focus in the ongoing development.However,current lithographic techniques such as direct-write,projection,and extreme ultraviolet lithography achieve higher resolution at the expense of increased complexity in optical systems or the use of shorter-wavelength light sources,thus raising the overall cost of production.Here,we present a cost-effective and wafer-level perfect conformal contact lithography at the diffraction limit.By leveraging a transferable photoresist,the technique ensures optimal contact between the mask and photoresist with zero-gap,facilitating the transfer of patterns at the diffraction limit while maintaining high fidelity and uniformity across large wafers.This technique applies to a wide range of complex surfaces,including non-conductive glass surfaces,flexible substrates,and curved surfaces.The proposed technique expands the potential of contact photolithography for novel device architectures and practic al manufacturing processes.展开更多
基金supported by the National Key Research and Development Program of China (2022YFB4602600)National Natural Science Foundation of China (Grant Nos. 52425508 & 52221001)the Hunan Provincial Natural Science Foundation of China (2025JJ60286)。
文摘Lithography is a Key enabling technique in modern micro/nano scale technology.Achieving the optimal trade-off between resolution,throughput,and cost remains a central focus in the ongoing development.However,current lithographic techniques such as direct-write,projection,and extreme ultraviolet lithography achieve higher resolution at the expense of increased complexity in optical systems or the use of shorter-wavelength light sources,thus raising the overall cost of production.Here,we present a cost-effective and wafer-level perfect conformal contact lithography at the diffraction limit.By leveraging a transferable photoresist,the technique ensures optimal contact between the mask and photoresist with zero-gap,facilitating the transfer of patterns at the diffraction limit while maintaining high fidelity and uniformity across large wafers.This technique applies to a wide range of complex surfaces,including non-conductive glass surfaces,flexible substrates,and curved surfaces.The proposed technique expands the potential of contact photolithography for novel device architectures and practic al manufacturing processes.
