The impacts of remote Coulomb scattering(RCS)on hole mobility in ultra-thin body silicon-on-insulator(UTB SOI)p-MOSFETs at cryogenic temperatures are investigated.The physical models including phonon scattering,surfac...The impacts of remote Coulomb scattering(RCS)on hole mobility in ultra-thin body silicon-on-insulator(UTB SOI)p-MOSFETs at cryogenic temperatures are investigated.The physical models including phonon scattering,surface roughness scattering,and remote Coulomb scatterings are considered,and the results are verified by the experimental results at different temperatures for both bulk(from 300 K to 30 K)and UTB SOI(300 K and 25 K)p-MOSFETs.The impacts of the interfacial trap charges at both front and bottom interfaces on the hole mobility are mainly evaluated for the UTB SOI p-MOSFETs at liquid helium temperature(4.2 K).The results reveal that as the temperature decreases,the RCS due to the interfacial trap charges plays an important role in the hole mobility.展开更多
Biaxial strain technology is a promising way to improve the mobility of both electrons and holes, while （100） channel direction appears as to be an effective booster of hole mobility in particular. In this work, the...Biaxial strain technology is a promising way to improve the mobility of both electrons and holes, while （100） channel direction appears as to be an effective booster of hole mobility in particular. In this work, the impact of biaxial strain together with （100） channel orientation on hole mobility is explored. The biaxial strain was incorporated by the growth of a relaxed SiGe buffer layer,serving as the template for depositing a Si layer in a state of biaxial tensile strain. The channel orientation was implemented with a 45^o rotated design in the device layout,which changed the channel direction from （110） to （100） on Si （001） surface. The maximum hole mobility is enhanced by 30% due to the change of channel direction from （110） to （100） on the same strained Si （s-Si） p-MOSFETs,in addition to the mobility enhancement of 130% when comparing s-Si pMOS to bulk Si pMOS both along （110） channels. Discussion and analysis are presented about the origin of the mobility enhancement by channel orientation along with biaxial strain in this work.展开更多
基金Project supported by the National Natural Science Foundation of China(Grant Nos.61674008,61421005,and 61804003)the National Key Research and Development Program of China(Grant No.2016YFA0202101)the China Postdoctoral Science Foundation(Grant Nos.2018M630034 and 2019T120017)。
文摘The impacts of remote Coulomb scattering(RCS)on hole mobility in ultra-thin body silicon-on-insulator(UTB SOI)p-MOSFETs at cryogenic temperatures are investigated.The physical models including phonon scattering,surface roughness scattering,and remote Coulomb scatterings are considered,and the results are verified by the experimental results at different temperatures for both bulk(from 300 K to 30 K)and UTB SOI(300 K and 25 K)p-MOSFETs.The impacts of the interfacial trap charges at both front and bottom interfaces on the hole mobility are mainly evaluated for the UTB SOI p-MOSFETs at liquid helium temperature(4.2 K).The results reveal that as the temperature decreases,the RCS due to the interfacial trap charges plays an important role in the hole mobility.
文摘Biaxial strain technology is a promising way to improve the mobility of both electrons and holes, while （100） channel direction appears as to be an effective booster of hole mobility in particular. In this work, the impact of biaxial strain together with （100） channel orientation on hole mobility is explored. The biaxial strain was incorporated by the growth of a relaxed SiGe buffer layer,serving as the template for depositing a Si layer in a state of biaxial tensile strain. The channel orientation was implemented with a 45^o rotated design in the device layout,which changed the channel direction from （110） to （100） on Si （001） surface. The maximum hole mobility is enhanced by 30% due to the change of channel direction from （110） to （100） on the same strained Si （s-Si） p-MOSFETs,in addition to the mobility enhancement of 130% when comparing s-Si pMOS to bulk Si pMOS both along （110） channels. Discussion and analysis are presented about the origin of the mobility enhancement by channel orientation along with biaxial strain in this work.
