Research on p-channel field-effect transistors(p-FETs)remains limited,primarily due to the significantly lower conductivity of the two-dimensional hole gas(2DHG)compared to the two-dimensional electron gas(2DEG)in n-c...Research on p-channel field-effect transistors(p-FETs)remains limited,primarily due to the significantly lower conductivity of the two-dimensional hole gas(2DHG)compared to the two-dimensional electron gas(2DEG)in n-channel field-effect transistors(n-FETs),which poses a significant challenge for monolithic integration.In this study,we investigate the impact of epitaxial structure parameters on 2DHG properties in p-Ga N/Al Ga N/Ga N heterostructures through semiconductor technology computer-aided design(TCAD)simulations and theoretical calculations,identifying the conditions necessary to achieve high-density 2DHG.Our simulations demonstrate that increasing the p-Ga N thickness leads to two critical thicknesses determined by surface states and acceptor ionization concentration:one corresponds to the onset of 2DHG formation,and the other to its saturation.Lowering the donor surface state energy level and increasing the acceptor ionization concentration promote 2DHG formation and saturation,although the saturated density remains independent of surface states.Additionally,a higher Al composition enhances intrinsic ionization due to stronger polarization effects,thereby increasing the 2DHG sheet density.Consequently,to achieve high-density 2DHG in p-Ga N/Al Ga N/Ga N heterostructures,it is essential to increase the Al composition,ensure that the p-Ga N thickness exceeds the critical thickness for 2DHG saturation,and maximize the acceptor ionization concentration.This study elucidates the impact of epitaxial structure parameters on 2DHG properties in p-Ga N/Al Ga N/Ga N heterostructures and provides valuable guidance for the optimization of p-FET designs.展开更多
增强型氮化镓(GaN)基高电子迁移率晶体管(high electron mobility transistor,HEMT)是高频高功率器件与开关器件领域的研究热点,P-GaN栅技术因具备制备工艺简单、可控且工艺重复性好等优势而成为目前最常用且唯一实现商用的GaN基增强型...增强型氮化镓(GaN)基高电子迁移率晶体管(high electron mobility transistor,HEMT)是高频高功率器件与开关器件领域的研究热点,P-GaN栅技术因具备制备工艺简单、可控且工艺重复性好等优势而成为目前最常用且唯一实现商用的GaN基增强型器件制备方法。首先,概述了当前制约P-GaN栅结构GaN基HEMT器件发展的首要问题,从器件结构与器件制备工艺这2个角度,综述了其性能优化举措方面的最新研究进展。然后,通过对研究进展的分析,总结了当前研究工作面临的挑战以及解决方法。最后,对未来的发展前景、发展方向进行了展望。展开更多
基金Project supported by the National Key Research and Development Program of China(Grant No.2022YFB3604203)the Key Research and Development Program of Guangdong Province,China(Grant No.2024B0101060002)the Key Research and Development Program of Shenzhen City,China(Grant No.JCYJ20241202130036043)。
文摘Research on p-channel field-effect transistors(p-FETs)remains limited,primarily due to the significantly lower conductivity of the two-dimensional hole gas(2DHG)compared to the two-dimensional electron gas(2DEG)in n-channel field-effect transistors(n-FETs),which poses a significant challenge for monolithic integration.In this study,we investigate the impact of epitaxial structure parameters on 2DHG properties in p-Ga N/Al Ga N/Ga N heterostructures through semiconductor technology computer-aided design(TCAD)simulations and theoretical calculations,identifying the conditions necessary to achieve high-density 2DHG.Our simulations demonstrate that increasing the p-Ga N thickness leads to two critical thicknesses determined by surface states and acceptor ionization concentration:one corresponds to the onset of 2DHG formation,and the other to its saturation.Lowering the donor surface state energy level and increasing the acceptor ionization concentration promote 2DHG formation and saturation,although the saturated density remains independent of surface states.Additionally,a higher Al composition enhances intrinsic ionization due to stronger polarization effects,thereby increasing the 2DHG sheet density.Consequently,to achieve high-density 2DHG in p-Ga N/Al Ga N/Ga N heterostructures,it is essential to increase the Al composition,ensure that the p-Ga N thickness exceeds the critical thickness for 2DHG saturation,and maximize the acceptor ionization concentration.This study elucidates the impact of epitaxial structure parameters on 2DHG properties in p-Ga N/Al Ga N/Ga N heterostructures and provides valuable guidance for the optimization of p-FET designs.
文摘增强型氮化镓(GaN)基高电子迁移率晶体管(high electron mobility transistor,HEMT)是高频高功率器件与开关器件领域的研究热点,P-GaN栅技术因具备制备工艺简单、可控且工艺重复性好等优势而成为目前最常用且唯一实现商用的GaN基增强型器件制备方法。首先,概述了当前制约P-GaN栅结构GaN基HEMT器件发展的首要问题,从器件结构与器件制备工艺这2个角度,综述了其性能优化举措方面的最新研究进展。然后,通过对研究进展的分析,总结了当前研究工作面临的挑战以及解决方法。最后,对未来的发展前景、发展方向进行了展望。
