In this paper, we propose multi-fin FET design techniques targeted for RF applications. Overlap and underlap design configuration in a base FinFET are compared first and then multi-fin device (consisting of transistor...In this paper, we propose multi-fin FET design techniques targeted for RF applications. Overlap and underlap design configuration in a base FinFET are compared first and then multi-fin device (consisting of transistor unit up to 50) is studied to develop design limitations and to evaluate their effects on the device performance. We have also investigated the impact of the number of fins (up to 50) in multi-fin structure and resulting RF parameters. Our results show that as the number of fin increases, underlap design compromises RF performance and short channel effects. The results provide technical understanding that is necessary to realize new opportunities for RF and analog mixed-signal design with nanoscale FinFETs.展开更多
据西安电子科技大学网站,近日,西安电子科技大学杭州研究院(西电杭研院)韩根全教授课题组在铁电场效应晶体管(FeFET)存储和存算技术领域取得重要进展,相关研究成果以“Low-power Edge Detection Based on Ferroelectric Field-Effect Tr...据西安电子科技大学网站,近日,西安电子科技大学杭州研究院(西电杭研院)韩根全教授课题组在铁电场效应晶体管(FeFET)存储和存算技术领域取得重要进展,相关研究成果以“Low-power Edge Detection Based on Ferroelectric Field-Effect Transistor”为题发表于《自然·通讯》。展开更多
A much more sustainable,cost effective and very flexible process for manufacturing critical fibres based on ultra high molecular weight polyethylene(UHMWPE)is being launched by the UK’s Fibre Extrusion Technologies(F...A much more sustainable,cost effective and very flexible process for manufacturing critical fibres based on ultra high molecular weight polyethylene(UHMWPE)is being launched by the UK’s Fibre Extrusion Technologies(FET).展开更多
SOI CMOS技术存在许多优势,但由于存在厚的埋氧层,其总剂量效应反而比体Si器件更差,因此需进行总剂量抗辐射加固设计。对几种SOI MOSFET的栅氧、埋氧和场氧总剂量抗辐射加固的方法进行了对比较分析,指出了各自的优劣势,给出了研究方向...SOI CMOS技术存在许多优势,但由于存在厚的埋氧层,其总剂量效应反而比体Si器件更差,因此需进行总剂量抗辐射加固设计。对几种SOI MOSFET的栅氧、埋氧和场氧总剂量抗辐射加固的方法进行了对比较分析,指出了各自的优劣势,给出了研究方向。并对FLEXFET和G4-FET三维SOI器件抗辐射加固新结构进行了阐述,分析了其优越性。展开更多
文摘In this paper, we propose multi-fin FET design techniques targeted for RF applications. Overlap and underlap design configuration in a base FinFET are compared first and then multi-fin device (consisting of transistor unit up to 50) is studied to develop design limitations and to evaluate their effects on the device performance. We have also investigated the impact of the number of fins (up to 50) in multi-fin structure and resulting RF parameters. Our results show that as the number of fin increases, underlap design compromises RF performance and short channel effects. The results provide technical understanding that is necessary to realize new opportunities for RF and analog mixed-signal design with nanoscale FinFETs.
文摘据西安电子科技大学网站,近日,西安电子科技大学杭州研究院(西电杭研院)韩根全教授课题组在铁电场效应晶体管(FeFET)存储和存算技术领域取得重要进展,相关研究成果以“Low-power Edge Detection Based on Ferroelectric Field-Effect Transistor”为题发表于《自然·通讯》。
文摘A much more sustainable,cost effective and very flexible process for manufacturing critical fibres based on ultra high molecular weight polyethylene(UHMWPE)is being launched by the UK’s Fibre Extrusion Technologies(FET).
