The drive towards shorter design cycles for analog integrated circuits has given impetus to the development of Field Programmable Analog Arrays(FPAAs),which are the analogue counterparts of Field Programmable Gate Arr...The drive towards shorter design cycles for analog integrated circuits has given impetus to the development of Field Programmable Analog Arrays(FPAAs),which are the analogue counterparts of Field Programmable Gate Arrays(FPGAs).In this paper,we present a new design methodology which using FPAA as a powerful analog front-end processing platform in the smart sensory microsystem.The proposed FPAA contains 16 homogeneous mixed-grained Configurable Analog Blocks(CABs) which house a variety of processing elements especially the proposed fine-grained Core Configurable Amplifiers(CCAs).The high flexible CABs allow the FPAA operating in both continuous-time and discrete-time approaches suitable to support variety of sensors.To reduce the nonideal parasitic effects and save area,the fat-tree interconnection network is adopted in this FPAA.The functionality of this FPAA is demonstrated through embedding of voltage and capacitive sensor signal readout circuits and a configurable band pass filter.The minimal detectable voltage and capacitor achieves 38 uV and 8.3 aF respectively within 100 Hz sensor bandwidth.The power consumption comparison of CCA in three applications shows that the FPAA has high power efficiency.And the simulation results also show that the FPAA has good tolerance with wide PVT variations.展开更多
In this work,AZ31B extruded sheets with mixed-grain microstructures were prepared through extrusion.Samples of mixed-grain microstructure with different morphologies were selected from the AZ31B extruded sheets(referr...In this work,AZ31B extruded sheets with mixed-grain microstructures were prepared through extrusion.Samples of mixed-grain microstructure with different morphologies were selected from the AZ31B extruded sheets(referred to as M1 and M2 samples,respectively).The creep tests were performed on these samples at the temperature range of 150-200℃,and the stress level range of 50-100 MPa.The creep properties and fracture behavior of AZ31 extruded sheets with mixed-grain microstructures were studied.Results showed that the creep properties of the M2 sample always outperformed that of the M1 sample and M1 and M2 samples’creep was dominated by dislocation movement.The creep rate of M2 samples(1.5×10^(-7)±1.1×10^(-10) s^(-1))is an order of magnitude lower than that of M1 samples(4.8×10^(-6)±8.1×10^(-10) s^(-1))at 200℃under 50 MPa The high activity of basal slip and softening mechanism in the M1 sample significantly accelerated creep,resulting in a relatively high creep rate.Moreover,the stress concentration within the M1 sample caused by deformation incompatibility,increased the initiation and propagation of voids,ultimately leading to fracture and poorer creep performance.However,the numerous<10µm fine grains surrounding deformed coarse grains in the M2 sample facilitated better coordination of deformation through dislocation slip,effectively slowing down the initiation of voids during the creep process.Meanwhile,the strain was uniformly distributed within each grain,mitigating stress concentration,inhibiting voids propagation,and contributing to the superior creep resistance of the M2 sample.展开更多
基金Supported by the CAS/SAFEA International Partnership Program for Creative Research Teams,National High Technology Research and Develop Program of China(2012AA012301)National Science and Technology Major Project of China(2013ZX03006004)
文摘The drive towards shorter design cycles for analog integrated circuits has given impetus to the development of Field Programmable Analog Arrays(FPAAs),which are the analogue counterparts of Field Programmable Gate Arrays(FPGAs).In this paper,we present a new design methodology which using FPAA as a powerful analog front-end processing platform in the smart sensory microsystem.The proposed FPAA contains 16 homogeneous mixed-grained Configurable Analog Blocks(CABs) which house a variety of processing elements especially the proposed fine-grained Core Configurable Amplifiers(CCAs).The high flexible CABs allow the FPAA operating in both continuous-time and discrete-time approaches suitable to support variety of sensors.To reduce the nonideal parasitic effects and save area,the fat-tree interconnection network is adopted in this FPAA.The functionality of this FPAA is demonstrated through embedding of voltage and capacitive sensor signal readout circuits and a configurable band pass filter.The minimal detectable voltage and capacitor achieves 38 uV and 8.3 aF respectively within 100 Hz sensor bandwidth.The power consumption comparison of CCA in three applications shows that the FPAA has high power efficiency.And the simulation results also show that the FPAA has good tolerance with wide PVT variations.
基金supported by the National Natural Science Foundation of China(52474419,52374395)Natural Science Foundation of Shanxi Province(20210302123135,202303021221143)+3 种基金Scientific and Technological Achievements Transformation Guidance Special Project of Shanxi Province(202104021301022,202204021301009)Central Government Guided Local Science and Technology development projects(YDZJSX20231B003,YDZJSX2021A010)The Ministry of Science and Higher Education of the Russian Federation for financial support under the Megagrant(No.075-15-2022-1133)the National Research Foundation(NRF)grant funded by the Ministry of Science and ICT(2015R1A2A1A01006795)of Korea through the Research Institute of Advanced.
文摘In this work,AZ31B extruded sheets with mixed-grain microstructures were prepared through extrusion.Samples of mixed-grain microstructure with different morphologies were selected from the AZ31B extruded sheets(referred to as M1 and M2 samples,respectively).The creep tests were performed on these samples at the temperature range of 150-200℃,and the stress level range of 50-100 MPa.The creep properties and fracture behavior of AZ31 extruded sheets with mixed-grain microstructures were studied.Results showed that the creep properties of the M2 sample always outperformed that of the M1 sample and M1 and M2 samples’creep was dominated by dislocation movement.The creep rate of M2 samples(1.5×10^(-7)±1.1×10^(-10) s^(-1))is an order of magnitude lower than that of M1 samples(4.8×10^(-6)±8.1×10^(-10) s^(-1))at 200℃under 50 MPa The high activity of basal slip and softening mechanism in the M1 sample significantly accelerated creep,resulting in a relatively high creep rate.Moreover,the stress concentration within the M1 sample caused by deformation incompatibility,increased the initiation and propagation of voids,ultimately leading to fracture and poorer creep performance.However,the numerous<10µm fine grains surrounding deformed coarse grains in the M2 sample facilitated better coordination of deformation through dislocation slip,effectively slowing down the initiation of voids during the creep process.Meanwhile,the strain was uniformly distributed within each grain,mitigating stress concentration,inhibiting voids propagation,and contributing to the superior creep resistance of the M2 sample.
