A hybrid control platform is investigated in this paper to mitigate microvibrations to a group of vibration-sensitive equipment installed in a microelectronics facility subject to nearby road vehicle-induced horizonta...A hybrid control platform is investigated in this paper to mitigate microvibrations to a group of vibration-sensitive equipment installed in a microelectronics facility subject to nearby road vehicle-induced horizontal and vertical ground motions. The hybrid control platform, on which microelectronics equipment is installed, is mounted on a building floor through a series of passive mounts and controlled by hydraulic actuators in both horizontal and vertical directions. The control platform is an elastic body with significant bending modes of vibration, and a sub-optimal control algorithm is used to manipulate the hydraulic actuators with actuator dynamics included. The finite element model and the equations of motion of the coupled platform-building system are then established in the absolute coordinate to facilitate the feedback control and performance evaluation of the platform. The horizontal and vertical ground vibrations at the base of the building induced by nearby moving road vehicles are assumed to be stationary random processes. A typical three-story microelectronics building is selected as a case study. The case study shows that the vertical vibration of the microelectronics building is higher than the horizontal. The use of a hybrid control platform can effectively reduce both horizontal and vertical microvibrations of the microelectronics equipment to the level which satisfies the stringent microscale velocity requirement specified in the Bolt Beranek & Newman (BBN) criteria.展开更多
The technology boom in microelectronics and telecommunication industry has presented a unique opportunity for nanomaterials. Nanomaterials enable the creation of unique devices, components and systems through the cont...The technology boom in microelectronics and telecommunication industry has presented a unique opportunity for nanomaterials. Nanomaterials enable the creation of unique devices, components and systems through the control of matter on a near molecular level. These new devices, components and systems will exhibit novel physical, chemical, mechanical, electrical, optical and biological properties. The synthesis processes of nanomaterials are reviewed and the applications of nanomatorials in microelectronics are discussed in this paper.展开更多
Device physics research for submicron and deep submicron space microelectronics devices and integrated circuits will be described in three topics.1.Thin film submicron and deep submicron SOS / CMOS devices and integra...Device physics research for submicron and deep submicron space microelectronics devices and integrated circuits will be described in three topics.1.Thin film submicron and deep submicron SOS / CMOS devices and integrated circuits.2.Deep submicron LDD CMOS devices and integrated circuits.3.C band and Ku band microwave GaAs MESFET and III-V compound hetrojunction HEM T and HBT devices and integrated circuits.展开更多
Whoever thinks of Empress Sisi,Sacher cake,skiing or the Vienna Opera Ball first in connection with Austria is not wrong at all,but this individual does overlook one important factor:Austria is actually an extremely i...Whoever thinks of Empress Sisi,Sacher cake,skiing or the Vienna Opera Ball first in connection with Austria is not wrong at all,but this individual does overlook one important factor:Austria is actually an extremely innovative and profitable business location.In addition to highly qualified and motivated employees,Austria always boasts the highest density of world market leaders in relation to the number of inhabitants.展开更多
The new digital society is based on Internet of Things (IoT) and related connected objects are becoming more prevalent around the world. This evolution implies innovation in many areas of technology, the heart of whic...The new digital society is based on Internet of Things (IoT) and related connected objects are becoming more prevalent around the world. This evolution implies innovation in many areas of technology, the heart of which is microelectronics. Connected objects involve many technological components and functions that are directly dependent of the microelectronics capabilities. If the perspectives are exciting, several challenges are appearing. The first is related to the energy consumption of all these objects, which will become enormous by 2030, and unrealistic by 2040. The second is human resources concern. The future engineers and PhD will have many obstacles to overcome. A way to face these challenges is to involve more and more new thin film technologies that must be combined with VLSI ones, and to better train students to this domain with enough know-how and with a large spectrum of knowledge suitable for multidisciplinary applications. The French national network for Higher Education in microelectronics has adopted this strategy. After presentation of the challenges, this paper deals with the innovative activities of the French network focused on thin film technologies, in order to face the challenges in a short future.展开更多
The human brain is asymmetrical in function, with each of its two hemispheres being somewhat responsible for distinct cognitive and motor tasks, to include writing. It stands to reason that engineering students who ha...The human brain is asymmetrical in function, with each of its two hemispheres being somewhat responsible for distinct cognitive and motor tasks, to include writing. It stands to reason that engineering students who have established entrance into their upper-division programs will have demonstrated cognitive proficiency in math and logical operations, abstract and analytical reasoning and language usage, to include writing. In this study the question was asked: is there a correlation between an upper-division electrical engineering students’ analytical reasoning ability and their descriptive writing ability? Descriptive writing is taken here to mean a students’ ability to identify key physical aspects of a mathematical model and to express—in words—a concise and well-balanced description that demonstrates a deep conceptual understanding of the model. This includes more than a description of the variables or the particular application to an engineering problem;it includes a demonstrated recognition of the basic physics that govern the model, certain limitations (idealizations) inherent in the model, and an understanding of how to make practical experimental measurements to verify the governing physics in the model. A student at this level may demonstrate proficiency in their analytical reasoning skills and hence be capable of correctly solving a given problem. However, this does not guarantee that the same student is skilled in associating equations with their physical meaning on a deep conceptual level or in understanding physical limitations of the equation. Consequently, such a student may demonstrate difficulty in mapping their comprehension of the model into written language that demonstrates a sound conceptual understanding of the governing physics. The findings represent a sample of two independent class sections of Electrical and Computer Engineering junior’s first course in Microe-lectronic Devices and Circuits during fall semesters 2012 and 2013 at a private mid-size university in NW Oregon. A total of three exams were administered to each of the 2012/2013 groups. Correlations between exam scores that students achieved on their descriptive writing of microelectronics phenomena and their analytical problem-solving abilities were examined and found to be quite significant.展开更多
Research and development work of space microelectronics of China startedin 1965 as part of the space development program of China. Jointcoordination administered by the Ministry of Aero-Space results in success of Ch...Research and development work of space microelectronics of China startedin 1965 as part of the space development program of China. Jointcoordination administered by the Ministry of Aero-Space results in success of China’s first generation of space program including the launching ofcommunication satellite. It is to be emphasized that during this phase of Rand D for space microelectronics (1965～1978), we were completely iso-展开更多
The mixed teaching mode plays an increasingly important role in stimulating students’interest and autonomy in learning,and strengthening students’learning ability.The full integration of mixed teaching mode and micr...The mixed teaching mode plays an increasingly important role in stimulating students’interest and autonomy in learning,and strengthening students’learning ability.The full integration of mixed teaching mode and microelectronics teaching can not only achieve the teaching objectives smoothly,but also enable students to deepen their understanding and memory of relevant knowledge with the help of diversified and interesting teaching methods.Therefore,this paper takes the microelectronics course as an example to practice and explore the effective ways to carry out the mixed teaching mode.Teachers should not make full use of online and offline teaching resources,but also actively improve the traditional assessment systems.Through the continuous improvement of the practicality of online and offline teaching content,an easy-to-complex teaching method with a coherent content structure can be adopted to stimulate students’learning motivation,improve their enthusiasm for participation,and lay a solid foundation for further improvements in the teaching of microelectronics technology.展开更多
A detailed sensitivity study was carried out on various key parameters from a high precision numerical model of a microelectronic package cooled by natural convection, to provide rules for the thermal modeling of micr...A detailed sensitivity study was carried out on various key parameters from a high precision numerical model of a microelectronic package cooled by natural convection, to provide rules for the thermal modeling of microelectronic packages subjected to natural convection heat transfer. An accurate estimate of the junction temperature, with an error of less than 1˚C, was obtained compared to the experimental data for the vertical and horizontal orientations of the test vehicle in the JEDEC Still Air configuration. The sensitivity study showed that to have an accurate estimate of the temperature, the following elements should be present in the thermal model: radiation heat transfer in natural convection cooling;a computational fluid dynamics analysis to find realistic convection coefficients;detailed models of the high conductivity elements in the direction of the heat flow towards the environment;and finally precise values for the thicknesses of layers and the thermal properties of the substrate and the printed circuit board.展开更多
This special issue will include reviews,regular papers,and short communications,and reports in the fields for next generation electronics and photonics.The topics include but not restricted in advanced microelectronic...This special issue will include reviews,regular papers,and short communications,and reports in the fields for next generation electronics and photonics.The topics include but not restricted in advanced microelectronic devices and materials,low-dimensional materials and novel nanodevice applications,flexible/wearable/implantable electronics,wide bandgap semiconductor materials and devices,photoelectronics,photonics,advanced display technologies,nanophotonics,integrated quantum photonics,photovoltaics,energy harvesting and self-powered wireless sensing,sensors,micro-actuators,MEMS,microfluidics,and bioMEMS,etc.展开更多
The combining microelectronic devices and associated technologies onto a single silicon chip poses a substantial challenge.However,in recent years,the area of silicon photonics has experienced remarkable advancements ...The combining microelectronic devices and associated technologies onto a single silicon chip poses a substantial challenge.However,in recent years,the area of silicon photonics has experienced remarkable advancements and notable leaps in performance.The performance of silicon on insulator(SOI)based photonic devices,such as fast silicon optical modulators,photonic transceivers,optical filters,etc.,have been discussed.This would be a step forward in creating standalone silicon photonic devices,strengthening the possibility of single on-chip nanophotonic integrated circuits.Suppose an integrated silicon photonic chip is designed and fabricated.In that case,it might drastically modify these combined photonic component costs,power consumption,and size,bringing substantial,perhaps revolutionary,changes to the next-generation communications sector.Yet,the monolithic integration of photonic and electrical circuitry is a significant technological difficulty.A complicated set of factors must be carefully considered to determine which application will have the best chance of success employing silicon-based integrated product solutions.The processing limitations connected to the current process flow,the process generation(sometimes referred to as lithography node generation),and packaging requirements are a few of these factors to consider.This review highlights recent developments in integrated silicon photonic devices and their proven applications,including but not limited to photonic waveguides,photonic amplifiers and filters,onchip photonic transceivers,and the state-of-the-art of silicon photonic in multidimensional quantum systems.The investigated devices aim to expedite the transfer of silicon photonics from academia to industry by opening the next phase in on-chip silicon photonics and enabling the application of silicon photonic-based devices in various optical systems.展开更多
The publication of Tsinghua Science and Technology was started in 1996. Since then, it has been an international academic journal sponsored by Tsinghua University and published bimonthly. This journal aims at presenti...The publication of Tsinghua Science and Technology was started in 1996. Since then, it has been an international academic journal sponsored by Tsinghua University and published bimonthly. This journal aims at presenting the state-of-art scientific achievements in computer science and other IT fields.展开更多
The publication of Tsinghua Science and Technology was started in 1996. Since then, it has been an international academic journal sponsored by Tsinghua University and published bimonthly. This journal aims at presenti...The publication of Tsinghua Science and Technology was started in 1996. Since then, it has been an international academic journal sponsored by Tsinghua University and published bimonthly. This journal aims at presenting the state-of-art scientific achievements in computer science and other IT fields.展开更多
A microelectronic circuit is used to regenerate the neural signals between the proximal end and the distal end of an injured nerve.An experimental scheme is designed and carried out to verify the feasibility of the so...A microelectronic circuit is used to regenerate the neural signals between the proximal end and the distal end of an injured nerve.An experimental scheme is designed and carried out to verify the feasibility of the so-called microelectronic neural bridge（MNB）.The sciatic signals of the source spinal toad which are evoked by chemical stimuli are used as source signals to stimulate the sciatic of the controlled spinal toad.The sciatic nerve signals of the source spinal toad,the regenerated sciatic signals in the controlled spinal toad,and the resulting electromyography（EMG）signals associated with the gastrocnemius muscle movements of the controlled spinal toad are displayed and recorded by an oscilloscope.By analyzing the coherence between the source sciatic nerve signals and the regenerated sciatic nerve signals and the coherence between the regenerated nerve signals and the EMG signals,it is proved that the regenerated sciatic nerve signals have a relationship with the source sciatic nerve signals and control shrinkage of the leg of the controlled toad.展开更多
Thermal management of microelectronics demands higher heat flux removal capabilities due to the rapid increase in component and heat flux densities generated by integrated circuits (ICs). Electrospray evaporative cool...Thermal management of microelectronics demands higher heat flux removal capabilities due to the rapid increase in component and heat flux densities generated by integrated circuits (ICs). Electrospray evaporative cooling (ESEC) is a potential package-level thermal management solution for the next generation of microelectronics. In this paper, a design methodology is presented using numerical electrostatic field modeling to indirectly design proof-of-concept, micronozzle-based ESEC chambers. The results of the numerical modeling and heat transfer experiments indicate that the potential distribution near the micronozzle tip of the ESEC chamber dominates the heat transfer performance of ESEC cooling devices. The surface charge density at the micronozzle tips has a minor impact on the heat transfer performance. The maximum enhancement ratio of 1.87 was achieved by the 8-nozzle ESEC chamber at the lowest heat flux investigated, indicating that the heat transfer capability of ESEC chambers declines as the heat source density increases. The study demonstrates that increasing the number of micronozzles and decreasing the flow rate per nozzle may not effectively improve the heat transfer performance of ESEC devices.展开更多
We report a simple method for fabricating all-solid-state micro-supercapacitors, utilizing laser writing technology. Porous graphene films with three-dimensional networks induced by laser from commercial polymer was a...We report a simple method for fabricating all-solid-state micro-supercapacitors, utilizing laser writing technology. Porous graphene films with three-dimensional networks induced by laser from commercial polymer was acted as scaffold for loading MnO2, a typical pseudocapacitive materials. Using gel electrolyte, all-solid-state pseudocapacitive micro-supercapacitors were fabricated. Compare to traditional printing and lithography techniques produced micro-supercapacitors, the as-fabricated devices demonstrate high volumetric capacitances, good stability and low leakage current, indicating a scalable and facile approach for future energy storage devices in portable microelectronics.展开更多
Thermionic emission is a tunneling phenomenon,which depicts that electrons on the surface of a conductor can be pulled out into the vacuum when they are subjected to high electrical tensions while being heated hot eno...Thermionic emission is a tunneling phenomenon,which depicts that electrons on the surface of a conductor can be pulled out into the vacuum when they are subjected to high electrical tensions while being heated hot enough to overtake their work functions.This principle has led to the great success of the so-called vacuum tubes in the early 20 th century.To date,major challenges still remain in the miniaturization of a vacuum channel transistor for on-chip integration in modern solid-state integrated circuits.Here,by introducing nano-sized vacuum gaps(~200 nm)in a van der Waals heterostructure,we successfully fabricated a one-dimensional(1 D)edge-to-edge thermionic emission vacuum tube using graphene as the filament.With the increasing collector voltage,the emitted current exhibits a typical rectifying behavior,with the maximum emission current reaching 200 p A and an ON-OFF ratio of 10;.In addition,it is found that the maximum emission current is proportional to the number of the layers of graphene.Our results expand the research of nano-sized vacuum tubes to an unexplored physical limit of 1 D edge-to-edge emission,and hold great promise for future nano-electronic systems based on it.展开更多
The device structure and technical processings of quasi-planar self-aligned silicon avalanche electron emission array arc introduced. The processing step at the edge of electron emission region is about 10nm only and ...The device structure and technical processings of quasi-planar self-aligned silicon avalanche electron emission array arc introduced. The processing step at the edge of electron emission region is about 10nm only and the width of self-aligned current channel of shallow As implantation is about 3μm. Its I-V characteristics show a larger linear region and lower series resistance than that of the previous silicon avalanche electron emission devices. Some of the electron emission characteristics are also discussed in this paper.展开更多
This article proposes a novel "cathode-on-membrane" vacuum microelectronic (VME)pressure sensor. Compared with conventional VME pressure sensors, the package process of the new structured sensor is easier to...This article proposes a novel "cathode-on-membrane" vacuum microelectronic (VME)pressure sensor. Compared with conventional VME pressure sensors, the package process of the new structured sensor is easier to control, and therefore it enable greater potential of nass production and high productivity. The properties of the new sensor have been theoretically investigated by computer simulations; the practical structure has been designed and fabricated; and the package technique has been studied.展开更多
基金CERG competitive research grant (Polyu 5054/02E) from Research Grants Council of Hong Kong, Area Strategic Development Programmer in Structural Control and Intelligent Buildings from The Hong Kong Polytechnic Universityand the Opening Research Foundation of the Beijing Key Laboratories (EESR2004-2) from Beijing University of Technology.
文摘A hybrid control platform is investigated in this paper to mitigate microvibrations to a group of vibration-sensitive equipment installed in a microelectronics facility subject to nearby road vehicle-induced horizontal and vertical ground motions. The hybrid control platform, on which microelectronics equipment is installed, is mounted on a building floor through a series of passive mounts and controlled by hydraulic actuators in both horizontal and vertical directions. The control platform is an elastic body with significant bending modes of vibration, and a sub-optimal control algorithm is used to manipulate the hydraulic actuators with actuator dynamics included. The finite element model and the equations of motion of the coupled platform-building system are then established in the absolute coordinate to facilitate the feedback control and performance evaluation of the platform. The horizontal and vertical ground vibrations at the base of the building induced by nearby moving road vehicles are assumed to be stationary random processes. A typical three-story microelectronics building is selected as a case study. The case study shows that the vertical vibration of the microelectronics building is higher than the horizontal. The use of a hybrid control platform can effectively reduce both horizontal and vertical microvibrations of the microelectronics equipment to the level which satisfies the stringent microscale velocity requirement specified in the Bolt Beranek & Newman (BBN) criteria.
文摘The technology boom in microelectronics and telecommunication industry has presented a unique opportunity for nanomaterials. Nanomaterials enable the creation of unique devices, components and systems through the control of matter on a near molecular level. These new devices, components and systems will exhibit novel physical, chemical, mechanical, electrical, optical and biological properties. The synthesis processes of nanomaterials are reviewed and the applications of nanomatorials in microelectronics are discussed in this paper.
文摘Device physics research for submicron and deep submicron space microelectronics devices and integrated circuits will be described in three topics.1.Thin film submicron and deep submicron SOS / CMOS devices and integrated circuits.2.Deep submicron LDD CMOS devices and integrated circuits.3.C band and Ku band microwave GaAs MESFET and III-V compound hetrojunction HEM T and HBT devices and integrated circuits.
文摘Whoever thinks of Empress Sisi,Sacher cake,skiing or the Vienna Opera Ball first in connection with Austria is not wrong at all,but this individual does overlook one important factor:Austria is actually an extremely innovative and profitable business location.In addition to highly qualified and motivated employees,Austria always boasts the highest density of world market leaders in relation to the number of inhabitants.
文摘The new digital society is based on Internet of Things (IoT) and related connected objects are becoming more prevalent around the world. This evolution implies innovation in many areas of technology, the heart of which is microelectronics. Connected objects involve many technological components and functions that are directly dependent of the microelectronics capabilities. If the perspectives are exciting, several challenges are appearing. The first is related to the energy consumption of all these objects, which will become enormous by 2030, and unrealistic by 2040. The second is human resources concern. The future engineers and PhD will have many obstacles to overcome. A way to face these challenges is to involve more and more new thin film technologies that must be combined with VLSI ones, and to better train students to this domain with enough know-how and with a large spectrum of knowledge suitable for multidisciplinary applications. The French national network for Higher Education in microelectronics has adopted this strategy. After presentation of the challenges, this paper deals with the innovative activities of the French network focused on thin film technologies, in order to face the challenges in a short future.
文摘The human brain is asymmetrical in function, with each of its two hemispheres being somewhat responsible for distinct cognitive and motor tasks, to include writing. It stands to reason that engineering students who have established entrance into their upper-division programs will have demonstrated cognitive proficiency in math and logical operations, abstract and analytical reasoning and language usage, to include writing. In this study the question was asked: is there a correlation between an upper-division electrical engineering students’ analytical reasoning ability and their descriptive writing ability? Descriptive writing is taken here to mean a students’ ability to identify key physical aspects of a mathematical model and to express—in words—a concise and well-balanced description that demonstrates a deep conceptual understanding of the model. This includes more than a description of the variables or the particular application to an engineering problem;it includes a demonstrated recognition of the basic physics that govern the model, certain limitations (idealizations) inherent in the model, and an understanding of how to make practical experimental measurements to verify the governing physics in the model. A student at this level may demonstrate proficiency in their analytical reasoning skills and hence be capable of correctly solving a given problem. However, this does not guarantee that the same student is skilled in associating equations with their physical meaning on a deep conceptual level or in understanding physical limitations of the equation. Consequently, such a student may demonstrate difficulty in mapping their comprehension of the model into written language that demonstrates a sound conceptual understanding of the governing physics. The findings represent a sample of two independent class sections of Electrical and Computer Engineering junior’s first course in Microe-lectronic Devices and Circuits during fall semesters 2012 and 2013 at a private mid-size university in NW Oregon. A total of three exams were administered to each of the 2012/2013 groups. Correlations between exam scores that students achieved on their descriptive writing of microelectronics phenomena and their analytical problem-solving abilities were examined and found to be quite significant.
文摘Research and development work of space microelectronics of China startedin 1965 as part of the space development program of China. Jointcoordination administered by the Ministry of Aero-Space results in success of China’s first generation of space program including the launching ofcommunication satellite. It is to be emphasized that during this phase of Rand D for space microelectronics (1965～1978), we were completely iso-
文摘The mixed teaching mode plays an increasingly important role in stimulating students’interest and autonomy in learning,and strengthening students’learning ability.The full integration of mixed teaching mode and microelectronics teaching can not only achieve the teaching objectives smoothly,but also enable students to deepen their understanding and memory of relevant knowledge with the help of diversified and interesting teaching methods.Therefore,this paper takes the microelectronics course as an example to practice and explore the effective ways to carry out the mixed teaching mode.Teachers should not make full use of online and offline teaching resources,but also actively improve the traditional assessment systems.Through the continuous improvement of the practicality of online and offline teaching content,an easy-to-complex teaching method with a coherent content structure can be adopted to stimulate students’learning motivation,improve their enthusiasm for participation,and lay a solid foundation for further improvements in the teaching of microelectronics technology.
文摘A detailed sensitivity study was carried out on various key parameters from a high precision numerical model of a microelectronic package cooled by natural convection, to provide rules for the thermal modeling of microelectronic packages subjected to natural convection heat transfer. An accurate estimate of the junction temperature, with an error of less than 1˚C, was obtained compared to the experimental data for the vertical and horizontal orientations of the test vehicle in the JEDEC Still Air configuration. The sensitivity study showed that to have an accurate estimate of the temperature, the following elements should be present in the thermal model: radiation heat transfer in natural convection cooling;a computational fluid dynamics analysis to find realistic convection coefficients;detailed models of the high conductivity elements in the direction of the heat flow towards the environment;and finally precise values for the thicknesses of layers and the thermal properties of the substrate and the printed circuit board.
文摘This special issue will include reviews,regular papers,and short communications,and reports in the fields for next generation electronics and photonics.The topics include but not restricted in advanced microelectronic devices and materials,low-dimensional materials and novel nanodevice applications,flexible/wearable/implantable electronics,wide bandgap semiconductor materials and devices,photoelectronics,photonics,advanced display technologies,nanophotonics,integrated quantum photonics,photovoltaics,energy harvesting and self-powered wireless sensing,sensors,micro-actuators,MEMS,microfluidics,and bioMEMS,etc.
文摘The combining microelectronic devices and associated technologies onto a single silicon chip poses a substantial challenge.However,in recent years,the area of silicon photonics has experienced remarkable advancements and notable leaps in performance.The performance of silicon on insulator(SOI)based photonic devices,such as fast silicon optical modulators,photonic transceivers,optical filters,etc.,have been discussed.This would be a step forward in creating standalone silicon photonic devices,strengthening the possibility of single on-chip nanophotonic integrated circuits.Suppose an integrated silicon photonic chip is designed and fabricated.In that case,it might drastically modify these combined photonic component costs,power consumption,and size,bringing substantial,perhaps revolutionary,changes to the next-generation communications sector.Yet,the monolithic integration of photonic and electrical circuitry is a significant technological difficulty.A complicated set of factors must be carefully considered to determine which application will have the best chance of success employing silicon-based integrated product solutions.The processing limitations connected to the current process flow,the process generation(sometimes referred to as lithography node generation),and packaging requirements are a few of these factors to consider.This review highlights recent developments in integrated silicon photonic devices and their proven applications,including but not limited to photonic waveguides,photonic amplifiers and filters,onchip photonic transceivers,and the state-of-the-art of silicon photonic in multidimensional quantum systems.The investigated devices aim to expedite the transfer of silicon photonics from academia to industry by opening the next phase in on-chip silicon photonics and enabling the application of silicon photonic-based devices in various optical systems.
文摘The publication of Tsinghua Science and Technology was started in 1996. Since then, it has been an international academic journal sponsored by Tsinghua University and published bimonthly. This journal aims at presenting the state-of-art scientific achievements in computer science and other IT fields.
文摘The publication of Tsinghua Science and Technology was started in 1996. Since then, it has been an international academic journal sponsored by Tsinghua University and published bimonthly. This journal aims at presenting the state-of-art scientific achievements in computer science and other IT fields.
基金The National Natural Science Foundation of China(No.90307013,90707005)the Natural Science Foundation of Jiangsu Province(No.BK2008032)+1 种基金Special Foundation and Open Foundation of State Key Laboratory of Bioelectronics of Southeast UniversityNantong Planning Project of Science and Technology(No.K2009037)
文摘A microelectronic circuit is used to regenerate the neural signals between the proximal end and the distal end of an injured nerve.An experimental scheme is designed and carried out to verify the feasibility of the so-called microelectronic neural bridge（MNB）.The sciatic signals of the source spinal toad which are evoked by chemical stimuli are used as source signals to stimulate the sciatic of the controlled spinal toad.The sciatic nerve signals of the source spinal toad,the regenerated sciatic signals in the controlled spinal toad,and the resulting electromyography（EMG）signals associated with the gastrocnemius muscle movements of the controlled spinal toad are displayed and recorded by an oscilloscope.By analyzing the coherence between the source sciatic nerve signals and the regenerated sciatic nerve signals and the coherence between the regenerated nerve signals and the EMG signals,it is proved that the regenerated sciatic nerve signals have a relationship with the source sciatic nerve signals and control shrinkage of the leg of the controlled toad.
文摘Thermal management of microelectronics demands higher heat flux removal capabilities due to the rapid increase in component and heat flux densities generated by integrated circuits (ICs). Electrospray evaporative cooling (ESEC) is a potential package-level thermal management solution for the next generation of microelectronics. In this paper, a design methodology is presented using numerical electrostatic field modeling to indirectly design proof-of-concept, micronozzle-based ESEC chambers. The results of the numerical modeling and heat transfer experiments indicate that the potential distribution near the micronozzle tip of the ESEC chamber dominates the heat transfer performance of ESEC cooling devices. The surface charge density at the micronozzle tips has a minor impact on the heat transfer performance. The maximum enhancement ratio of 1.87 was achieved by the 8-nozzle ESEC chamber at the lowest heat flux investigated, indicating that the heat transfer capability of ESEC chambers declines as the heat source density increases. The study demonstrates that increasing the number of micronozzles and decreasing the flow rate per nozzle may not effectively improve the heat transfer performance of ESEC devices.
基金financially supported by the National Natural Science Foundation of China(Nos.51706016,51506014)the China Postdoctoral Science Foundation(No.2017T100677)
文摘We report a simple method for fabricating all-solid-state micro-supercapacitors, utilizing laser writing technology. Porous graphene films with three-dimensional networks induced by laser from commercial polymer was acted as scaffold for loading MnO2, a typical pseudocapacitive materials. Using gel electrolyte, all-solid-state pseudocapacitive micro-supercapacitors were fabricated. Compare to traditional printing and lithography techniques produced micro-supercapacitors, the as-fabricated devices demonstrate high volumetric capacitances, good stability and low leakage current, indicating a scalable and facile approach for future energy storage devices in portable microelectronics.
基金supported by the National Natural Science Foundation of China(Grant Nos.12004389,12004288,and 12104462)the China Postdoctoral Science Foundation(Grant Nos.2020M68036 and 2021T140430)+1 种基金the support from the Joint Research Fund of Liaoning-Shenyang National Laboratory for Materials Science(Grant No.2019JH3/30100031)the support from the IMR Innovation Fund(Grant No.2021-PY17)。
文摘Thermionic emission is a tunneling phenomenon,which depicts that electrons on the surface of a conductor can be pulled out into the vacuum when they are subjected to high electrical tensions while being heated hot enough to overtake their work functions.This principle has led to the great success of the so-called vacuum tubes in the early 20 th century.To date,major challenges still remain in the miniaturization of a vacuum channel transistor for on-chip integration in modern solid-state integrated circuits.Here,by introducing nano-sized vacuum gaps(~200 nm)in a van der Waals heterostructure,we successfully fabricated a one-dimensional(1 D)edge-to-edge thermionic emission vacuum tube using graphene as the filament.With the increasing collector voltage,the emitted current exhibits a typical rectifying behavior,with the maximum emission current reaching 200 p A and an ON-OFF ratio of 10;.In addition,it is found that the maximum emission current is proportional to the number of the layers of graphene.Our results expand the research of nano-sized vacuum tubes to an unexplored physical limit of 1 D edge-to-edge emission,and hold great promise for future nano-electronic systems based on it.
基金National Natural Science Foudation of ChinaNatural Science Foudation of Zhejiang Province
文摘The device structure and technical processings of quasi-planar self-aligned silicon avalanche electron emission array arc introduced. The processing step at the edge of electron emission region is about 10nm only and the width of self-aligned current channel of shallow As implantation is about 3μm. Its I-V characteristics show a larger linear region and lower series resistance than that of the previous silicon avalanche electron emission devices. Some of the electron emission characteristics are also discussed in this paper.
基金Supported by the National High Technology R&D Program (863-512, project, number 9805-10)the National Natural Science Foundation of China (grant. number 69674030).
文摘This article proposes a novel "cathode-on-membrane" vacuum microelectronic (VME)pressure sensor. Compared with conventional VME pressure sensors, the package process of the new structured sensor is easier to control, and therefore it enable greater potential of nass production and high productivity. The properties of the new sensor have been theoretically investigated by computer simulations; the practical structure has been designed and fabricated; and the package technique has been studied.
