Since electromagnetic pollution is detrimental to human health and the environment,numerous efforts have been successively made to achieve excellent electromagnetic interference shielding effectiveness(EMI SE)via desi...Since electromagnetic pollution is detrimental to human health and the environment,numerous efforts have been successively made to achieve excellent electromagnetic interference shielding effectiveness(EMI SE)via designing the hierarchical structures for electromagnetic interference(EMI)shielding polymer composites.Among the plentiful structures,the asymmetric structures are currently a hot spot,principally categorizing into multi-layered,porous,fibrous,and segregated asymmetric structures,which endows the high EMI shielding performance for polymer composites incorporated with magnetic,conductive,and/or dielectric micro/nano-fillers,due to the“absorption-reflection-reabsorption”shielding mechanism.Therefore,this review provides the retrospection and summary of the efforts with respect to abundant asymmetric structures and multifunctional micro/nano-fillers for enhancing EMI shielding properties,which is conducive to the booming development of polymeric EMI shielding materials for the promising prospect in modern electronics and 5-generation(5G)technology.展开更多
Micro/nano functional structures (MNFSs) have attracted substantial attention because of theiroutstanding performance in optical, tribological, thermal, electronic, and biomedical applications. Despite thedevelopment ...Micro/nano functional structures (MNFSs) have attracted substantial attention because of theiroutstanding performance in optical, tribological, thermal, electronic, and biomedical applications. Despite thedevelopment of various mechanical and non-mechanical machining methods, achieving the high-efficiency, high-precision fabrication of MNFS from difficult-to-cut materials remains a significant technical challenge. This reviewbegins with an introduction to typical artificial MNFSs and their stringent requirements and then provides acomprehensive survey of MNFSs, focusing on etching methods. In particular, plasma etching demonstrates notableadvantages in MNFS fabrication. However, two critical challenges persist: accurately controlling topographicalinformation during pattern transfer in plasma etching and achieving high-quality, uniform patterning masks overlarge areas. These issues are addressed by thoroughly analyzing and summarizing the modeling of plasma etchingand the simulation of feature profiles. Various hybrid etching machining (HEM) strategies, including laser andetching combined machining, cutting and etching combined machining, molding and etching combined machining,and self-assembly and etching combined machining, are categorized and compared in detail to facilitate themanufacturing of complex MNFSs. Finally, this review summarizes current deficiencies and future challenges ofHEM, laying the groundwork for further advancements in MNFS fabrication and intelligent HEM technologies.展开更多
Owing to its unique ability to capture volumetric tomographic information with a single light flash,optoacoustic(OA)tomography has recently demonstrated ultrafast imaging speeds ultimately limited by the ultrasound ti...Owing to its unique ability to capture volumetric tomographic information with a single light flash,optoacoustic(OA)tomography has recently demonstrated ultrafast imaging speeds ultimately limited by the ultrasound time-of-flight.The method's scalability and the achievable spatial resolution are yet limited by the narrow bandwidth of piezo-composite arrays currently employed for OA signal detection.Here we report on the first implementation of high-density spherical array technology based on flexible polyvinylidene difluoride films featuring ultrawideband(0.3-40 MHz)sub mm^(2)area elements,thus enabling real-time multi-scale volumetric imaging with 22-35μm spatial resolution,superior image fidelity and over an order of magnitude signal-to-noise enhancement compared to piezo-composite equivalents.We further demonstrate five-dimensional(spectroscopic,time-resolved,volumetric)imaging capabilities by visualizing fast stimulus-evoked cerebral oxygenation changes in mice and performing real-time functional angiography of deep human micro-vasculature.The new technology thus leverages the true potential of OA for quantitative high-resolution visualization of rapid bio-dynamics across scales.展开更多
Free of any thermoplastic or photocuring resists, electrochemical nanoimprint lithography(ECNL) has emerged as an alternative nanoimprint way to fabricate three-dimensional micro/nano-structures(3D-MNSs) directly on a...Free of any thermoplastic or photocuring resists, electrochemical nanoimprint lithography(ECNL) has emerged as an alternative nanoimprint way to fabricate three-dimensional micro/nano-structures(3D-MNSs) directly on a semiconductor wafer by a spatially-confined corrosion reaction induced by the metal/semiconductor contact potential. However, the consumption of electron acceptors in the ultrathin electrolyte between imprint mold and semiconductor wafer will slow down or even cease the corrosion rate. To solve this problem, we change the short-circuited corrosion cell into a spatially-separated primary cell: the imprint mold compacted gallium arsenide(GaAs) wafer in the anodic chamber while the platinum(Pt) plate connected to the imprint mold in the cathodic chamber. Thus, the GaAs corrosion rate will be stabilized in its limiting steady-state current density because of the abundant source of electron acceptors in the catholic chamber. The corrosion processes can be photo-enhanced by white-light illumination. Consequently, both the accuracy and the efficiency are promoted dramatically, which are demonstrated by the excellent performance of the fabricated binary optical elements. Moreover, the contamination problem caused by the electron acceptors is totally avoided. All the results prove that this novel ECNL mode is competitive and prospective in imprinting 3D-MNSs directly on semiconductor wafer.展开更多
基金financially supported by the National Natural Science Foundation of China(Nos.52363004,51963003 and 52263003)Guizhou Provincial Science and Technology Projects(Nos.ZK[2022]Maj019 and ZK[2023]-Nor160)Guizhou Province High-level Innovative Talent Selection and Training Program(No.GCC2022-046)。
文摘Since electromagnetic pollution is detrimental to human health and the environment,numerous efforts have been successively made to achieve excellent electromagnetic interference shielding effectiveness(EMI SE)via designing the hierarchical structures for electromagnetic interference(EMI)shielding polymer composites.Among the plentiful structures,the asymmetric structures are currently a hot spot,principally categorizing into multi-layered,porous,fibrous,and segregated asymmetric structures,which endows the high EMI shielding performance for polymer composites incorporated with magnetic,conductive,and/or dielectric micro/nano-fillers,due to the“absorption-reflection-reabsorption”shielding mechanism.Therefore,this review provides the retrospection and summary of the efforts with respect to abundant asymmetric structures and multifunctional micro/nano-fillers for enhancing EMI shielding properties,which is conducive to the booming development of polymeric EMI shielding materials for the promising prospect in modern electronics and 5-generation(5G)technology.
基金supports by the National Natural Science Foundation of China(Grant Nos.52435008,52205440,and 52205441).
文摘Micro/nano functional structures (MNFSs) have attracted substantial attention because of theiroutstanding performance in optical, tribological, thermal, electronic, and biomedical applications. Despite thedevelopment of various mechanical and non-mechanical machining methods, achieving the high-efficiency, high-precision fabrication of MNFS from difficult-to-cut materials remains a significant technical challenge. This reviewbegins with an introduction to typical artificial MNFSs and their stringent requirements and then provides acomprehensive survey of MNFSs, focusing on etching methods. In particular, plasma etching demonstrates notableadvantages in MNFS fabrication. However, two critical challenges persist: accurately controlling topographicalinformation during pattern transfer in plasma etching and achieving high-quality, uniform patterning masks overlarge areas. These issues are addressed by thoroughly analyzing and summarizing the modeling of plasma etchingand the simulation of feature profiles. Various hybrid etching machining (HEM) strategies, including laser andetching combined machining, cutting and etching combined machining, molding and etching combined machining,and self-assembly and etching combined machining, are categorized and compared in detail to facilitate themanufacturing of complex MNFSs. Finally, this review summarizes current deficiencies and future challenges ofHEM, laying the groundwork for further advancements in MNFS fabrication and intelligent HEM technologies.
基金supported by the Swiss National Science Foundation(310030_192757)the European Research Council(ERC-2015-CoG-682379)+2 种基金The development of the ultra-wideband ultrasonic antenna and the in vivo optoacoustic experiments were supported by the grants from the Russian Science Foundation(18-45-06006)the Helmholtz Association(HRSF-0020)The development of numerical algorithms for enhancement of angiographic optoacoustic images was partially supported by the grant from the Russian Science Foundation(19-75-10055)。
文摘Owing to its unique ability to capture volumetric tomographic information with a single light flash,optoacoustic(OA)tomography has recently demonstrated ultrafast imaging speeds ultimately limited by the ultrasound time-of-flight.The method's scalability and the achievable spatial resolution are yet limited by the narrow bandwidth of piezo-composite arrays currently employed for OA signal detection.Here we report on the first implementation of high-density spherical array technology based on flexible polyvinylidene difluoride films featuring ultrawideband(0.3-40 MHz)sub mm^(2)area elements,thus enabling real-time multi-scale volumetric imaging with 22-35μm spatial resolution,superior image fidelity and over an order of magnitude signal-to-noise enhancement compared to piezo-composite equivalents.We further demonstrate five-dimensional(spectroscopic,time-resolved,volumetric)imaging capabilities by visualizing fast stimulus-evoked cerebral oxygenation changes in mice and performing real-time functional angiography of deep human micro-vasculature.The new technology thus leverages the true potential of OA for quantitative high-resolution visualization of rapid bio-dynamics across scales.
基金supported by the National Natural Science Foundation of China(21827802,22021001)the Program of Introducing Talents of Discipline to Universities of China(111 Project)(B08027,B17027)。
文摘Free of any thermoplastic or photocuring resists, electrochemical nanoimprint lithography(ECNL) has emerged as an alternative nanoimprint way to fabricate three-dimensional micro/nano-structures(3D-MNSs) directly on a semiconductor wafer by a spatially-confined corrosion reaction induced by the metal/semiconductor contact potential. However, the consumption of electron acceptors in the ultrathin electrolyte between imprint mold and semiconductor wafer will slow down or even cease the corrosion rate. To solve this problem, we change the short-circuited corrosion cell into a spatially-separated primary cell: the imprint mold compacted gallium arsenide(GaAs) wafer in the anodic chamber while the platinum(Pt) plate connected to the imprint mold in the cathodic chamber. Thus, the GaAs corrosion rate will be stabilized in its limiting steady-state current density because of the abundant source of electron acceptors in the catholic chamber. The corrosion processes can be photo-enhanced by white-light illumination. Consequently, both the accuracy and the efficiency are promoted dramatically, which are demonstrated by the excellent performance of the fabricated binary optical elements. Moreover, the contamination problem caused by the electron acceptors is totally avoided. All the results prove that this novel ECNL mode is competitive and prospective in imprinting 3D-MNSs directly on semiconductor wafer.
