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Emergence of metal-semiconductor phase transition in MX_(2)(M=Ni,Pd,Pt;X=S,Se,Te)moirésuperlattices
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作者 Jie Li Rui-Zi Zhang +2 位作者 Jinbo Pan Ping Chen Shixuan Du 《Chinese Physics B》 2025年第3期12-18,共7页
Two-dimensional(2D)moirésuperlattices with a small twist in orientation exhibit a broad range of physical properties due to the complicated intralayer and interlayer interactions modulated by the twist angle.Here... Two-dimensional(2D)moirésuperlattices with a small twist in orientation exhibit a broad range of physical properties due to the complicated intralayer and interlayer interactions modulated by the twist angle.Here,we report a metal-semiconductor phase transition in homojunction moirésuperlattices of NiS_(2) and PtTe_(2) with large twist angles based on high-throughput screening of 2D materials MX_(2)(M=Ni,Pd,Pt;X=S,Se,Te)via density functional theory(DFT)calculations.Firstly,the calculations for different stacking configurations(AA,AB and AC)reveal that AA stacking ones are stable for all the bilayer MX_(2).The metallic or semiconducting properties of these 2D materials remain invariable for different stacking without twisting except for NiS_(2) and PtTe_(2).For the twisted configurations,NiS_(2) transfers from metal to semiconductor when the twist angles are 21.79°,27.79°,32.20°and 60°.PtTe_(2) exhibits a similar transition at 60°.The phase transition is due to the weakened d-p orbital hybridization around the Fermi level as the interlayer distance increases in the twisted configurations.Further calculations of untwisted bilayers with increasing interlayer distance demonstrate that all the materials undergo metal-semiconductor phase transition with the increased interlayer distance because of the weakened d-p orbital hybridization.These findings provide fundamental insights into tuning the electronic properties of moirésuperlattices with large twist angles. 展开更多
关键词 moirésuperlattices first-principles calculations metal-semiconductor phase transition
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Improved performance of 4H-SiC metal-semiconductor field-effect transistors with step p-buffer layer
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作者 邓小川 张波 +2 位作者 张有润 王易 李肇基 《Chinese Physics B》 SCIE EI CAS CSCD 2011年第1期584-588,共5页
An improved 4H-SiC metal-semiconductor field-effect transistors (MESFETs) with step p-buffer layer is proposed, and the static and dynamic electrical performances are analysed in this paper. A step p-buffer layer ha... An improved 4H-SiC metal-semiconductor field-effect transistors (MESFETs) with step p-buffer layer is proposed, and the static and dynamic electrical performances are analysed in this paper. A step p-buffer layer has been applied not only to increase the channel current, but also to improve the transconductance. This is due to the fact that the variation in p-buffer layer depth leads to the decrease in parasitic series resistance resulting from the change in the active channel thickness and modulation in the electric field distribution inside the channel. Detailed numerical simulations demonstrate that the saturation drain current and the maximum theoretical output power density of the proposed structure are about 30% and 37% larger than those of the conventional structure. The cut-off frequency and the maximum oscillation frequency of the proposed MESFETs are 14.5 and 62 GHz, respectively, which are higher than that of the conventional structure. Therefore, the 4H-SiC MESFETs with step p-buffer layer have superior direct-current and radio-frequency performances compared to the similar devices based on the conventional structure. 展开更多
关键词 4H-SIC metal-semiconductor field-effect transistors step buffer laver
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Drain-induced barrier lowering effect for short channel dual material gate 4H silicon carbide metal-semiconductor field-effect transistor
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作者 张现军 杨银堂 +3 位作者 段宝兴 柴常春 宋坤 陈斌 《Chinese Physics B》 SCIE EI CAS CSCD 2012年第9期455-459,共5页
Sub-threshold characteristics of the dual material gate 4H-SiC MESFET (DMGFET) are investigated and the analytical models to describe the drain-induced barrier lowering (DIBL) effect are derived by solving one- an... Sub-threshold characteristics of the dual material gate 4H-SiC MESFET (DMGFET) are investigated and the analytical models to describe the drain-induced barrier lowering (DIBL) effect are derived by solving one- and two- dimensional Poisson's equations. Using these models, we calculate the bottom potential of the channel and the threshold voltage shift, which characterize the drain-induced barrier lowering (DIBL) effect. The calculated results reveal that the dual material gate (DMG) structure alleviates the deterioration of the threshold voltage and thus suppresses the DIBL effect due to the introduced step function, which originates from the work function difference of the two gate materials when compared with the conventional single material gate metal-semiconductor field-effect transistor (SMGFET). 展开更多
关键词 silicon carbide metal-semiconductor contact dual material gate
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The Model for Linear Magnetoresistance of Two-Dimensional Metal-Semiconductor Composites with Interfacial Shells
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作者 徐洁 王国栋 +2 位作者 李山东 李强 高小洋 《Chinese Physics Letters》 SCIE CAS CSCD 2015年第9期123-127,共5页
A metal-semiconductor composite with the interracial shells is investigated theoretically for the large linear mag- netoresistance effect of high doping Ag2+δ Se and Ag2+δ te materials. The magnetoresistance (MR... A metal-semiconductor composite with the interracial shells is investigated theoretically for the large linear mag- netoresistance effect of high doping Ag2+δ Se and Ag2+δ te materials. The magnetoresistance (MR) of composites is a function of the magnetic field, temperature, the conductivities of two phases without magnetic field, and the thickness and conductivity of the interracial shells. The MR increases with the increase of the magnetic field and with the decrease of temperature, and no saturation is found even under the high magnetic field. Moreover, it is interestingly found that the interracial shell is an important factor for the MR of the composites. The MR increases with the thickness and the conductivity of the interfacial shells. Lastly, the theoretical results on the MR are compared with the experimental data. It is found that the value of the MR of the composite with the interfacial shell is larger than that without the interfacial shell. 展开更多
关键词 The Model for Linear Magnetoresistance of Two-Dimensional metal-semiconductor Composites with Interfacial Shells Ag MR
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MODELING OF METAL-SEMICONDUCTOR-METAL PHOTODETECTOR
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作者 陈维友 刘式墉 《Journal of Electronics(China)》 1994年第4期377-382,共6页
A complete model of Metal-Semiconductor-Metal Photodetector(MSM-PD) is presented. It can be used in any circuit simulators. Simulated DC characteristics for a GaAs MSM-PD are in good agreement with reported results.
关键词 metal-semiconductor-metal PHOTODETECTOR MODELING COMPUTER-AIDED ANALYSIS
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Metal-Semiconductor Interfaces Investigated by Positron Annihilation Spectroscopy
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作者 Abdulnasser S. Saleh 《World Journal of Condensed Matter Physics》 CAS 2016年第2期68-74,共7页
Variable-energy positron annihilation spectroscopy has been applied to study interfaces in Al/Si, Au/Si and Au/GaAs structures. Computational fittings of ROYPROF program were used to analyze Doppler broadening results... Variable-energy positron annihilation spectroscopy has been applied to study interfaces in Al/Si, Au/Si and Au/GaAs structures. Computational fittings of ROYPROF program were used to analyze Doppler broadening results in order to determine kinds of regions that positrons were likely to sample. The interfaces were found acting as a capturing thin layer with negligible positrons stopped in them and their characteristics came only from positrons diffusing to these interfaces, the positron work function of these materials were taken into consideration. In all fittings, the interfaces are found to have 1 nm thickness and act as an absorbing sink for all thermal positrons diffusing towards them, and this indicates either the existence of open volume defects or a weakness of known theoretical models for positron affinities. The result is supported by measurements obtained by applying external electric fields on Al/Si sample. Theoretical fittings have clearly demonstrated the sensitivity of interfaces in these attempts and their importance in data analyzing and in developing of fitting cods. 展开更多
关键词 Positron Annihilation INTERFACE metal-semiconductor DEFECTS
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Fabrication of Ag@Cu2O core-shell metal-semiconductor nanoparticles and high efficiency photocatalysis under visible- near-infrared light irradiation
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作者 Lele Wang Ailing Yang +1 位作者 Xichang Bao Renqiang Yang 《纳米科技》 2015年第5期43-50,共8页
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Epitaxial growth of metal-semiconductor van der Waals heterostructures NbS2/MoS2 with enhanced performance of transistors and photodetectors 被引量:4
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作者 Peng Zhang Ce Bian +9 位作者 Jiafu Ye Ningyan Chen Xingguo Wang Huaning Jiang Yi Wei Yiwei Zhang Yi Du Lihong Bao Weida Hu Yongji Gong 《Science China Materials》 SCIE EI CSCD 2020年第8期1548-1559,共12页
Two-dimensional(2D)heterostructures based on layered transition metal dichalcogenides(TMDs)have attracted increasing attention for the applications of the nextgeneration high-performance integrated electronics and opt... Two-dimensional(2D)heterostructures based on layered transition metal dichalcogenides(TMDs)have attracted increasing attention for the applications of the nextgeneration high-performance integrated electronics and optoelectronics.Although various TMD heterostructures have been successfully fabricated,epitaxial growth of such atomically thin metal-semiconductor heterostructures with a clean and sharp interface is still challenging.In addition,photodetectors based on such heterostructures have seldom been studied.Here,we report the synthesis of high-quality vertical NbS2/MoS2metallic-semiconductor heterostructures.By using NbS2as the contact electrodes,the field-effect mobility and current on-off ratio of MoS2can be improved at least 6-fold and two orders of magnitude compared with the conventional Ti/Au contact,respectively.By using NbS2as contact,the photodetector performance of MoS2is much improved with higher responsivity and less response time.Such facile synthesis of atomically thin metal-semiconductor heterostructures by a simple chemical vapor deposition strategy and its effectiveness as ultrathin 2D metal contact open the door for the future application of electronics and optoelectronics. 展开更多
关键词 metal-semiconductor heterostructures contact engineering field-effect transistor PHOTODETECTOR
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Ultrathin nanoporous metal-semiconductor heterojunction photoanodes for visible light hydrogen evolution
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作者 Weiqing Zhang Yunfeng Zhao +7 位作者 Kai He Jun Luo Guoliang Li Ruirui Liu Siyu Liu Zhen Cao Pengtao Jing Yi Ding 《Nano Research》 SCIE EI CAS CSCD 2018年第4期2046-2057,共12页
Plasmonic metal-semiconductor nano-heterojuncfions (NHJs), with their superior photocatalytic performance, provide opportunities for the efficient utilization of solar energy. However, scientific significance and te... Plasmonic metal-semiconductor nano-heterojuncfions (NHJs), with their superior photocatalytic performance, provide opportunities for the efficient utilization of solar energy. However, scientific significance and technical challenges remain in the development of suitable metal-semiconductor NHJ photoelectrodes for new generation flexible optoelectronic devices, which often require complex processing. Herein, we report integrated three-dimensional (3D) NHJ photoelectrodes by conformally coating cadmium sulfide (CdS) nanolayers onto ultrathin nano- porous gold (NPG) films via a facile electrodeposition method. Localized surface plasmon resonance (LSPR) of NPG enhances the electron-hole pair generation and separation. Moreover, the direct contact interface and high conductive framework structure of the NHJs boosts the photogenerated carrier separation and transport. Hence, the NHJs exhibit evidently enhanced photocurrent density and hydrogen evolution rate relative to CdS deposited on either gold (Au) foil or fluorine-doped tin oxide (FTO) at 0 V vs. SCE (saturated calomel electrode) under visible-light irradiation. Moreover, they demonstrate a surprisingly stable photoelectrochemical hydrogen evolution (PEC-HE) activity over 104 s of continuous irradiation. 展开更多
关键词 nanoporous gold cadmium sulfide metal-semiconductor heterojunction localized surface plasmon resonance visible light hydrogen evolution DEALLOYING
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Co_(3)O_(4)@SnO_(2)异质结材料的设计构筑及其氢气气敏性能研究
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作者 林孟豪 陈唯一 +3 位作者 王添乐 丁杨 路金达 刘洋 《中国陶瓷》 北大核心 2026年第1期24-32,共9页
电力变压器油中溶解气体气敏检测面临传统气敏材料对低浓度H_(2)的检测灵敏度不足和传感器响应动态范围有限等问题,难以满足变压器早期故障监测的精度要求并会严重影响故障等级的准确判断。基于此,本文采用“分步水热-煅烧法”成功合成... 电力变压器油中溶解气体气敏检测面临传统气敏材料对低浓度H_(2)的检测灵敏度不足和传感器响应动态范围有限等问题,难以满足变压器早期故障监测的精度要求并会严重影响故障等级的准确判断。基于此,本文采用“分步水热-煅烧法”成功合成了Co_(3)O_(4)@SnO_(2)异质结复合材料,通过精确调控半导体氧化物显微结构及其表界面特性,系统研究了微结构对H_(2)气敏性能的增强机制。通过XRD、SEM、XPS等表征结果显示,ZIF-67衍生的Co_(3)O_(4)纳米颗粒均匀地负载于SnO_(2)表面,形成了紧密的p-n异质结界面并显著提升了异质结表面的氧空位浓度。气敏测试表明,在150℃的最佳工作温度下,优化后的Co_(3)O_(4)@SnO_(2)传感器对20 ppm H_(2)表现出较高的响应值(46.7),响应时间为17.2 s,恢复时间为21.6 s,且具备优异的线性和长期稳定性。气敏性能提升归因于异质结内建电场促进了氧吸附/解离动力学及氧空位对H_(2)分子的高效活化作用,为设计和开发高性能金属半导体氧化物基气敏传感器提供了“结构–性能”协同优化策略。 展开更多
关键词 氧空位调控 二氧化锡 四氧化三钴 金属氧化物半导体
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Engineering Colloidal Metal-Semiconductor Nanorods Hybrid Nanostructures for Photocatalysis
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作者 Jiayi Chen Derek Hao +7 位作者 Wei Chen Yazi Liu Zongyou Yin Hsien-Yi Hsu Bing-Jie Ni Aixiang Wang Simon W.Lewis Guohua Jia 《Chinese Journal of Chemistry》 SCIE CAS CSCD 2023年第22期3050-3062,共13页
Emerging engineering strategies of colloidal metal-semiconductor nanorod hybrid nanostructures spanning from type,size,dimension,and location of both metal nanoparticles and semiconductors,co-catalyst,band gap structu... Emerging engineering strategies of colloidal metal-semiconductor nanorod hybrid nanostructures spanning from type,size,dimension,and location of both metal nanoparticles and semiconductors,co-catalyst,band gap structure,surface ligand to hole scavenger are elaborated symmetrically to rationalize the design of this type of intriguing materials for efficient photocatalytic applications. 展开更多
关键词 Hybrid nanostructure metal-semiconductor nanorod Engineering strategy PHOTOCATALYSIS Hydrogen production
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sp^(2) to sp^(3) hybridization transformation in 2D metal-semiconductor contact interface suppresses tunneling barrier and Fermi level pinning simultaneously
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作者 Wenchao Shan Anqi Shi +4 位作者 Zhuorong Zhong Xiuyun Zhang Bing Wang Yongtao Li Xianghong Niu 《Nano Research》 SCIE EI CSCD 2024年第11期10227-10234,共8页
Van der Waals (vdWs) stacking of two-dimensional (2D) materials can effectively weaken the Fermi level pinning (FLP) effect in metal/semiconductor contacts due to dangling-bond-free surfaces. However, the inherent vdW... Van der Waals (vdWs) stacking of two-dimensional (2D) materials can effectively weaken the Fermi level pinning (FLP) effect in metal/semiconductor contacts due to dangling-bond-free surfaces. However, the inherent vdWs gap always induces a considerable tunneling barrier, significantly limiting carrier injection. Herein, by inducing a sp^(2) to sp^(3) hybridization transformation in 2D carbon-based metal via surface defect engineering, the large orbital overlap can form an efficient carrier channel, overcoming the tunneling barrier. Specifically, by selecting the 2D carbon-based X_(3)C_(2) (X = Cd, Hg, and Zn) metal and the 2D MSi_(2)N_(4) (M = Cr, Hf, Mo, Ti, V, and Zr) semiconductor, we constructed 36 metal/semiconductor contacts. For vdWs contacts, although Ohmic contacts can be formed at the interface, the highest tunneling probability (P TB) is only 3.11%. As expected, the P TB can be significantly improved, as high as 48.73%, when MSi_(2)N_(4), accompanied by surface nitrogen vacancies, forms an interface covalent bond with X_(3)C_(2). Simultaneously, weak FLP and Ohmic contact remain at the covalent-bond-based surface, attributing to the protection of the MSi_(2)N_(4) band-edge electronic states by the outlying Si-N sublayer. Our work provides a promising path for advancing the progress of 2D electronic and photoelectronic devices. 展开更多
关键词 two-dimensional(2D)material metal-semiconductor contacts tunneling-barrier Schottky barrier density functional theory
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氧化温度与NO退火组分协同优化提升SiC MOSFET界面特性与器件性能
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作者 刘玮 陈刚 +4 位作者 夏云 桂雅雯 陈昱 田佳民 杜融鑫 《微纳电子技术》 2026年第1期104-109,共6页
针对碳化硅(SiC)金属-氧化物-半导体场效应晶体管(MOSFET)中SiC/SiO2界面态密度偏高、迁移率低、栅氧击穿场强退化与阈值电压不稳定问题,系统研究了氧化温度、NO退火组分对界面特性及器件性能的调控机制。通过设计三组对比实验(氧化温度... 针对碳化硅(SiC)金属-氧化物-半导体场效应晶体管(MOSFET)中SiC/SiO2界面态密度偏高、迁移率低、栅氧击穿场强退化与阈值电压不稳定问题,系统研究了氧化温度、NO退火组分对界面特性及器件性能的调控机制。通过设计三组对比实验(氧化温度1200~1350℃;退火温度1250~1300℃;NO组分10%~100%),制备金属-氧化物-半导体(MOS)电容、平面MOSFET及横向MOSFET。电学表征与物性分析发现:温度升至1300℃可抑制界面碳团簇,阈值电压负漂移率改善44%,但1350℃工艺因氧空位增多导致栅氧反向击穿场强下降7%;10%NO退火较100%NO显著提升场效应迁移率38%,这源于氮原子对界面悬挂键的高效钝化。在最优工艺(1300℃氧化温度结合1300℃/10%NO退火)条件下,器件综合性能最优:栅氧正向击穿场强9.65 MV/cm、迁移率14.4 cm^(2)/(V·s)、阈值电压负漂移率-9%。本研究为SiC MOSFET栅氧工艺提供了明确的参数窗口与机理解释。 展开更多
关键词 SiC金属-氧化物-半导体(MOS)电容 SiC横向金属-氧化物-半导体场效应晶体管(MOSFET) 栅氧工艺 场效应迁移率 栅氧击穿场强 阈值电压漂移
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CMOS低噪声高响应度太赫兹探测器线阵电路设计
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作者 徐雷钧 马宇杰 +2 位作者 黄磊 白雪 陈建锋 《半导体技术》 北大核心 2025年第3期296-303,共8页
为了进一步提高电压响应度和探测成像速度,降低噪声等效功率,基于0.18μm CMOS工艺设计了一种低噪声高响应度太赫兹探测器线阵电路,提出了一种由自混频功率探测电路、电压缓冲级、运算放大器组成的1×4太赫兹阵列结构。通过源极差... 为了进一步提高电压响应度和探测成像速度,降低噪声等效功率,基于0.18μm CMOS工艺设计了一种低噪声高响应度太赫兹探测器线阵电路,提出了一种由自混频功率探测电路、电压缓冲级、运算放大器组成的1×4太赫兹阵列结构。通过源极差分驱动的自混频功率探测电路将辐射信号耦合至场效应管的栅极和源极,实现高响应度。通过电压缓冲级降低总体噪声,通过运算放大器有效放大探测信号。探测器线阵电路面积为0.8 mm^(2)。测试结果表明,当偏置电压为0.5 V时,该探测系统对0.37 THz辐射信号的电压响应度最大可达441 kV/W,对应的最小噪声等效功率为48 pW/Hz^(1/2)。相比单像素探测器,该探测器阵列可有效提升探测成像速度;相比传统的探测器阵列,该探测器阵列具有更优的性能参数。 展开更多
关键词 互补金属氧化物半导体(CMOS) 太赫兹 探测器 高响应度 低噪声
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提高金属氧化物半导体气体传感器抗湿稳定性的方法研究
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作者 刘新宽 邓志祥 +1 位作者 吴郅轩 孙艳 《有色金属材料与工程》 2025年第1期57-66,共10页
测试环境中的水汽会干扰金属氧化物半导体气敏材料的气敏反应,导致基线电阻漂移、响应灵敏度降低等问题,从而显著影响传感器对目标气体的检测。对水汽干扰气体传感器气敏反应的机制进行了简要阐述,重点对当前抗湿检测的思路进行了归纳... 测试环境中的水汽会干扰金属氧化物半导体气敏材料的气敏反应,导致基线电阻漂移、响应灵敏度降低等问题,从而显著影响传感器对目标气体的检测。对水汽干扰气体传感器气敏反应的机制进行了简要阐述,重点对当前抗湿检测的思路进行了归纳总结。当前较为广泛开发的抗湿检测思路包括筛滤作用、捕水作用、传感器表面调控3大类,不同抗湿思路的组合可实现金属氧化物半导体气敏材料抗湿维稳和响应性能的同步提升。 展开更多
关键词 金属氧化物半导体 抗湿性能 吸附氧 气体传感器
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基于离心铸造法制备的CsPbBr_(3)多晶薄膜及其光电性能 被引量:2
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作者 云文磊 郭喜涛 +1 位作者 冯林 邓文娟 《半导体技术》 北大核心 2025年第4期358-364,共7页
金属卤化物钙钛矿因具有优异的光电特性,被广泛应用于光电探测器。然而,溶液法制备钙钛矿多晶薄膜的工艺复杂,且薄膜的连续性和致密度不高,进而影响其光电性能。使用溶液处理离心铸造法快速制备了连续且致密的CsPbBr_(3)多晶薄膜,采用... 金属卤化物钙钛矿因具有优异的光电特性,被广泛应用于光电探测器。然而,溶液法制备钙钛矿多晶薄膜的工艺复杂,且薄膜的连续性和致密度不高,进而影响其光电性能。使用溶液处理离心铸造法快速制备了连续且致密的CsPbBr_(3)多晶薄膜,采用叉指金电极构建了金属-半导体-金属结构的CsPbBr_(3)微米晶薄膜光电探测器。利用离心力增强CsPbBr_(3)微米晶粒之间的接触,形成连续且致密的高质量薄膜,最终有效地提升了CsPbBr_(3)多晶薄膜光电探测器的性能。所制备的光电探测器表现出出色的弱光电探测能力,在520 nm波长光源照射下,器件的光响应度和比探测率分别达到525 mA/W和2.8×10^(12)Jones。研究结果表明,通过离心铸造法能够有效地提高溶液处理的钙钛矿多晶薄膜的质量,进而提升其光电器件性能。 展开更多
关键词 金属卤化物钙钛矿 离心铸造法 金属-半导体-金属结构 CsPbBr_(3)多晶薄膜 光电探测器
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Current-voltage characteristics simulation and analysis of 4H-SiC metal-semiconductor-metal ultraviolet photodetectors 被引量:1
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作者 张军琴 杨银堂 +1 位作者 娄利飞 赵妍 《Chinese Optics Letters》 SCIE EI CAS CSCD 2008年第8期615-618,共4页
The current-voltage (I-V) characteristics of 4H-SiC metal-semiconductor-metal (MSM) ultraviolet photodetector with different finger widths and spacings, different carrier concentrations and thicknesses of n-type e... The current-voltage (I-V) characteristics of 4H-SiC metal-semiconductor-metal (MSM) ultraviolet photodetector with different finger widths and spacings, different carrier concentrations and thicknesses of n-type epitaxial layer are simulated. The simulation results indicate that the dark current and the photocurrent both increase when the finger width increases. But the effect of finger width on the dark current is more significant. On the other hand, the effect of finger spacing on the photocurrent is more significant. When the finger spacing increases, the photocurrent decreases and the dark current is almost changeless. In addition, it is found that the smaller the carrier concentration of n-type epitaxial layer is, the smaller the dark current and the larger the photocurrent will be. It is also found that I-V characteristics of MSM detector also depend on the epitaxial layer thickness. The dark current of detector is smaller and the photocurrent is larger when the epitaxial layer thickness is about 3μm. 展开更多
关键词 Bioactivity Carrier concentration Civil aviation Concentration (process) Electric conductivity Epitaxial layers Markov processes METALS Molecular beam epitaxy Optoelectronic devices PHOTOCURRENTS PHOTODETECTORS Semiconductor materials Silicon carbide
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175℃下比导通电阻3.8 mΩ·cm^(2)的1200 V SiC MOSFET 被引量:1
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作者 刘佳佳 张力江 +1 位作者 周国 付兴中 《电力电子技术》 2025年第8期137-140,共4页
针对光伏逆变、电动汽车、电源管理等领域对高功率高可靠性碳化硅(SiC)金属-氧化物-半导体型场效应管(MOSFET)器件的需求,开展了SiC MOSFET器件设计技术研究,研制出结温25℃下比导通电阻2.7 mΩ·cm^(2)、反向漏电流小于1µA的1... 针对光伏逆变、电动汽车、电源管理等领域对高功率高可靠性碳化硅(SiC)金属-氧化物-半导体型场效应管(MOSFET)器件的需求,开展了SiC MOSFET器件设计技术研究,研制出结温25℃下比导通电阻2.7 mΩ·cm^(2)、反向漏电流小于1µA的1200 V/13 mΩSiC MOSFET,在175℃的应力条件下,比导通电阻为3.8 mΩ·cm^(2),显示出良好的温度稳定性。器件在漏源电压1500 V时,漏源漏电流小于1µA。在环境温度175℃的应力条件下,器件完成了1000 h的高温可靠性验证,阈值电压漂移量小于0.3 V,展现出良好的高温可靠性。 展开更多
关键词 金属-氧化物-半导体型场效应管 碳化硅 比导通电阻
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金-银合金的制备及其热电子注入效率研究
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作者 张震 尹鹏飞 +1 位作者 菅傲群 桑胜波 《太原理工大学学报》 北大核心 2025年第6期1234-1239,共6页
【目的】负载贵金属(Au、Ag等)拓宽了半导体材料的光吸收范围,但单一贵金属存在稳定性差、热电子注入效率低等问题,限制了其应用范围及效能。制备Au-Ag合金能够结合Au和Ag的优势,并且可以通过改变成分来调控性能,具有简单、灵活、高性... 【目的】负载贵金属(Au、Ag等)拓宽了半导体材料的光吸收范围,但单一贵金属存在稳定性差、热电子注入效率低等问题,限制了其应用范围及效能。制备Au-Ag合金能够结合Au和Ag的优势,并且可以通过改变成分来调控性能,具有简单、灵活、高性能的特点。了解Au-Ag合金的成分对其光学特性及热电子注入效率的影响在光催化、光电化学传感等方面具有重要作用。【方法】通过高温退火的方法在TiO_(2)薄膜表面制备了Au-Ag合金纳米颗粒,通过改变磁控溅射镀膜的厚度来控制合金中各元素的含量。制备了三种不同比例的Au-Ag/TiO_(2)/Au复合结构,这种三明治夹层结构能够有效增强光吸收。通过UV-Vis以及开尔文探针力显微镜研究了薄膜的光学吸收特性及热电子注入效率。【结果】结果表明合金中Ag元素含量增大会使其吸收峰蓝移并且会提高热电子注入效率。验证了Au-Ag合金的制备及可控调节,为高性能光催化材料及高灵敏度可调控光电化学传感电极的制备提供了参考。 展开更多
关键词 Au-Ag合金 局域表面等离子体共振 金半接触电势差 开尔文探针力显微镜
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β-Ga_(2)O_(3)基MSM型日盲紫外光电探测器高温电流输运机制的研究
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作者 杜桐 付俊杰 +6 位作者 王紫石 狄静 陶春雷 张赫之 张琦 胡锡兵 梁红伟 《人工晶体学报》 北大核心 2025年第2期319-328,共10页
本文成功制备了β-Ga_(2)O_(3)基金属半导体金属(MSM)型日盲紫外光电探测器。在室温下偏压为5 V时,具有高质量外延的器件的响应度达到469.6 mA/W(对应外量子效率(EQE)为229.2%),光暗电流比为5.26×10^(3)。为了研究β-Ga_(2)O_(3)基... 本文成功制备了β-Ga_(2)O_(3)基金属半导体金属(MSM)型日盲紫外光电探测器。在室温下偏压为5 V时,具有高质量外延的器件的响应度达到469.6 mA/W(对应外量子效率(EQE)为229.2%),光暗电流比为5.26×10^(3)。为了研究β-Ga_(2)O_(3)基MSM型日盲紫外光电探测器在高温环境下的潜在应用,对该器件在高温下的电流-电压(I-V)和光响应(I-T)特性进行了测试,分析器件在高温下的载流子输运机制。结果表明:在300~375 K时,器件的暗电流主要由低压下的热离子场发射(TFE)和高压下的普尔-弗兰克发射(PFE)主导,由PFE模型拟合的I-V曲线可知,PFE由导带下的0.200 eV附近的缺陷引起;根据光响应特性拟合结果,得到上升时间拟合活化能为0.280 eV,下降时间拟合活化能为0.036 eV。由分析结果可知,光电流的输运过程如下:光生电子首先被导带下0.200~0.280 eV附近的缺陷能级捕获并通过PFE发射进入到导带产生光电流。光生载流子的复合过程为:光电子更倾向于被导带下的0.036 eV附近的缺陷能级捕获,进而与价带中的光生空穴复合。 展开更多
关键词 β-Ga_(2)O_(3) 金属半导体金属 日盲紫外光电探测器 热离子场发射 普尔-弗兰克发射 缺陷
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