In this paper, a micro water dissolution machining （MWDM） principle is proposed for machining potassium dihydrogen phosphate （KDP） crystal using water-in-oil micro-emulsion as an abrasive-free polishing fluid. In ...In this paper, a micro water dissolution machining （MWDM） principle is proposed for machining potassium dihydrogen phosphate （KDP） crystal using water-in-oil micro-emulsion as an abrasive-free polishing fluid. In addition, two instances of the application of this principle to ultra-precision machining of KDP crystals are presented. Computer-controlled optical surfacing （CCOS） and diamond wire cutting （DWC） process were carried out according to the MWDM principle. In the case of the CCOS technology, it is found that the micro-waviness was removed completely by following the MWDM principle. The surface undulation decreased from 40 nm to less than 10 nm, and the surface root-mean-square （rms） roughness obviously reduced from 8.147 to 2.660 nm. In the case of the DWC process, the surface rms roughness reduced from 8.012 to 2.391 gm, and the cutting efficiency was improved. These results indicate that the MWDM principle can efficiently improve the machining quality of KDP optical crystal and has a great potential to machine water-soluble materials.展开更多
基金supported by the National Natural Science Foundation of China(Grant No.51135002)Science Fund for Creative Research Groups(Grant No.51321004)
文摘In this paper, a micro water dissolution machining （MWDM） principle is proposed for machining potassium dihydrogen phosphate （KDP） crystal using water-in-oil micro-emulsion as an abrasive-free polishing fluid. In addition, two instances of the application of this principle to ultra-precision machining of KDP crystals are presented. Computer-controlled optical surfacing （CCOS） and diamond wire cutting （DWC） process were carried out according to the MWDM principle. In the case of the CCOS technology, it is found that the micro-waviness was removed completely by following the MWDM principle. The surface undulation decreased from 40 nm to less than 10 nm, and the surface root-mean-square （rms） roughness obviously reduced from 8.147 to 2.660 nm. In the case of the DWC process, the surface rms roughness reduced from 8.012 to 2.391 gm, and the cutting efficiency was improved. These results indicate that the MWDM principle can efficiently improve the machining quality of KDP optical crystal and has a great potential to machine water-soluble materials.
