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AlGaN/GaN MISHEMTs with Sodium-Beta-Alumina as the Gate Dielectrics
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作者 TIAN Ben-Lang CHEN Chao +2 位作者 ZHANG Ji-Hua ZHANG Wan-Li LIU Xing-Zhao 《Chinese Physics Letters》 SCIE CAS CSCD 2013年第2期169-173,共5页
AlGaN/GaN metal-insulator-semiconductor high-electron-mobility transistors(MISHEMTs)with sodium beta-alumina(SBA)thin films as the gate dielectrics are studied.AlGaN/GaN metal-semiconductor high-electron-mobility tran... AlGaN/GaN metal-insulator-semiconductor high-electron-mobility transistors(MISHEMTs)with sodium beta-alumina(SBA)thin films as the gate dielectrics are studied.AlGaN/GaN metal-semiconductor high-electron-mobility transistors(MESHEMTs)and MISHEMTs with Al_(2)O_(3) thin-film gate dielectrics are also fabricated for comparative study.The MISHEMTs with SBA gate dielectrics show nearly four orders of magnitude lower gate leakage current and an approximately 60%increase in maximum transconductance,indicating that SBA can serve as an effective dielectric for AlGaN/GaN MISHEMTs.However,SBA gate dielectrics result in threshold voltage modulation of AlGaN/GaN MISHEMTs.Compared with those of AlGaN/GaN MESHEMTs,the threshold voltages of AlGaN/GaN MISHEMTs with Al_(2)O_(3) gate dielectrics shift negatively from-5.5 V to-7.5 V.In contrast with the normally used gate dielectrics,the threshold voltages of MISHEMTs with SBA gate dielectrics shift positively from-5.5 V to-3.5 V.Based on an x-ray photoelectron spectrum study and energy band spectrum calculation,the primary mechanism of the threshold voltage modulation is attributed to the decrease in the surface valence-band maximum and the increase in the barrier height by SBA gate dielectrics. 展开更多
关键词 ALGAN/GAN MISHEMT HEMTS
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IMEC利用CMOS工艺制程GaN MISHEMTs
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作者 吴琪乐 《半导体信息》 2011年第4期8-8,共1页
欧洲微电子研究中心(Interuniversity Microelectronics Cent。即IMEC)与其合作伙伴共同开发了在200mm硅芯片上生长GaN/AlGaN的技术。借助这项新技术,GaN MISHEMTs(metal-insulator semiconductor highelectron mobility transistors,... 欧洲微电子研究中心(Interuniversity Microelectronics Cent。即IMEC)与其合作伙伴共同开发了在200mm硅芯片上生长GaN/AlGaN的技术。借助这项新技术,GaN MISHEMTs(metal-insulator semiconductor highelectron mobility transistors,无金属高电子迁移率晶体管)能够严格按照CMOS(Complementary Metal Oxide Semiconductor,互补金属氧化物半导体) 展开更多
关键词 ALGAN 硅芯片 工艺制程 Complementary CMOS工艺 GAN mishemts IMEC INSULATOR 研究中心 兼容问题
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基于自支撑GaN和蓝宝石衬底AlGaN/GaN MISHEMT器件对比
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作者 李淑萍 孙世闯 张宝顺 《微纳电子技术》 北大核心 2017年第11期734-739,共6页
通过金属有机化学气相沉积(MOCVD)法,在氢化物气相外延(HVPE)自支撑GaN衬底和蓝宝石(0001)衬底上外延生长AlGaN/AlN/GaN结构的高电子迁移率晶体管(HEMT)材料,采用低压化学气相沉积SiN_x作为栅介质层,形成金属绝缘半导体高电子迁移率晶体... 通过金属有机化学气相沉积(MOCVD)法,在氢化物气相外延(HVPE)自支撑GaN衬底和蓝宝石(0001)衬底上外延生长AlGaN/AlN/GaN结构的高电子迁移率晶体管(HEMT)材料,采用低压化学气相沉积SiN_x作为栅介质层,形成金属绝缘半导体高电子迁移率晶体管(MISHEMT)结构,对比研究了两种器件的材料性能和电学特性。阴极发光测试表明HVPE的自支撑GaN衬底缺陷密度可降至6×10~5 cm^(-2)量级。自支撑GaN衬底上AlGaN/GaN HEMT结构具有良好的表面形貌,其表面粗糙度R_a仅为0.51 nm,具有较大的源漏电极饱和电流I_(DS)=378 mA/mm和较高跨导G_m=47 mS/mm。动态导通电阻测试进一步表明,自支撑GaN衬底上同质外延生长的GaN缓冲层具有低缺陷密度,使AlGaN/GaN MISHEMT电流崩塌特性得到抑制。 展开更多
关键词 氢化物气相外延(HVPE)GaN衬底 金属有机化学气相沉积(MOcVD) AlGaN/ GaN金属绝缘半导体高电子迁移率晶体管(MIsHEMT) 同质外延 电流崩塌
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Sodium beta-alumina thin films as gate dielectrics for AlGaN/GaN metal-insulator-semiconductor high-electron-mobility transistors 被引量:3
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作者 田本朗 陈超 +2 位作者 李言荣 张万里 刘兴钊 《Chinese Physics B》 SCIE EI CAS CSCD 2012年第12期335-339,共5页
Sodium beta-alumina (SBA) is deposited on A1GaN/GaN by using a co-deposition process with sodium and Al2O3 as the precursors. The X-ray diffraction (XRD) spectrum reveals that the deposited thin film is amorphous.... Sodium beta-alumina (SBA) is deposited on A1GaN/GaN by using a co-deposition process with sodium and Al2O3 as the precursors. The X-ray diffraction (XRD) spectrum reveals that the deposited thin film is amorphous. The binding energy and composition of the deposited thin film, obtained from the X-ray photoelectron spectroscopy (XPS) measurement, are consistent with those of SBA. The dielectric constant of the SBA thin film is about 50. Each of the capacitance voltage characteristics obtained at five different frequencies shows a high-quality interface between SBA and A1GaN. The interface trap density of metal-insulator-semiconductor high-electron-mobility transistor (MISHEMT) is measured to be (3.5-9.5)× 10^10 cm-2.eV-1 by the conductance method. The fixed charge density of SBA dielectric is on the order of 2.7× 1012 cm-2. Compared with the A1GaN/GaN metal-semiconductor heterostructure high-electron- mobility transistor (MESHEMT), the A1GaN/GaN MISHEMT usually has a threshold voltage that shifts negatively. However, the threshold voltage of the A1GaN/GaN MISHEMT using SBA as the gate dielectric shifts positively from -5.5 V to -3.5 V. From XPS results, the surface valence-band maximum (VBM-EF) of A1GaN is found to decrease from 2.56 eV to 2.25 eV after the SBA thin film deposition. The possible reasons why the threshold voltage of A1GaN/GaN MISHEMT with the SBA gate dielectric shifts positively are the influence of SBA on surface valence-band maximum (VBM-EF), the reduction of interface traps and the effects of sodium ions, and/or the fixed charges in SBA on the two-dimensional electron gas (2DEG). 展开更多
关键词 sodium beta-alumina A1GAN/GAN MESHEMT MISHEMT
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采用AlN绝缘栅的AlGaN/GaN凹栅槽结构MISHEMT器件
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作者 黄俊 张宗贤 +4 位作者 黄峰 魏珂 刘新宇 郝跃 张进诚 《科技创新导报》 2012年第4期6-8,共3页
本文通过射频磁控反应溅射实现高质量的AlN绝缘栅层,采用感应耦合等离子体(ICP)刻蚀出凹栅槽结构,将MIS结构和凹栅槽结构的优点相结合,研制成功AlGaN/GaN凹栅槽结构MIS HEMT器件,在提高器件栅控能力的同时,降低栅极漏电,提高击穿电压。... 本文通过射频磁控反应溅射实现高质量的AlN绝缘栅层,采用感应耦合等离子体(ICP)刻蚀出凹栅槽结构,将MIS结构和凹栅槽结构的优点相结合,研制成功AlGaN/GaN凹栅槽结构MIS HEMT器件,在提高器件栅控能力的同时,降低栅极漏电,提高击穿电压。器件栅长0.8μm,栅宽60μm,测得栅压为+5V时最大饱和输出电流为832mA/mm,最大跨导达到210mS/mm,栅压为-15V时栅极反向漏电为6nA/mm。 展开更多
关键词 ALGAN/GAN 凹栅槽 ALN MISHEMT
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The improvement of Al_2O_3 /AlGaN/GaN MISHEMT performance by N_2 plasma pretreatment 被引量:1
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作者 冯倩 田园 +5 位作者 毕志伟 岳远征 倪金玉 张进成 郝跃 杨林安 《Chinese Physics B》 SCIE EI CAS CSCD 2009年第7期3014-3017,共4页
This paper discusses the effect of N2 plasma treatment before dielectric deposition on the electrical performance of a Al203/AlGaN/GaN metal-insulator-semiconductor high electron mobility transistor (MISHEMT),with A... This paper discusses the effect of N2 plasma treatment before dielectric deposition on the electrical performance of a Al203/AlGaN/GaN metal-insulator-semiconductor high electron mobility transistor (MISHEMT),with Al203 deposited by atomic layer deposition.The results indicated that the gate leakage was decreased two orders of magnitude after the Al203/AlGaN interface was pretreated by N2 plasma.Furthermore,effects of N2 plasma pretreatrnent on the electrical properties of the AlGaN/Al2O3 interface were investigated by x-ray photoelectron spectroscopy measurements and the interface quality between Al203 and AlGaN film was improved. 展开更多
关键词 Al2O3/AlGaN/GaN MISHEMT atomic layer deposition N2 plasma pretreatment
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Performance of an AlGaN/GaN MISHEMT with sodium beta-alumina for gate insulation and surface passivation
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作者 田本朗 陈超 +1 位作者 张万里 刘兴钊 《Journal of Semiconductors》 EI CAS CSCD 2013年第9期45-48,共4页
An A1GaN/GaN metal-insulator-semiconductor high-electron-mobility transistor (MISHEMT), with sodium beta-alumina (SBA) for both gate insulation and surface passivation, was investigated and compared with a convent... An A1GaN/GaN metal-insulator-semiconductor high-electron-mobility transistor (MISHEMT), with sodium beta-alumina (SBA) for both gate insulation and surface passivation, was investigated and compared with a conventional metal-semiconductor high-electron-mobility transistor (MESHEMT). The measured gate leakage current of the MISHEMT was reduced by approximately one order of magnitude as compared with that of the con- ventional MESHEMT. The saturation drain current of the A1GaN/GaN MISHEMT reached 830 mA/mm, which was about 43% higher than that of a conventional MESHEMT. The peak extrinsic transconductance of the MISHEMT was 103 mS/mm, which was similarly higher than that of the MESHEMT. The results suggested that the SBA thin film is an effective candidate gate dielectric for AIGaN/GaN MISHEMTs. 展开更多
关键词 SBA A1GAN/GAN MESHEMT MISHEMT
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