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QUICK ASSESSMENT METHODOLOGY FOR RELIABILITY OF SOLDER JOINTS IN BALL GRID ARRAY(BGA)ASSEMBLY——PART Ⅱ:RELIABILITY EXPERIMENT AND NUMERICAL SIMULATION 被引量:1
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作者 史训清 John HL Pang +2 位作者 杨前进 王志平 聂景旭 《Acta Mechanica Sinica》 SCIE EI CAS CSCD 2002年第4期356-367,共12页
In the present study,a facility,i.e.,a mechanical deflection system (MDS),was established and applied to assess the long-term reliability of the solder joints in plastic ball grid array (BGA) assembly.It was found tha... In the present study,a facility,i.e.,a mechanical deflection system (MDS),was established and applied to assess the long-term reliability of the solder joints in plastic ball grid array (BGA) assembly.It was found that the MDS not only quickly assesses the long-term reliability of solder joints within days,but can also mimic similar failure mechanisms in accelerated thermal cycling (ATC) tests. Based on the MDS and ATC reliability experiments,the acceleration factors (AF) were obtained for different reliability testing conditions.Furthermore,by using the creep constitutive relation and fatigue life model developed in part I,a numerical approach was established for the purpose of virtual life prediction of solder joints. The simulation results were found to be in good agreement with the test results from the MDS.As a result,a new reliability assessment methodology was established as an alternative to ATC for the evaluation of long-term reliability of plastic BGA assembly. 展开更多
关键词 long-term reliability plastic BGA assembly mds reliability experiment FE numerical simulation acceleration factor
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