As a core power device in strategic industries such as new energy power generation and electric vehicles,the thermal reliability of IGBT modules directly determines the performance and lifetime of the whole system.A s...As a core power device in strategic industries such as new energy power generation and electric vehicles,the thermal reliability of IGBT modules directly determines the performance and lifetime of the whole system.A synergistic optimization structure of“inlet plate-channel spoiler columns”is proposed for the local hot spot problem during the operation of Insulated Gate Bipolar Transistor(IGBT),combined with the inherent defect of uneven flow distribution of the traditional U-type liquid cooling plate in this paper.The influences of the shape,height(H),and spacing from the spoiler column(b)of the plate on the comprehensive heat dissipation performance of the liquid cooling plate are analyzed at different Reynolds numbers,A dual heat source strategy is introduced and the effect of the optimized structure is evaluated by the temperature inhomogeneity coefficient(Φ).The results show that the optimum effect is achieved when the shape of the plate is square,H=4.5 mm,b=2 mm,and u=0.05 m/s,at which the HTPE=1.09 and Φ are reduced by 40%.In contrast,the maximum temperatures of the IGBT and the FWD(Free Wheeling Diode)chips are reduced by 8.7 and 8.4 K,respectively,and ΔP rises by only 1.58 Pa while keeping ΔT not significantly increased.This optimized configuration achieves a significant reduction in the critical chip temperature and optimization of the flow field uniformity with almost no change in the system flow resistance.It breaks through the limitation of single structure optimization of the traditional liquid cooling plate and effectively solves the problem of uneven flow in the U-shaped cooling plate,which provides a new solution with important engineering value for the thermal management of IGBT modules.展开更多
In this study, a microchannel liquid cooling plate (LCP) is proposed for Intel Xeon 52.5 mm * 45 mm packaged architecture processors based on topology optimization (TO). Firstly, a mathematical model for topology opti...In this study, a microchannel liquid cooling plate (LCP) is proposed for Intel Xeon 52.5 mm * 45 mm packaged architecture processors based on topology optimization (TO). Firstly, a mathematical model for topology optimization design of the LCP is established based on heat dissipation and pressure drop objectives. We obtain a series of two-dimensional (2D) topology optimization configurations with different weighting factors for two objectives. It is found that the biomimetic phenomenon of the topologically optimized flow channel structure is more pronounced at low Reynolds numbers. Secondly, the topology configuration is stretched into a three-dimensional (3D) model to perform CFD simulations under actual operating conditions. The results show that the thermal resistance and pressure drop of the LCP based on topology optimization achieve a reduction of approximately 20% - 50% compared to traditional serpentine and microchannel straight flow channel structures. The Nusselt number can be improved by up to 76.1% compared to microchannel straight designs. Moreover, it is observed that under high flow rates, straight microchannel LCPs exhibit significant backflow, vortex phenomena, and topology optimization structures LCPs also tend to lead to loss of effectiveness in the form of tree root-shaped branch flows. Suitable flow rate ranges for LCPs are provided. Furthermore, the temperature and pressure drop of experimental results are consistent with the numerical ones, which verifies the effectiveness of performance for topology optimization flow channel LCP.展开更多
To ensure the battery works in a suitable temperature range,a new design for distributed liquid cooling plate is proposed,and a battery thermal management system(BTMS)for cylindrical power battery pack based on the pr...To ensure the battery works in a suitable temperature range,a new design for distributed liquid cooling plate is proposed,and a battery thermal management system(BTMS)for cylindrical power battery pack based on the proposed cooling plate is also investigated.To verify the accuracy of the battery model and battery pack numerical calculation model used for simulation,an experiment is conducted for the liquid cooling BTMS.The influence of key working parameters,including the cooling water inlet flow,ambient temperature and working conditions,are investigated.The results show that at the discharge rate of 3 C,the best cooling performance can be achieved when the total inlet mass flow rate is 3.2 g/s and the flow distribution is 3:1:1:3.The obtained maximum temperature is 29.6℃ and the maximum temperature difference is 2.1℃.When the ambient temperature is in the range of 20℃ to 50℃,the proposed BTMS can keep the temperature of battery pack in the proper range.Finally,different inlet flow rates are recommended according to different battery working states.展开更多
基金supported by Tianjin Science and Technology Planning Project(22YDTPJC0020).
文摘As a core power device in strategic industries such as new energy power generation and electric vehicles,the thermal reliability of IGBT modules directly determines the performance and lifetime of the whole system.A synergistic optimization structure of“inlet plate-channel spoiler columns”is proposed for the local hot spot problem during the operation of Insulated Gate Bipolar Transistor(IGBT),combined with the inherent defect of uneven flow distribution of the traditional U-type liquid cooling plate in this paper.The influences of the shape,height(H),and spacing from the spoiler column(b)of the plate on the comprehensive heat dissipation performance of the liquid cooling plate are analyzed at different Reynolds numbers,A dual heat source strategy is introduced and the effect of the optimized structure is evaluated by the temperature inhomogeneity coefficient(Φ).The results show that the optimum effect is achieved when the shape of the plate is square,H=4.5 mm,b=2 mm,and u=0.05 m/s,at which the HTPE=1.09 and Φ are reduced by 40%.In contrast,the maximum temperatures of the IGBT and the FWD(Free Wheeling Diode)chips are reduced by 8.7 and 8.4 K,respectively,and ΔP rises by only 1.58 Pa while keeping ΔT not significantly increased.This optimized configuration achieves a significant reduction in the critical chip temperature and optimization of the flow field uniformity with almost no change in the system flow resistance.It breaks through the limitation of single structure optimization of the traditional liquid cooling plate and effectively solves the problem of uneven flow in the U-shaped cooling plate,which provides a new solution with important engineering value for the thermal management of IGBT modules.
文摘In this study, a microchannel liquid cooling plate (LCP) is proposed for Intel Xeon 52.5 mm * 45 mm packaged architecture processors based on topology optimization (TO). Firstly, a mathematical model for topology optimization design of the LCP is established based on heat dissipation and pressure drop objectives. We obtain a series of two-dimensional (2D) topology optimization configurations with different weighting factors for two objectives. It is found that the biomimetic phenomenon of the topologically optimized flow channel structure is more pronounced at low Reynolds numbers. Secondly, the topology configuration is stretched into a three-dimensional (3D) model to perform CFD simulations under actual operating conditions. The results show that the thermal resistance and pressure drop of the LCP based on topology optimization achieve a reduction of approximately 20% - 50% compared to traditional serpentine and microchannel straight flow channel structures. The Nusselt number can be improved by up to 76.1% compared to microchannel straight designs. Moreover, it is observed that under high flow rates, straight microchannel LCPs exhibit significant backflow, vortex phenomena, and topology optimization structures LCPs also tend to lead to loss of effectiveness in the form of tree root-shaped branch flows. Suitable flow rate ranges for LCPs are provided. Furthermore, the temperature and pressure drop of experimental results are consistent with the numerical ones, which verifies the effectiveness of performance for topology optimization flow channel LCP.
基金supported by the National Natural Science Foundation of China(Grant No.52076163)。
文摘To ensure the battery works in a suitable temperature range,a new design for distributed liquid cooling plate is proposed,and a battery thermal management system(BTMS)for cylindrical power battery pack based on the proposed cooling plate is also investigated.To verify the accuracy of the battery model and battery pack numerical calculation model used for simulation,an experiment is conducted for the liquid cooling BTMS.The influence of key working parameters,including the cooling water inlet flow,ambient temperature and working conditions,are investigated.The results show that at the discharge rate of 3 C,the best cooling performance can be achieved when the total inlet mass flow rate is 3.2 g/s and the flow distribution is 3:1:1:3.The obtained maximum temperature is 29.6℃ and the maximum temperature difference is 2.1℃.When the ambient temperature is in the range of 20℃ to 50℃,the proposed BTMS can keep the temperature of battery pack in the proper range.Finally,different inlet flow rates are recommended according to different battery working states.
