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Kinetics study on separation and recovery of In-Pb solder by vacuum volatilization
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作者 Jian PANG Chao-wei DONG +2 位作者 Bao-qiang XU Ling-xin KONG Bin YANG 《Transactions of Nonferrous Metals Society of China》 2025年第9期3147-3160,共14页
The vacuum volatilization kinetics of Pb in In-Pb solder was investigated.The results indicate a significant increase in the vacuum volatilization rates of Pb,25In-75Pb,40In-60Pb,and In with increasing temperatures fr... The vacuum volatilization kinetics of Pb in In-Pb solder was investigated.The results indicate a significant increase in the vacuum volatilization rates of Pb,25In-75Pb,40In-60Pb,and In with increasing temperatures from 923 to 1123 K,system pressure of 3 Pa and holding time of 30 min.The mass transfer coefficients and apparent activation energies of Pb and its alloys were determined at various temperatures.Additionally,a kinetics model was developed to describe Pb vacuum volatilization in high-temperature melts.It is obtained that the vapor mass transfer is the factor limiting the vacuum volatilization rates of Pb and In-Pb alloys under the above specified conditions. 展开更多
关键词 vacuum volatilization in-pb alloy SOLDER rate equation kinetics model
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软钎焊料特种合金及其应用
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作者 刘平 钟海锋 +2 位作者 冯斌 石磊 金霞 《浙江冶金》 2020年第4期1-4,共4页
本文介绍了在电子组装领域用于特定场合的特种合金软钎料,并与Sn-Pb钎料进行了对比,分析了优劣势,详细阐述了各自的应用场景。
关键词 in-pb钎料 低温钎料 高温无铅钎料 电子组装
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