ICE(inducer of CBF expression)基因家族是植物低温信号转导通路中的重要转录调控因子之一,为系统解析白菜型油菜中ICE家族的成员特征及其低温响应表达模式,基于白菜型油菜全基因组数据,通过BLAST与HMM方法鉴定出74个ICE基因家族成员...ICE(inducer of CBF expression)基因家族是植物低温信号转导通路中的重要转录调控因子之一,为系统解析白菜型油菜中ICE家族的成员特征及其低温响应表达模式,基于白菜型油菜全基因组数据,通过BLAST与HMM方法鉴定出74个ICE基因家族成员。染色体定位结果显示,该家族在全部10条染色体上均有分布,其中以第9号染色体上成员数最多。蛋白质特性分析显示,所有成员均定位于细胞核,分子量和等电点差异较大,70个成员蛋白不稳定性指数超过稳定性阈值。基因结构与保守功能模块分析揭示成员间结构组成存在多样性,其中Motif 1和Motif 2在绝大多数成员中高度保守。共线性分析表明,该家族扩展主要受全基因组复制与片段复制事件驱动。启动子区顺式调控元件分析显示大部分基因含有光响应、ABA、MeJA及MYB结合位点等顺式调控元件,其中34个BraICE含有低温响应元件。基于西藏白菜型油菜转录组数据的表达分析发现,BraICE17在低温处理后表达上调幅度最大,BraICE35表达下调幅度最为明显,qRT-PCR实验总体支持转录组数据的可靠性。本研究结果为进一步解析BraICE的分子功能与低温应答机制奠定了理论基础,并提供了潜在的耐寒研究基因资源。展开更多
Debate over the benefits and harms of icing acute muscle injuries remains unresolved.Some contend that ice is ineffective or even harmful,while others promote cryotherapy as a universal remedy.Centrists,often academic...Debate over the benefits and harms of icing acute muscle injuries remains unresolved.Some contend that ice is ineffective or even harmful,while others promote cryotherapy as a universal remedy.Centrists,often academics,call for more high-quality randomized controlled trials(RCTs)to resolve the issue.This viewpoint reframes the debate around 3 key points:first,although ice produces analgesia,evidence for sustained pain relief,beyond the immediate post-treatment period.展开更多
IC10 alloy is a promising material for the applications of engine turbine blades.Fabricating and repairing of the turbine blades urgently need a sound joining technique for the IC10 alloy.The traditional transient liq...IC10 alloy is a promising material for the applications of engine turbine blades.Fabricating and repairing of the turbine blades urgently need a sound joining technique for the IC10 alloy.The traditional transient liquid phase(TLP)bonding method is difficult to achieve isothermal solidification,which tends to form brittle eutectic phases.In this study,a novel Al/BNi2 composite filler was designed.This new type of composite filler facilitates the diffusion of elements to completely dissolve or disperse the brittle eutectic structure of continuous large blocks in the TLP joint,thereby improving the room-temperature mechanical properties of the joint and increasing its average shear strength by 20%to 550 MPa.Effect of Al content and bonding temperature on microstructure and mechanical strength of the IC10/Al/BNi2/IC10 joint was investigated.Microstructure evolution mechanisms of the traditional TLP bonding method(with a pure BNi2 filler)and the novel TLP bonding method(with the Al/BNi2 composite filler)were put into comparison.The TLP joint of the new filler achieved a maximum room temperature shear strength of 570 MPa(3 wt.%Al,1100℃,2 h).展开更多
To address the challenges of complexity,power consumption,and cost constraints in traditional display driver integrated circuits(DDICs)caused by external NOR Flash and SRAM,this work proposes an embedded resistive ran...To address the challenges of complexity,power consumption,and cost constraints in traditional display driver integrated circuits(DDICs)caused by external NOR Flash and SRAM,this work proposes an embedded resistive random-access memory(RRAM)integration solution based on a 40 nm high-voltage CMOS logic platform.Targeting the yield fluctuations and stability challenges during RRAM mass production,systematic process optimizations are implemented to achieve synergistic improvements in RRAM performance and yield.Through modifications to the film sputtering and pre-deposition treatment,the withinwafer resistance uniformity(RSU)of the oxygen-deficient layer(ODL)thin film is improved from 11%to 8%,while inter-wafer process stability variation reduces from 23%to below 6%.Consequently,the yield of 8 Mb RRAM embedded mass production products increases from 87%to 98.5%.In terms of device performance,the RRAM demonstrates a fast 4.8 ns read speed,exceptional read disturb immunity of 3×10^(8) cycles at 95℃,10^(3) write/erase endurance cycles for the 1 Mb cells,and data retention of 12.5 years at 125℃.Post high-temperature operating life(HTOL)testing exhibits stable high/low resistance window.This study provides process optimization strategies and a reliability assurance framework for the mass production of highly integrated,low-power embedded RRAM display driver IC.展开更多
近年来全球极端低温天气频发,严重影响了茶树的产量和品质。ICE(Inducer of CBF expression)基因家族主要参与植物的低温胁迫响应,但在茶树领域中的相关研究还不够全面。本研究从茶树基因组中鉴定出51个茶树CsICEs基因,对其理化性质、...近年来全球极端低温天气频发,严重影响了茶树的产量和品质。ICE(Inducer of CBF expression)基因家族主要参与植物的低温胁迫响应,但在茶树领域中的相关研究还不够全面。本研究从茶树基因组中鉴定出51个茶树CsICEs基因,对其理化性质、基因结构和启动子顺式作用元件展开生物信息学分析。茶树CsICEs基因的启动子区域富含光响应、植物激素、生长发育及非生物胁迫相关顺式作用元件,其可能参与多种逆境胁迫响应。转录组分析和RT-qPCR验证结果发现,低温下CsICE43基因的表达量上升了4.24倍,其可能与茶树低温响应相关。以茶树品种‘保靖黄金茶1号’的cDNA为模板,克隆获得了CsICE43基因,其在不同组织中的表达模式存在差异,在顶芽和嫩叶中特异性高表达。蛋白氨基酸序列和系统进化树分析表明,CsICE43基因包含与ICE家族其他成员一致的S-rich、bHLH、ACT等保守结构域,且与毛花猕猴桃(Actinidiaeriantha)的亲缘关系较近。在STRING在线网站中以拟南芥AtICEs为模型,推测茶树CsICE43蛋白与HOS1、MYB15、DREB1/2存在潜在的互作关系。亚细胞定位试验表明CsICE43定位于细胞核,与跨膜结构分析结果一致。综上所述,本研究发现CsICE43基因可能与茶树低温响应关联,为深入挖掘其基因功能与抗寒分子机理提供了一定的理论基础。展开更多
文摘Debate over the benefits and harms of icing acute muscle injuries remains unresolved.Some contend that ice is ineffective or even harmful,while others promote cryotherapy as a universal remedy.Centrists,often academics,call for more high-quality randomized controlled trials(RCTs)to resolve the issue.This viewpoint reframes the debate around 3 key points:first,although ice produces analgesia,evidence for sustained pain relief,beyond the immediate post-treatment period.
基金funded by the National Natural Science Foundation of China(Grant No.U2167216,52504408,52475335)China Postdoctoral Science Foundation Funded Project(Grant No.2024M754181).
文摘IC10 alloy is a promising material for the applications of engine turbine blades.Fabricating and repairing of the turbine blades urgently need a sound joining technique for the IC10 alloy.The traditional transient liquid phase(TLP)bonding method is difficult to achieve isothermal solidification,which tends to form brittle eutectic phases.In this study,a novel Al/BNi2 composite filler was designed.This new type of composite filler facilitates the diffusion of elements to completely dissolve or disperse the brittle eutectic structure of continuous large blocks in the TLP joint,thereby improving the room-temperature mechanical properties of the joint and increasing its average shear strength by 20%to 550 MPa.Effect of Al content and bonding temperature on microstructure and mechanical strength of the IC10/Al/BNi2/IC10 joint was investigated.Microstructure evolution mechanisms of the traditional TLP bonding method(with a pure BNi2 filler)and the novel TLP bonding method(with the Al/BNi2 composite filler)were put into comparison.The TLP joint of the new filler achieved a maximum room temperature shear strength of 570 MPa(3 wt.%Al,1100℃,2 h).
文摘To address the challenges of complexity,power consumption,and cost constraints in traditional display driver integrated circuits(DDICs)caused by external NOR Flash and SRAM,this work proposes an embedded resistive random-access memory(RRAM)integration solution based on a 40 nm high-voltage CMOS logic platform.Targeting the yield fluctuations and stability challenges during RRAM mass production,systematic process optimizations are implemented to achieve synergistic improvements in RRAM performance and yield.Through modifications to the film sputtering and pre-deposition treatment,the withinwafer resistance uniformity(RSU)of the oxygen-deficient layer(ODL)thin film is improved from 11%to 8%,while inter-wafer process stability variation reduces from 23%to below 6%.Consequently,the yield of 8 Mb RRAM embedded mass production products increases from 87%to 98.5%.In terms of device performance,the RRAM demonstrates a fast 4.8 ns read speed,exceptional read disturb immunity of 3×10^(8) cycles at 95℃,10^(3) write/erase endurance cycles for the 1 Mb cells,and data retention of 12.5 years at 125℃.Post high-temperature operating life(HTOL)testing exhibits stable high/low resistance window.This study provides process optimization strategies and a reliability assurance framework for the mass production of highly integrated,low-power embedded RRAM display driver IC.
文摘近年来全球极端低温天气频发,严重影响了茶树的产量和品质。ICE(Inducer of CBF expression)基因家族主要参与植物的低温胁迫响应,但在茶树领域中的相关研究还不够全面。本研究从茶树基因组中鉴定出51个茶树CsICEs基因,对其理化性质、基因结构和启动子顺式作用元件展开生物信息学分析。茶树CsICEs基因的启动子区域富含光响应、植物激素、生长发育及非生物胁迫相关顺式作用元件,其可能参与多种逆境胁迫响应。转录组分析和RT-qPCR验证结果发现,低温下CsICE43基因的表达量上升了4.24倍,其可能与茶树低温响应相关。以茶树品种‘保靖黄金茶1号’的cDNA为模板,克隆获得了CsICE43基因,其在不同组织中的表达模式存在差异,在顶芽和嫩叶中特异性高表达。蛋白氨基酸序列和系统进化树分析表明,CsICE43基因包含与ICE家族其他成员一致的S-rich、bHLH、ACT等保守结构域,且与毛花猕猴桃(Actinidiaeriantha)的亲缘关系较近。在STRING在线网站中以拟南芥AtICEs为模型,推测茶树CsICE43蛋白与HOS1、MYB15、DREB1/2存在潜在的互作关系。亚细胞定位试验表明CsICE43定位于细胞核,与跨膜结构分析结果一致。综上所述,本研究发现CsICE43基因可能与茶树低温响应关联,为深入挖掘其基因功能与抗寒分子机理提供了一定的理论基础。
