This paper mainly describes a research of fabrication-technology of silicon magnetic-sensitive transistor (SMST) with rectangle-plank-cubic structure fabricated on silicon wafer by MEMS technique.An experiment researc...This paper mainly describes a research of fabrication-technology of silicon magnetic-sensitive transistor (SMST) with rectangle-plank-cubic structure fabricated on silicon wafer by MEMS technique.An experiment research on basic characteristic of the silicon magnetic-sensitive transistor was done.Anisotropic etching and reliable technique project were provided and applied in order to fabricate SMST with rectangle-plank-cubic construction.This means that a new kind of fabrication technology for silicon magnetic-sensitive transistor was provided.The result shows that the technique can be not only compatible with IC technology but also integrated easily,and has a wide application field.展开更多
Successful implementation of simple mechanism on silicon chip is a prerequisite for monolithic microrobotic systems. This paper describes the integrated fabrication of polycrystalline silicon microgripper. Link, fixed...Successful implementation of simple mechanism on silicon chip is a prerequisite for monolithic microrobotic systems. This paper describes the integrated fabrication of polycrystalline silicon microgripper. Link, fixed and active joint, and sliding flange structures with dimensions of micrometers have been fabricated on the substrate of monocrystalline silicon using silicon microfabrication technology.This microgripper, which may be applied to transducers or sensors, can be batch fabricated in IC compatible process. The movable mechanical elements are built on layers that are later removed, so that they are free for translation and rotation. Under external driving, a microgripper cut from substrate would be able to catch tiny filament or small particle with dimension of 10～200 micrometers.展开更多
This Special Issue includes five papers from the 2024 IEEE International Conference on Integrated Circuits Technologies and Applications(ICTA),held in Hangzhou,Zhejiang,China,from October 25 to 27,2024.ICTA is an IEEE...This Special Issue includes five papers from the 2024 IEEE International Conference on Integrated Circuits Technologies and Applications(ICTA),held in Hangzhou,Zhejiang,China,from October 25 to 27,2024.ICTA is an IEEE flagship conference in the field of integrated circuits(ICs)in China,providing a platform for the presentation and exchange of the latest technical achievements and fostering cross-discipline collaboration in IC designs,technologies,and applications within the rapidly evolving technical community.展开更多
This Special Issue is dedicated to the selected papers from the 2023 IEEE International Conference on Integrated Circuits Technologies and Applications(ICTA),held in Hefei,Anhui,China,from October 27 to 29,2023.ICTA i...This Special Issue is dedicated to the selected papers from the 2023 IEEE International Conference on Integrated Circuits Technologies and Applications(ICTA),held in Hefei,Anhui,China,from October 27 to 29,2023.ICTA is an IEEE flagship conference in the field of integrated circuits(ICs)in China,providing a platform for the presentation and exchange of the latest technical achievements and fostering cross-discipline collaboration in IC designs,technologies,and applications within the rapidly evolving technical community.展开更多
文摘This paper mainly describes a research of fabrication-technology of silicon magnetic-sensitive transistor (SMST) with rectangle-plank-cubic structure fabricated on silicon wafer by MEMS technique.An experiment research on basic characteristic of the silicon magnetic-sensitive transistor was done.Anisotropic etching and reliable technique project were provided and applied in order to fabricate SMST with rectangle-plank-cubic construction.This means that a new kind of fabrication technology for silicon magnetic-sensitive transistor was provided.The result shows that the technique can be not only compatible with IC technology but also integrated easily,and has a wide application field.
文摘Successful implementation of simple mechanism on silicon chip is a prerequisite for monolithic microrobotic systems. This paper describes the integrated fabrication of polycrystalline silicon microgripper. Link, fixed and active joint, and sliding flange structures with dimensions of micrometers have been fabricated on the substrate of monocrystalline silicon using silicon microfabrication technology.This microgripper, which may be applied to transducers or sensors, can be batch fabricated in IC compatible process. The movable mechanical elements are built on layers that are later removed, so that they are free for translation and rotation. Under external driving, a microgripper cut from substrate would be able to catch tiny filament or small particle with dimension of 10～200 micrometers.
文摘This Special Issue includes five papers from the 2024 IEEE International Conference on Integrated Circuits Technologies and Applications(ICTA),held in Hangzhou,Zhejiang,China,from October 25 to 27,2024.ICTA is an IEEE flagship conference in the field of integrated circuits(ICs)in China,providing a platform for the presentation and exchange of the latest technical achievements and fostering cross-discipline collaboration in IC designs,technologies,and applications within the rapidly evolving technical community.
文摘This Special Issue is dedicated to the selected papers from the 2023 IEEE International Conference on Integrated Circuits Technologies and Applications(ICTA),held in Hefei,Anhui,China,from October 27 to 29,2023.ICTA is an IEEE flagship conference in the field of integrated circuits(ICs)in China,providing a platform for the presentation and exchange of the latest technical achievements and fostering cross-discipline collaboration in IC designs,technologies,and applications within the rapidly evolving technical community.
