The brain's functions are governed by molecular metabolic networks.However,due to the sophisticated spatial organization and diverse activities of the brain,characterizing both the minute and large-scale metabolic...The brain's functions are governed by molecular metabolic networks.However,due to the sophisticated spatial organization and diverse activities of the brain,characterizing both the minute and large-scale metabolic activity across the entire brain and its numerous micro-regions remains incredibly challenging.Here,we offer a high-definition spatially resolved metabolomics technique to better understand the metabolic specialization and interconnection throughout the mouse brain using improved ambient mass spectrometry imaging.This method allows for the simultaneous mapping of thousands of metabolites at a 30 μm spatial resolution across the mouse brain,ranging from structural lipids to functional neurotransmitters.This approach effectively reveals the distribution patterns of delicate microregions and their distinctive metabolic characteristics.Using an integrated database,we annotated 259 metabolites,demonstrating that the metabolome and metabolic pathways are unique to each brain microregion.The distribution of metabolites,closely linked to functionally connected brain regions and their interactions,offers profound insights into the complexity of chemical processes and their roles in brain function.An initial dataset for future metabolomics research might be obtained from the high-definition mouse brain's spatial metabolome atlas.展开更多
As circuit feature sizes approach the nanoscale,traditional Copper(Cu)interconnects face significant hurdles posed by rising resistance-capacitance(RC)delay,electromigration,and high power dissipation.These limitation...As circuit feature sizes approach the nanoscale,traditional Copper(Cu)interconnects face significant hurdles posed by rising resistance-capacitance(RC)delay,electromigration,and high power dissipation.These limitations impose constraints on the scalability and reliability of future semiconductor technologies.Our paper describes the new Vertical multilayer Aluminium Boron Nitride Nanoribbon(AlBN)interconnect structure,integrated with Density functional theory(DFT)using first-principles calculations.This study explores AlBN-based nanostructures with doping of 1Cu,2Cu,1Fe(Iron),and 2Fe for the application of Very Large Scale Integration(VLSI)interconnects.The AlBN structure utilized the advantages of vertical multilayer interconnects to both reduce the RC delay while enhancing signal integrity.Key parameters like Fermi energy,bandgap,binding energy,conduction channels,quantum resistance,and RC delay were analyzed.Through modeling and large-scale simulation,the structural,electronic,and stability attributes of the AlBN interconnects are analyzed,and the results illustrate considerable improvements in signal propagation against Cu interconnect structures.These findings confirm the tunable,high-performance nature of AlBN-2Fe,making it a promising candidate for future high-speed,low-power VLSI interconnect technologies.We demonstrated an advanced energy-efficient interconnect that can be easily scaled for future nanoscale VLSI circuit design and gives rise to a next generation of viable interconnect technology for high-capacity,high-speed,reliable semiconductor technology.展开更多
Industrial intelligence and secure interconnection serve as the foundational platform and critical information infrastructure for new industrialization,carrying significant strategic importance.They not only function ...Industrial intelligence and secure interconnection serve as the foundational platform and critical information infrastructure for new industrialization,carrying significant strategic importance.They not only function as the core engine driving the transformation and upgrading of the manufacturing sector and ensuring stable socioeconomic operation but are also vital to enhancing national technological competitiveness and safeguarding industrial security.展开更多
Nano-twinned copper(nt-Cu),with a preferred orientation,is highly promising as interconnect materials in high-density advanced packaging due to its considerable mechanical strength,excellent electrical conductivity,an...Nano-twinned copper(nt-Cu),with a preferred orientation,is highly promising as interconnect materials in high-density advanced packaging due to its considerable mechanical strength,excellent electrical conductivity,and resistance to thermal migration.However,its application is impeded by sulfur-containing byproducts from the electroplating process,exacerbating the formation of Kirkendall voids within solder joints during thermal aging.Herein,through the incorporation of Zinc(Zn)into the nt-Cu layer,we develop a nt-Cu/Zn composite structure.Our findings provide the first definitive confirmation of the mechanism by which sulfur atoms migrate to the Cu_(3)Sn/nt-Cu interface through interstitial diffusion,thereby reducing the activation energy for vacancy formation.We further demonstrate that Zn effectively an-choring sulfur atoms,forming ZnS within the nt-Cu layer during heat treatment,which increases the vacancy formation energy and inhibits the development of Kirkendall voids.Remarkably,no Kirkendall voids are observed in the modified interconnects even after prolonged aging at 150℃ for 1000 h.The nt-Cu/Zn composite metallization layers significantly decrease the growth rate of interfacial intermetallic compounds by 33.6% and enhance the shear strength of solder interconnections to 228.9%.This research underscores the potential of nt-Cu in advanced electronic packaging,offering new pathways for improving the power density and reliability of electronic devices.展开更多
Interconnection planning involving bi-directional converters(BdCs)is crucial for enhancing the reliability and robustness of hybrid alternating current(AC)/direct current(DC)microgrid clusters with high penetrations o...Interconnection planning involving bi-directional converters(BdCs)is crucial for enhancing the reliability and robustness of hybrid alternating current(AC)/direct current(DC)microgrid clusters with high penetrations of renewable energy resources(RESs).However,challenges such as the non-convex nature of BdC efficiency and renewable energy uncertainty complicate the planning process.To address these issues,this paper proposes a tri-level BdC-based planning framework that incorporates dynamic BdC efficiency and a data-correlated uncertainty set(DcUS)derived from historical data patterns.The proposed framework employs a least-squares approximation to linearize BdC efficiency and constructs the DcUS to balance computational efficiency and solution robustness.Additionally,a fully parallel column and constraint generation algorithm is developed to solve the model efficiently.Numerical simulations on a practical hybrid AC/DC microgrid system demonstrate that the proposed method reduces interconnection costs by up to 21.8%compared to conventional uncertainty sets while ensuring robust operation under all considered scenarios.These results highlight the computational efficiency,robustness,and practicality of the proposed approach,making it a promising solution for modern power systems.展开更多
Permanent Magnet Synchronous Motors(PMSMs)are widely employed in high-performance drive applications due to their superior efficiency and dynamic capabilities.However,their control remains challenging owing to nonline...Permanent Magnet Synchronous Motors(PMSMs)are widely employed in high-performance drive applications due to their superior efficiency and dynamic capabilities.However,their control remains challenging owing to nonlinear dynamics,parameter variations,and unmeasurable external disturbances,particularly load torquefluctuations.This study proposes an enhanced Interconnection and Damp-ing Assignment Passivity-Based Control(IDA-PBC)scheme,formulated within the port-controlled Hamiltonian(PCH)framework,to address these limitations.A nonlinear disturbance observer is embedded to estimate and compensate,in real time,for lumped mis-matched disturbances arising from parameter uncertainties and external loads.Additionally,aflatness-based control strategy is employed to generate the desired current references within the nonlinear drive system,ensuring accurate tracking of time-varying speed commands.This integrated approach preserves the system’s energy-based structure,enabling systematic stability analysis while enhancing robustness.The proposed control architecture also maintains low complexity with a limited number of tunable parameters,facilitating practical implementation.Simulation and experimental results under various operating conditions demonstrate the effectiveness and robustness of the proposed method.Comparative analysis with conventional proportional-integral(PI)control and standard IDA-PBC strategies confirms its capability to handle disturbances and maintain dynamic performance.展开更多
The effects of adjacent metal layers and space between metal lines on the temperature rise of multilevel ULSI interconnect lines are investigated by modeling a three-layer interconnect. The heat dissipation of various...The effects of adjacent metal layers and space between metal lines on the temperature rise of multilevel ULSI interconnect lines are investigated by modeling a three-layer interconnect. The heat dissipation of various metallization technologies concerning the metal and low-k dielectric employment is simulated in detail. The Joule heat generated in the interconnect is transferred mainly through the metal lines in each metal layer and through the path with the smallest thermal resistance in each Ield layer. The temperature rises of Al metallization are approximately pAl/pCu times higher than those of Cu metallization under the same conditions. In addition, a thermal problem in 0.13μm globe interconnects is studied for the worst case, in which there are no metal lines in the lower interconnect layers. Several types of dummy metal heat sinks are investigated and compared with regard to thermal efficiency,influence on parasitic capacitance,and optimal application by combined thermal and electrical simula- tion.展开更多
To solve the load balancing problem in a triplet-based hierarchical interconnection network（THIN） system, a dynamic load balancing （DLB）algorithm--THINDLBA, which adopts multicast tree （MT）technology to improve ...To solve the load balancing problem in a triplet-based hierarchical interconnection network（THIN） system, a dynamic load balancing （DLB）algorithm--THINDLBA, which adopts multicast tree （MT）technology to improve the efficiency of interchanging load information, is presented. To support the algorithm, a complete set of DLB messages and a schema of maintaining DLB information in each processing node are designed. The load migration request messages from the heavily loaded node （HLN）are spread along an MT whose root is the HLN. And the lightly loaded nodes（LLNs） covered by the MT are the candidate destinations of load migration; the load information interchanged between the LLNs and the HLN can be transmitted along the MT. So the HLN can migrate excess loads out as many as possible during a one time execution of the THINDLBA, and its load state can be improved as quickly as possible. To avoid wrongly transmitted or redundant DLB messages due to MT overlapping, the MT construction is restricted in the design of the THINDLBA. Through experiments, the effectiveness of four DLB algorithms are compared, and the results show that the THINDLBA can effectively decrease the time costs of THIN systems in dealing with large scale computeintensive tasks more than others.展开更多
We study the problem of the prediction of interconnection dimensions for FPGAs, including estimating interconnection length and channel width. Experimental results show that our estimates are more accurate than those ...We study the problem of the prediction of interconnection dimensions for FPGAs, including estimating interconnection length and channel width. Experimental results show that our estimates are more accurate than those of existing methods.展开更多
This paper introduces the current situation of China power industry and interconnection, the necessity to develop interconnection, the principle of nationwide interconnection and the key technologies to be studiedincl...This paper introduces the current situation of China power industry and interconnection, the necessity to develop interconnection, the principle of nationwide interconnection and the key technologies to be studiedinclude HVDC and FACTS. The paper also discusses thefeasibility of 750 kV to be used in the northwest.regionand to speed up research and development of nighervoltage level in other regions of China, as well as scl-ence and technical innovation for transmission and dis-tribution projects.展开更多
The wavelength routing technology applied to computer interconnection networks is introduced in this paper.By analyzing the relation between wavelength and network routing,we describe a concept of wavelength used as n...The wavelength routing technology applied to computer interconnection networks is introduced in this paper.By analyzing the relation between wavelength and network routing,we describe a concept of wavelength used as network IP address,and propose a wavelength routing topology to extend the scale of a network and realize the scalability of the network.Moreover,a twin wavelength ring network that is being developed in our laboratory to implement and test the function of wavelength routing is presented,and the main units of the twin wavelength ring network are presented also.According to the testing results based on a single wavelength ring network,it proves that the optical interconnection technology is a perfect technology to provide enough communication bandwidth for computer network.展开更多
背景:骨代谢紊乱会引起骨相关疾病的发生,而叉头框转录因子O3可以通过调节氧化应激、自噬水平等来影响骨组织细胞增殖、分化与凋亡,调控骨代谢过程。目的:系统性分析叉头框转录因子O3调控骨代谢及其在骨科疾病中作用机制的相关研究文献...背景:骨代谢紊乱会引起骨相关疾病的发生,而叉头框转录因子O3可以通过调节氧化应激、自噬水平等来影响骨组织细胞增殖、分化与凋亡,调控骨代谢过程。目的:系统性分析叉头框转录因子O3调控骨代谢及其在骨科疾病中作用机制的相关研究文献,为后续以叉头框转录因子O3为靶点治疗骨疾病的研究提供参考。方法:以“(SU=FoxO3a OR SU=Foxo3 OR SU=Forkhead box O3 OR SU=叉头框转录因子O3)AND SU=骨”为检索句在中国知网进行检索,以“主题:(“FoxO3a”)OR主题:(“Foxo3”)OR主题:(“Forkhead box O3”)OR主题:(“叉头框转录因子O3”)AND主题:(“骨”)”为检索句在万方医学数据库进行检索;以“((FoxO3a)OR(Foxo3)OR(Forkhead box O3))AND((bone)OR(Skeleton))”为检索句在PubMed数据库进行检索,排除陈旧、重复、质量较差以及不相关的文献,最终纳入56篇文献进行综述分析。结果与结论:①叉头框转录因子O3与骨髓间充质干细胞:叉头框转录因子O3能够促进成骨谱系的形成,还可通过激活自噬促进早期成骨分化。同时,叉头框转录因子O3在骨髓间充质干细胞中体现抗氧化特性,保护细胞免受氧化应激诱导的衰老。②叉头框转录因子O3与成骨细胞:叉头框转录因子O3在成骨细胞中能通过干扰Wnt/β-连环蛋白通路抑制成骨,同时能激活抗氧化酶保护成熟成骨细胞。叉头框转录因子O3能促进成骨祖细胞的增殖,并通过激活自噬促进成骨分化。③叉头框转录因子O3与破骨细胞:叉头框转录因子O3表达可抵抗氧化应激和激活自噬抑制破骨细胞生成。④叉头框转录因子O3与骨细胞:叉头框转录因子O3可通过抗氧化作用保护骨细胞,还可通过抑制p16和p53信号通路和抑制衰老相关分泌表型来减少骨流失。⑤叉头框转录因子O3与软骨细胞:叉头框转录因子O3在骨关节炎中对软骨细胞起到保护作用,抑制软骨细胞分解或凋亡,促进软骨细胞外基质合成,可抑制软骨细胞肥大;然而,叉头框转录因子O3与Runt相关转录因子1在软骨细胞中高度共表达却会促进软骨祖细胞的早期软骨形成和终末肥大。⑥叉头框转录因子O3通过参与氧化应激抵抗与调控自噬等过程影响骨代谢,参与多类骨相关疾病的病理进程。展开更多
基金financial support from the National Natural Science Foundation of China (Nos.82473887 and 21927808)the Scientific and Technological Innovation Program of Shanghai (No.23DZ2202500)the CAMS Innovation Fund for Medical Sciences (No.2021-1-I2M-026)。
文摘The brain's functions are governed by molecular metabolic networks.However,due to the sophisticated spatial organization and diverse activities of the brain,characterizing both the minute and large-scale metabolic activity across the entire brain and its numerous micro-regions remains incredibly challenging.Here,we offer a high-definition spatially resolved metabolomics technique to better understand the metabolic specialization and interconnection throughout the mouse brain using improved ambient mass spectrometry imaging.This method allows for the simultaneous mapping of thousands of metabolites at a 30 μm spatial resolution across the mouse brain,ranging from structural lipids to functional neurotransmitters.This approach effectively reveals the distribution patterns of delicate microregions and their distinctive metabolic characteristics.Using an integrated database,we annotated 259 metabolites,demonstrating that the metabolome and metabolic pathways are unique to each brain microregion.The distribution of metabolites,closely linked to functionally connected brain regions and their interactions,offers profound insights into the complexity of chemical processes and their roles in brain function.An initial dataset for future metabolomics research might be obtained from the high-definition mouse brain's spatial metabolome atlas.
文摘As circuit feature sizes approach the nanoscale,traditional Copper(Cu)interconnects face significant hurdles posed by rising resistance-capacitance(RC)delay,electromigration,and high power dissipation.These limitations impose constraints on the scalability and reliability of future semiconductor technologies.Our paper describes the new Vertical multilayer Aluminium Boron Nitride Nanoribbon(AlBN)interconnect structure,integrated with Density functional theory(DFT)using first-principles calculations.This study explores AlBN-based nanostructures with doping of 1Cu,2Cu,1Fe(Iron),and 2Fe for the application of Very Large Scale Integration(VLSI)interconnects.The AlBN structure utilized the advantages of vertical multilayer interconnects to both reduce the RC delay while enhancing signal integrity.Key parameters like Fermi energy,bandgap,binding energy,conduction channels,quantum resistance,and RC delay were analyzed.Through modeling and large-scale simulation,the structural,electronic,and stability attributes of the AlBN interconnects are analyzed,and the results illustrate considerable improvements in signal propagation against Cu interconnect structures.These findings confirm the tunable,high-performance nature of AlBN-2Fe,making it a promising candidate for future high-speed,low-power VLSI interconnect technologies.We demonstrated an advanced energy-efficient interconnect that can be easily scaled for future nanoscale VLSI circuit design and gives rise to a next generation of viable interconnect technology for high-capacity,high-speed,reliable semiconductor technology.
文摘Industrial intelligence and secure interconnection serve as the foundational platform and critical information infrastructure for new industrialization,carrying significant strategic importance.They not only function as the core engine driving the transformation and upgrading of the manufacturing sector and ensuring stable socioeconomic operation but are also vital to enhancing national technological competitiveness and safeguarding industrial security.
基金financially supported by National Natural Science Foundation of China(No.U2241223)Pre-Research Foundation of China(No.909010203-202).
文摘Nano-twinned copper(nt-Cu),with a preferred orientation,is highly promising as interconnect materials in high-density advanced packaging due to its considerable mechanical strength,excellent electrical conductivity,and resistance to thermal migration.However,its application is impeded by sulfur-containing byproducts from the electroplating process,exacerbating the formation of Kirkendall voids within solder joints during thermal aging.Herein,through the incorporation of Zinc(Zn)into the nt-Cu layer,we develop a nt-Cu/Zn composite structure.Our findings provide the first definitive confirmation of the mechanism by which sulfur atoms migrate to the Cu_(3)Sn/nt-Cu interface through interstitial diffusion,thereby reducing the activation energy for vacancy formation.We further demonstrate that Zn effectively an-choring sulfur atoms,forming ZnS within the nt-Cu layer during heat treatment,which increases the vacancy formation energy and inhibits the development of Kirkendall voids.Remarkably,no Kirkendall voids are observed in the modified interconnects even after prolonged aging at 150℃ for 1000 h.The nt-Cu/Zn composite metallization layers significantly decrease the growth rate of interfacial intermetallic compounds by 33.6% and enhance the shear strength of solder interconnections to 228.9%.This research underscores the potential of nt-Cu in advanced electronic packaging,offering new pathways for improving the power density and reliability of electronic devices.
基金supported by the National Natural Science Foundation of China(72271213)the Shenzhen Science and Technology Program(JCYJ20220530143800001 and RCYX20221008092927070)+1 种基金the Guangdong Basic and Applied Basic Research Foundation(2024A1515240024)the National Key Research and Development Program of China(2022YFB2403500).
文摘Interconnection planning involving bi-directional converters(BdCs)is crucial for enhancing the reliability and robustness of hybrid alternating current(AC)/direct current(DC)microgrid clusters with high penetrations of renewable energy resources(RESs).However,challenges such as the non-convex nature of BdC efficiency and renewable energy uncertainty complicate the planning process.To address these issues,this paper proposes a tri-level BdC-based planning framework that incorporates dynamic BdC efficiency and a data-correlated uncertainty set(DcUS)derived from historical data patterns.The proposed framework employs a least-squares approximation to linearize BdC efficiency and constructs the DcUS to balance computational efficiency and solution robustness.Additionally,a fully parallel column and constraint generation algorithm is developed to solve the model efficiently.Numerical simulations on a practical hybrid AC/DC microgrid system demonstrate that the proposed method reduces interconnection costs by up to 21.8%compared to conventional uncertainty sets while ensuring robust operation under all considered scenarios.These results highlight the computational efficiency,robustness,and practicality of the proposed approach,making it a promising solution for modern power systems.
基金supported in part by an International Research Partnership“Electrical Engineering-Thai French Research Center(EE-TFRC)”under the project framework of the Lorraine Universite´d’Excellence(LUE)in cooperation between Universite´de Lorraine(France)and King Mongkut’s University of Technology North Bangkok(year 2021-2024/2025-28)by the National Research Council of Thailand(NRCT)under Research Team Promotion Grant(Senior Research Scholar Program)under Grant No.N42A 680561by the NSRF via the Program Management Unit for Human Resources&Institutional Development,Research and Innovation under Research project Grant No.B41G680025.
文摘Permanent Magnet Synchronous Motors(PMSMs)are widely employed in high-performance drive applications due to their superior efficiency and dynamic capabilities.However,their control remains challenging owing to nonlinear dynamics,parameter variations,and unmeasurable external disturbances,particularly load torquefluctuations.This study proposes an enhanced Interconnection and Damp-ing Assignment Passivity-Based Control(IDA-PBC)scheme,formulated within the port-controlled Hamiltonian(PCH)framework,to address these limitations.A nonlinear disturbance observer is embedded to estimate and compensate,in real time,for lumped mis-matched disturbances arising from parameter uncertainties and external loads.Additionally,aflatness-based control strategy is employed to generate the desired current references within the nonlinear drive system,ensuring accurate tracking of time-varying speed commands.This integrated approach preserves the system’s energy-based structure,enabling systematic stability analysis while enhancing robustness.The proposed control architecture also maintains low complexity with a limited number of tunable parameters,facilitating practical implementation.Simulation and experimental results under various operating conditions demonstrate the effectiveness and robustness of the proposed method.Comparative analysis with conventional proportional-integral(PI)control and standard IDA-PBC strategies confirms its capability to handle disturbances and maintain dynamic performance.
文摘The effects of adjacent metal layers and space between metal lines on the temperature rise of multilevel ULSI interconnect lines are investigated by modeling a three-layer interconnect. The heat dissipation of various metallization technologies concerning the metal and low-k dielectric employment is simulated in detail. The Joule heat generated in the interconnect is transferred mainly through the metal lines in each metal layer and through the path with the smallest thermal resistance in each Ield layer. The temperature rises of Al metallization are approximately pAl/pCu times higher than those of Cu metallization under the same conditions. In addition, a thermal problem in 0.13μm globe interconnects is studied for the worst case, in which there are no metal lines in the lower interconnect layers. Several types of dummy metal heat sinks are investigated and compared with regard to thermal efficiency,influence on parasitic capacitance,and optimal application by combined thermal and electrical simula- tion.
基金The National Natural Science Foundation of China(No.69973007).
文摘To solve the load balancing problem in a triplet-based hierarchical interconnection network（THIN） system, a dynamic load balancing （DLB）algorithm--THINDLBA, which adopts multicast tree （MT）technology to improve the efficiency of interchanging load information, is presented. To support the algorithm, a complete set of DLB messages and a schema of maintaining DLB information in each processing node are designed. The load migration request messages from the heavily loaded node （HLN）are spread along an MT whose root is the HLN. And the lightly loaded nodes（LLNs） covered by the MT are the candidate destinations of load migration; the load information interchanged between the LLNs and the HLN can be transmitted along the MT. So the HLN can migrate excess loads out as many as possible during a one time execution of the THINDLBA, and its load state can be improved as quickly as possible. To avoid wrongly transmitted or redundant DLB messages due to MT overlapping, the MT construction is restricted in the design of the THINDLBA. Through experiments, the effectiveness of four DLB algorithms are compared, and the results show that the THINDLBA can effectively decrease the time costs of THIN systems in dealing with large scale computeintensive tasks more than others.
文摘We study the problem of the prediction of interconnection dimensions for FPGAs, including estimating interconnection length and channel width. Experimental results show that our estimates are more accurate than those of existing methods.
文摘This paper introduces the current situation of China power industry and interconnection, the necessity to develop interconnection, the principle of nationwide interconnection and the key technologies to be studiedinclude HVDC and FACTS. The paper also discusses thefeasibility of 750 kV to be used in the northwest.regionand to speed up research and development of nighervoltage level in other regions of China, as well as scl-ence and technical innovation for transmission and dis-tribution projects.
基金Supported by“863” high technology research and developmentprogram,No.863- 30 7- 1 4 - 2 (0 1 )
文摘The wavelength routing technology applied to computer interconnection networks is introduced in this paper.By analyzing the relation between wavelength and network routing,we describe a concept of wavelength used as network IP address,and propose a wavelength routing topology to extend the scale of a network and realize the scalability of the network.Moreover,a twin wavelength ring network that is being developed in our laboratory to implement and test the function of wavelength routing is presented,and the main units of the twin wavelength ring network are presented also.According to the testing results based on a single wavelength ring network,it proves that the optical interconnection technology is a perfect technology to provide enough communication bandwidth for computer network.
文摘背景:骨代谢紊乱会引起骨相关疾病的发生,而叉头框转录因子O3可以通过调节氧化应激、自噬水平等来影响骨组织细胞增殖、分化与凋亡,调控骨代谢过程。目的:系统性分析叉头框转录因子O3调控骨代谢及其在骨科疾病中作用机制的相关研究文献,为后续以叉头框转录因子O3为靶点治疗骨疾病的研究提供参考。方法:以“(SU=FoxO3a OR SU=Foxo3 OR SU=Forkhead box O3 OR SU=叉头框转录因子O3)AND SU=骨”为检索句在中国知网进行检索,以“主题:(“FoxO3a”)OR主题:(“Foxo3”)OR主题:(“Forkhead box O3”)OR主题:(“叉头框转录因子O3”)AND主题:(“骨”)”为检索句在万方医学数据库进行检索;以“((FoxO3a)OR(Foxo3)OR(Forkhead box O3))AND((bone)OR(Skeleton))”为检索句在PubMed数据库进行检索,排除陈旧、重复、质量较差以及不相关的文献,最终纳入56篇文献进行综述分析。结果与结论:①叉头框转录因子O3与骨髓间充质干细胞:叉头框转录因子O3能够促进成骨谱系的形成,还可通过激活自噬促进早期成骨分化。同时,叉头框转录因子O3在骨髓间充质干细胞中体现抗氧化特性,保护细胞免受氧化应激诱导的衰老。②叉头框转录因子O3与成骨细胞:叉头框转录因子O3在成骨细胞中能通过干扰Wnt/β-连环蛋白通路抑制成骨,同时能激活抗氧化酶保护成熟成骨细胞。叉头框转录因子O3能促进成骨祖细胞的增殖,并通过激活自噬促进成骨分化。③叉头框转录因子O3与破骨细胞:叉头框转录因子O3表达可抵抗氧化应激和激活自噬抑制破骨细胞生成。④叉头框转录因子O3与骨细胞:叉头框转录因子O3可通过抗氧化作用保护骨细胞,还可通过抑制p16和p53信号通路和抑制衰老相关分泌表型来减少骨流失。⑤叉头框转录因子O3与软骨细胞:叉头框转录因子O3在骨关节炎中对软骨细胞起到保护作用,抑制软骨细胞分解或凋亡,促进软骨细胞外基质合成,可抑制软骨细胞肥大;然而,叉头框转录因子O3与Runt相关转录因子1在软骨细胞中高度共表达却会促进软骨祖细胞的早期软骨形成和终末肥大。⑥叉头框转录因子O3通过参与氧化应激抵抗与调控自噬等过程影响骨代谢,参与多类骨相关疾病的病理进程。
