High-quality dielectric/Ge interface and low gate leakage current are crucial issues for high-performance nanoscaled Ge-based complementary metal–oxide–semiconductor(CMOS) device. In this paper, the interfacial and ...High-quality dielectric/Ge interface and low gate leakage current are crucial issues for high-performance nanoscaled Ge-based complementary metal–oxide–semiconductor(CMOS) device. In this paper, the interfacial and electrical properties of high-k Hf Gd ON/La Ta ON stacked gate dielectric Ge metal–oxide–semiconductor(MOS) capacitors with different gadolinium(Gd) contents are investigated. Experimental results show that when the controlling Gd content is a suitable value(e.g., 13.16%), excellent device performances can be achieved: low interface-state density(6.93 × 10^11 cm^-2·e V-1), small flatband voltage(0.25 V), good capacitance–voltage behavior, small frequency dispersion, and low gate leakage current(2.29× 10^-6 A/cm^2 at Vg = Vfb + 1 V). These could be attributed to the repair of oxygen vacancies, the increase of conduction band offset, and the suppression of germanate and suboxide Ge Ox at/near the high k/Ge interface by doping suitable Gd into Hf ON.展开更多
基金Project supported by the National Key Research and Development Program of China(Grant No.2018YFB2200500)the National Natural Science Foundation of China(Grant Nos.61851406 and 61274112)
文摘High-quality dielectric/Ge interface and low gate leakage current are crucial issues for high-performance nanoscaled Ge-based complementary metal–oxide–semiconductor(CMOS) device. In this paper, the interfacial and electrical properties of high-k Hf Gd ON/La Ta ON stacked gate dielectric Ge metal–oxide–semiconductor(MOS) capacitors with different gadolinium(Gd) contents are investigated. Experimental results show that when the controlling Gd content is a suitable value(e.g., 13.16%), excellent device performances can be achieved: low interface-state density(6.93 × 10^11 cm^-2·e V-1), small flatband voltage(0.25 V), good capacitance–voltage behavior, small frequency dispersion, and low gate leakage current(2.29× 10^-6 A/cm^2 at Vg = Vfb + 1 V). These could be attributed to the repair of oxygen vacancies, the increase of conduction band offset, and the suppression of germanate and suboxide Ge Ox at/near the high k/Ge interface by doping suitable Gd into Hf ON.
