针对传统模型因缺少对电磁相互作用的表征而导致高频精度不足的问题,以具有优异高频特性的磷化铟高电子迁移率场效应晶体管(indium phosphide high electron mobility field-effect transistor,InP HEMT)为例,提出一种引入寄生耦合效应...针对传统模型因缺少对电磁相互作用的表征而导致高频精度不足的问题,以具有优异高频特性的磷化铟高电子迁移率场效应晶体管(indium phosphide high electron mobility field-effect transistor,InP HEMT)为例,提出一种引入寄生耦合效应的小信号等效电路模型与高频等效噪声电路模型.首先引入栅极–漏极之间的互感元件来模拟器件在高频下由于电磁相互作用产生的寄生耦合效应,并采用电磁仿真与直接参数提取相结合的建模方法,建立小信号等效电路模型.然后以所建小信号模型为基础,通过相关噪声矩阵与噪声参数的提取方法,建立高频等效噪声电路模型.实验结果表明,在500 MHz~50 GHz频段内,S参数最大误差小于3%,四噪声参数相较于传统模型提升约2.45%,并从小信号电流增益(|h21|)、单边功率增益(U)与最小噪声系数(Fmin)出发,评估了寄生耦合效应对高频性能的影响.展开更多
In this work,we investigate the impact of the whole small recess offset on DC and RF characteristics of InP high electron mobility transistors(HEMTs).L_(g)=80 nm HEMTs are fabricated with a double-recessed gate proces...In this work,we investigate the impact of the whole small recess offset on DC and RF characteristics of InP high electron mobility transistors(HEMTs).L_(g)=80 nm HEMTs are fabricated with a double-recessed gate process.We focus on their DC and RF responses,including the maximum transconductance(g_(m_max)),ON-resistance(R_(ON)),current-gain cutoff frequency(f_(T)),and maximum oscillation frequency(f_(max)).The devices have almost same RON.The g_(m_max) improves as the whole small recess moves toward the source.However,a small gate to source capacitance(C_(gs))and a small drain output conductance(g_(ds))lead to the largest f_(T),although the whole small gate recess moves toward the drain leads to the smaller g_(m_max).According to the small-signal modeling,the device with the whole small recess toward drain exhibits an excellent RF characteristics,such as f_(T)=372 GHz and f_(max)=394 GHz.This result is achieved by paying attention to adjust resistive and capacitive parasitics,which play a key role in high-frequency response.展开更多
磷化铟(InP)材料具有禁带宽度大、电子迁移率高、耐高温、抗辐照等优点,是制备航天器电子器件的优良材料.近地轨道内的质子和α粒子对近地卫星威胁巨大,其在InP电子器件中产生的位移损失效应是导致InP电子器件电学性能下降的主要因素....磷化铟(InP)材料具有禁带宽度大、电子迁移率高、耐高温、抗辐照等优点,是制备航天器电子器件的优良材料.近地轨道内的质子和α粒子对近地卫星威胁巨大,其在InP电子器件中产生的位移损失效应是导致InP电子器件电学性能下降的主要因素.本文使用蒙特卡罗软件Geant4研究近地轨道的质子与α粒子分别经过150μm二氧化硅和2.54 mm铝层屏蔽后,在500/1000/5000μm InP材料中产生的非电离能量损失(non-ionizing energy loss,NIEL)、平均非电离损伤能随深度分布以及年总非电离损伤能.研究发现:低能质子射程短且较易发生非电离反应,入射粒子能谱中低能粒子占比越大,材料厚度越小,NIEL值越大;计算质子和α粒子年总非电离损伤能,质子的年总非电离损伤能占比达98%,表明质子是近地轨道内产生位移损伤的主要因素;α粒子年总非电离损伤能占比小,但其在InP中的NIEL约为质子的2-10倍,应关注α粒子在InP中产生的单粒子位移损伤效应.本文计算为InP材料在空间辐射环境的应用提供了参考依据.展开更多
文摘针对传统模型因缺少对电磁相互作用的表征而导致高频精度不足的问题,以具有优异高频特性的磷化铟高电子迁移率场效应晶体管(indium phosphide high electron mobility field-effect transistor,InP HEMT)为例,提出一种引入寄生耦合效应的小信号等效电路模型与高频等效噪声电路模型.首先引入栅极–漏极之间的互感元件来模拟器件在高频下由于电磁相互作用产生的寄生耦合效应,并采用电磁仿真与直接参数提取相结合的建模方法,建立小信号等效电路模型.然后以所建小信号模型为基础,通过相关噪声矩阵与噪声参数的提取方法,建立高频等效噪声电路模型.实验结果表明,在500 MHz~50 GHz频段内,S参数最大误差小于3%,四噪声参数相较于传统模型提升约2.45%,并从小信号电流增益(|h21|)、单边功率增益(U)与最小噪声系数(Fmin)出发,评估了寄生耦合效应对高频性能的影响.
基金Supported by the Terahertz Multi User RF Transceiver System Development Project(Z211100004421012).
文摘In this work,we investigate the impact of the whole small recess offset on DC and RF characteristics of InP high electron mobility transistors(HEMTs).L_(g)=80 nm HEMTs are fabricated with a double-recessed gate process.We focus on their DC and RF responses,including the maximum transconductance(g_(m_max)),ON-resistance(R_(ON)),current-gain cutoff frequency(f_(T)),and maximum oscillation frequency(f_(max)).The devices have almost same RON.The g_(m_max) improves as the whole small recess moves toward the source.However,a small gate to source capacitance(C_(gs))and a small drain output conductance(g_(ds))lead to the largest f_(T),although the whole small gate recess moves toward the drain leads to the smaller g_(m_max).According to the small-signal modeling,the device with the whole small recess toward drain exhibits an excellent RF characteristics,such as f_(T)=372 GHz and f_(max)=394 GHz.This result is achieved by paying attention to adjust resistive and capacitive parasitics,which play a key role in high-frequency response.
基金Supported by the National Natural Science Foundation of China(12027805,62171136,62174166,U2241219)the Science and Technology Commission of Shanghai Municipality(2019SHZDZX01,22JC1402902)the Strategic Priority Research Program of the Chinese Academy of Sciences(XDB43010200)。
基金Supported by the National Natural Science Foundation of China(NSFC)(62174166,11991063,U2241219)Shanghai Municipal Science and Technology Major Project(2019SHZDZX01,22JC1402902)the Strategic Priority Research Program of Chinese Academy of Sciences(XDB43010200)。
文摘磷化铟(InP)材料具有禁带宽度大、电子迁移率高、耐高温、抗辐照等优点,是制备航天器电子器件的优良材料.近地轨道内的质子和α粒子对近地卫星威胁巨大,其在InP电子器件中产生的位移损失效应是导致InP电子器件电学性能下降的主要因素.本文使用蒙特卡罗软件Geant4研究近地轨道的质子与α粒子分别经过150μm二氧化硅和2.54 mm铝层屏蔽后,在500/1000/5000μm InP材料中产生的非电离能量损失(non-ionizing energy loss,NIEL)、平均非电离损伤能随深度分布以及年总非电离损伤能.研究发现:低能质子射程短且较易发生非电离反应,入射粒子能谱中低能粒子占比越大,材料厚度越小,NIEL值越大;计算质子和α粒子年总非电离损伤能,质子的年总非电离损伤能占比达98%,表明质子是近地轨道内产生位移损伤的主要因素;α粒子年总非电离损伤能占比小,但其在InP中的NIEL约为质子的2-10倍,应关注α粒子在InP中产生的单粒子位移损伤效应.本文计算为InP材料在空间辐射环境的应用提供了参考依据.
