An approach based on film buckling under simple uniaxial tensile testing was utilized in this paper to quan- titatively estimate the interfacial energy of the nanostructured multilayer films （NMFs） adherent to flexi...An approach based on film buckling under simple uniaxial tensile testing was utilized in this paper to quan- titatively estimate the interfacial energy of the nanostructured multilayer films （NMFs） adherent to flexible substrates. The interfacial energies of polyimide-supported NMFs are determined to be ~ 5.0 J/m2 for Cu/Cr, ~4.1 J/m2 for Cu/Ta, ~ 2.8 J/m2 for Cu/Mo, ~ 1.1 J/m2 for Cu/Nb, and ~ 1.2 J/m2 for Cu/Zr NMFs. Furthermore, a linear relationship between the adhesion energy and the interfacial shear strength is clearly demonstrated for the Cu-based NMFs, which is highly indicative of the applicability and reliability of the modified models.展开更多
Premature failure of coated tool often results from a poor adhesion of coating-substrate and shortens the lifetime of the tool. The results of increasing the adhesion strength of thin film coatings on cutting tool ins...Premature failure of coated tool often results from a poor adhesion of coating-substrate and shortens the lifetime of the tool. The results of increasing the adhesion strength of thin film coatings on cutting tool inserts by pretreating the inserts with sandblasting technique to obtain a desirable surface morphology of the inserts are presented. A geometric model representing the ideal surface morphology is established to enhance the nucleation density and adhesion strength of coating-substrate. Thin film coating experiment is conducted on the substrates of four different sample groups. Indentation and wear tests are performed on coated inserts to evaluate the effect of sandblasting on the adhesion strength of the coatings. A theoretical analysis is provided on the formation and growth of atom clusters in terms of the contact angle and the thermodynamic barrier of a substrate to predict thin film nucleation.展开更多
The cantilever bending test,particularly monitored by an acoustic emission technique, was adopted to measure the tensile and interfacial adhesive strengths of the HCD ion plated fine TiN film on pure Ti substrate.The ...The cantilever bending test,particularly monitored by an acoustic emission technique, was adopted to measure the tensile and interfacial adhesive strengths of the HCD ion plated fine TiN film on pure Ti substrate.The behaviors of film damaging were found to be characterized by:an internal tensile stress which exceeded its tensile strength for TiN facing upward,and a shearing stress along film substrate interface which exceeded its adhesive strength for TiN facing downward.The measured tensile and adhcsive strengths are 603 and 242 MPa respectively.展开更多
The fraction of TiN/Si3N4 in the cross section was observed with scanning electric microscope （SEM）, and residual stresses of TiN coated on the surface of Si3N4 ceramic were measured with X-ray diffraction （XRD）.T...The fraction of TiN/Si3N4 in the cross section was observed with scanning electric microscope （SEM）, and residual stresses of TiN coated on the surface of Si3N4 ceramic were measured with X-ray diffraction （XRD）.The hardness of TiN film was measured, and bonding strength of TiN film coated on Si3N4 substrate was measured by scratching method. The formed mechanism of residual stress and the failure mechanism of the bonding interface in the film were analyzed, and the adhesion mechanism of TiN film was investigated preliminarily. The results show that residual stresses of TiN film are all behaved as compressive stress, and TiN film is represented smoothly with brittle fracture, which is closely bonded with Si3N4 substrate. TiN film has high hardness and bonding strength of about 500 MPa, which could satisfy usage requests of the surface of cutting Si3N4 ceramic.展开更多
Cu-W thin film with high W content was deposited by dual-target DC-magnetron co-sputtering technology.Effects of the substrates surface treating technique on the adhesive strength of Cu-W thin films were studied.It is...Cu-W thin film with high W content was deposited by dual-target DC-magnetron co-sputtering technology.Effects of the substrates surface treating technique on the adhesive strength of Cu-W thin films were studied.It is found that the technique of ion beam assisting bombardment implanting of W particles can remarkably improve the adhesive property of Cu-W thin films. Indentation and scratching test show that,the critical load is doubled over than the sample only sputter-cleaned by ion beam.The enhancing mechanism of ion beam assisting bombardment implanting of Cu-W thin films was analyzed.With the help of mid-energy Ar+ion beam,W atoms can diffuse into the Fe-substrate surface layer;Fe atoms in the substrate surface layer and W atoms interlace with one another;and microcosmic mechanical meshing and diffusing combination on atom-scale among the Fe and W atoms through the film/substrate interface can be formed.The wettability and thermal expansion properties of the W atoms diffusion zone containing plentiful W atoms are close to those of pure W or W-based Cu-W film.展开更多
A novel co-sputtering method that combined magnetron sputtering (MS) with ion beam sputtering (IBS) was used to fabricate CuCr alloy films without breaking vacuum after depositing diffusion barrier with IBS. Different...A novel co-sputtering method that combined magnetron sputtering (MS) with ion beam sputtering (IBS) was used to fabricate CuCr alloy films without breaking vacuum after depositing diffusion barrier with IBS. Different bombardment energies were used to improve the comprehensive properties of Cu alloy film. The results indicated that the effects of diffusion barriers and bombardment energy on adhesive strength could be evaluated by a rolling contact fatigue adhesion test. Diffusion barrier can enhance the adhesive strength, and the adhesion of CuCr/CrN was higher than that of CuCr/TiN. When bombarding energy was higher, the adhesive strength of CuCr/TiN films was higher due to the broader transition zone.展开更多
Large advancement has been made in understanding the nucleation and growth of chemical vapor deposition （CVD） diamond, but the adhesion of CVD diamond to substrates is poor and there is no good method for quantitati...Large advancement has been made in understanding the nucleation and growth of chemical vapor deposition （CVD） diamond, but the adhesion of CVD diamond to substrates is poor and there is no good method for quantitative evaluation of the adhesive strength. The blister test is a potentially powerful tool for characterizing the mechanical properties of diamond films. In this test, pressure was applied on a thin membrane and the out-of-plane deflection of the membrane center was measured. The Young＇s modulus, residual stress, and adhesive strength were simultaneously determined using the load-deflection behavior of a membrane. The free-standing window sample of diamond thin films was fabricated by means of photolithography and anisotropic wet etching. The research indicates that the adhesive strength of diamond thin films is 4.28±0.37 J/m^2. This method uses a simple apparatus, and the fabrication of samples is very easy.展开更多
Film-substrate’s interfacial bonding strength is closely related to film quality. An excellent interfacial bonding strength is the premise for the well use of film. The laser detecting technique of discrete scratches...Film-substrate’s interfacial bonding strength is closely related to film quality. An excellent interfacial bonding strength is the premise for the well use of film. The laser detecting technique of discrete scratches based on laser shockwave effect is a new method, which can measure interfacial bonding strength. With this technique, film-substrate system is of transient load of different laser energy, the relation between the dynamic response characteristics of such film-substrate system and film-substrate’s interfacial bonding strength is a core problem to be solved urgently. On this basis, this paper conducted research on the dynamic response characteristics of film-substrate system during laser loading process using detecting technique of PVDF patch sensor. Results show that under the irradiation of different laser energy, it can detect dynamic responses of theory models of different film-substrate system using PVDF patch sensor, wherein shockwave dynamic response and dynamic strain response are included. Laser energy and interfacial bonding strength are of a regular influence to the dynamic response of film-substrate system theory model.展开更多
A kind of W/DLC/W-S-C composite film was fabricated by magnetron sputtering method.Effects of WSx content on the structure and the adhesion of the composite films were investigated.In addition,tribological behavior of...A kind of W/DLC/W-S-C composite film was fabricated by magnetron sputtering method.Effects of WSx content on the structure and the adhesion of the composite films were investigated.In addition,tribological behavior of the composite films was studied in the conditions of the ambient air and N2 gas atmosphere by ball-on-disk tester.The results indicate that the composite films show dense and amorphous microstructure.The WCx and WSx compounds are found in amorphous diamond like carbon matrix in the top layers of W-S-C.A proper WSx content is beneficial for improving the adhesion of the composite films.In air atmosphere,the composite films with high C content have better wear resistance and the friction coefficients range from 0.15 to 0.25.In N2 condition,high WSx content is benefit for the wear resistance and the friction coefficients of the composite films range from 0.03 to 0.1.展开更多
Amorphous Si O2（a-Si O2） films were synthesized on WC-Co substrates with H2 and tetraethoxysilane（TEOS） via pyrolysis of molecular precursor.X-ray diffraction（XRD） pattern shows that silicon-cobalt compounds for...Amorphous Si O2（a-Si O2） films were synthesized on WC-Co substrates with H2 and tetraethoxysilane（TEOS） via pyrolysis of molecular precursor.X-ray diffraction（XRD） pattern shows that silicon-cobalt compounds form at the interface between a-Si O2 films and WC-Co substrates.Moreover,it is observed by transmission electron microscope（TEM） that the a-Si O2 films are composed of hollow mirco-spheroid a-Si O2 particles.Subsequently,the a-Si O2 films are used as intermediate films and chemical vapor deposition（CVD） diamond films are deposited on them.Indentation tests were performed to evaluate the adhesion of bi-layer（a-Si O2 ＋ diamond） films on cemented carbide substrates.And the cutting performance of bi-layer（a-Si O2 ＋ diamond） coated inserts was evaluated by machining the glass fiber reinforced plastic（GFRP）.The results show that a-Si O2 interlayers can greatly improve the adhesive strength of diamond films on cemented carbide inserts;furthermore,thickness of the a-Si O2 interlayers plays a significant role in their effectiveness on adhesion enhancement of diamond films.展开更多
Flexible electrode films play critical and fundamental roles in the successful development of flexible electronic devices. In this study, carbon nanotubes（CNTs） were implanted into silver（Ag） ink to enhance the el...Flexible electrode films play critical and fundamental roles in the successful development of flexible electronic devices. In this study, carbon nanotubes（CNTs） were implanted into silver（Ag） ink to enhance the electrical conductivity and the reliability of the printed Ag electrode films. The fabricated carbon nanotubes-enriched silver（Ag-CNTs） electrode films were printed on the polyimide substrates by a facile screen printing method and sintered at a relatively low temperature. The resistivity of Ag-CNTs films was decreased by 62.27% compared with the pure Ag film. Additionally, the Ag-CNTs films exhibited excellent flexibility under a bending radius of 4 mm（strain ε = 2.09%） over 1000 cycles. Furthermore, the Ag-CNTs film displayed unchangeable electrical conductivity together with a strong adhesion after an accelerated aging test with 500 thermal shock cycles. These improvements were attributed to the AgCNTs interconnected network structure, which can provide electronic transmission channels and prevent cracks from initiating and propagating.展开更多
基金financially supported by the National Natural Science Foundation of China(Nos.5132100351322104+6 种基金51201123 and 51571157)the National Basic Research Program of China(No.2010CB631003)the 111 Project of China(No.B06025)the support from Fundamental Research Funds for the Central UniversitiesTengfei Scholar projectChina Postdoctoral Science Foundation(No.2012M521765)Shaanxi Province Postdoctoral Scientific Research Projects for part of financial support
文摘An approach based on film buckling under simple uniaxial tensile testing was utilized in this paper to quan- titatively estimate the interfacial energy of the nanostructured multilayer films （NMFs） adherent to flexible substrates. The interfacial energies of polyimide-supported NMFs are determined to be ~ 5.0 J/m2 for Cu/Cr, ~4.1 J/m2 for Cu/Ta, ~ 2.8 J/m2 for Cu/Mo, ~ 1.1 J/m2 for Cu/Nb, and ~ 1.2 J/m2 for Cu/Zr NMFs. Furthermore, a linear relationship between the adhesion energy and the interfacial shear strength is clearly demonstrated for the Cu-based NMFs, which is highly indicative of the applicability and reliability of the modified models.
基金This project is Supported by National Science Foundation of China (No.59475090)National Science Foundation of USA (No.DDM-93-9669)
文摘Premature failure of coated tool often results from a poor adhesion of coating-substrate and shortens the lifetime of the tool. The results of increasing the adhesion strength of thin film coatings on cutting tool inserts by pretreating the inserts with sandblasting technique to obtain a desirable surface morphology of the inserts are presented. A geometric model representing the ideal surface morphology is established to enhance the nucleation density and adhesion strength of coating-substrate. Thin film coating experiment is conducted on the substrates of four different sample groups. Indentation and wear tests are performed on coated inserts to evaluate the effect of sandblasting on the adhesion strength of the coatings. A theoretical analysis is provided on the formation and growth of atom clusters in terms of the contact angle and the thermodynamic barrier of a substrate to predict thin film nucleation.
文摘The cantilever bending test,particularly monitored by an acoustic emission technique, was adopted to measure the tensile and interfacial adhesive strengths of the HCD ion plated fine TiN film on pure Ti substrate.The behaviors of film damaging were found to be characterized by:an internal tensile stress which exceeded its tensile strength for TiN facing upward,and a shearing stress along film substrate interface which exceeded its adhesive strength for TiN facing downward.The measured tensile and adhcsive strengths are 603 and 242 MPa respectively.
文摘The fraction of TiN/Si3N4 in the cross section was observed with scanning electric microscope （SEM）, and residual stresses of TiN coated on the surface of Si3N4 ceramic were measured with X-ray diffraction （XRD）.The hardness of TiN film was measured, and bonding strength of TiN film coated on Si3N4 substrate was measured by scratching method. The formed mechanism of residual stress and the failure mechanism of the bonding interface in the film were analyzed, and the adhesion mechanism of TiN film was investigated preliminarily. The results show that residual stresses of TiN film are all behaved as compressive stress, and TiN film is represented smoothly with brittle fracture, which is closely bonded with Si3N4 substrate. TiN film has high hardness and bonding strength of about 500 MPa, which could satisfy usage requests of the surface of cutting Si3N4 ceramic.
基金Project(05JJ3005)supported by the Natural Science Foundation of Hunan Province,China
文摘Cu-W thin film with high W content was deposited by dual-target DC-magnetron co-sputtering technology.Effects of the substrates surface treating technique on the adhesive strength of Cu-W thin films were studied.It is found that the technique of ion beam assisting bombardment implanting of W particles can remarkably improve the adhesive property of Cu-W thin films. Indentation and scratching test show that,the critical load is doubled over than the sample only sputter-cleaned by ion beam.The enhancing mechanism of ion beam assisting bombardment implanting of Cu-W thin films was analyzed.With the help of mid-energy Ar+ion beam,W atoms can diffuse into the Fe-substrate surface layer;Fe atoms in the substrate surface layer and W atoms interlace with one another;and microcosmic mechanical meshing and diffusing combination on atom-scale among the Fe and W atoms through the film/substrate interface can be formed.The wettability and thermal expansion properties of the W atoms diffusion zone containing plentiful W atoms are close to those of pure W or W-based Cu-W film.
基金the Natural Science Foundation of China for its financial support under the granted No.59931010.
文摘A novel co-sputtering method that combined magnetron sputtering (MS) with ion beam sputtering (IBS) was used to fabricate CuCr alloy films without breaking vacuum after depositing diffusion barrier with IBS. Different bombardment energies were used to improve the comprehensive properties of Cu alloy film. The results indicated that the effects of diffusion barriers and bombardment energy on adhesive strength could be evaluated by a rolling contact fatigue adhesion test. Diffusion barrier can enhance the adhesive strength, and the adhesion of CuCr/CrN was higher than that of CuCr/TiN. When bombarding energy was higher, the adhesive strength of CuCr/TiN films was higher due to the broader transition zone.
文摘Large advancement has been made in understanding the nucleation and growth of chemical vapor deposition （CVD） diamond, but the adhesion of CVD diamond to substrates is poor and there is no good method for quantitative evaluation of the adhesive strength. The blister test is a potentially powerful tool for characterizing the mechanical properties of diamond films. In this test, pressure was applied on a thin membrane and the out-of-plane deflection of the membrane center was measured. The Young＇s modulus, residual stress, and adhesive strength were simultaneously determined using the load-deflection behavior of a membrane. The free-standing window sample of diamond thin films was fabricated by means of photolithography and anisotropic wet etching. The research indicates that the adhesive strength of diamond thin films is 4.28±0.37 J/m^2. This method uses a simple apparatus, and the fabrication of samples is very easy.
文摘Film-substrate’s interfacial bonding strength is closely related to film quality. An excellent interfacial bonding strength is the premise for the well use of film. The laser detecting technique of discrete scratches based on laser shockwave effect is a new method, which can measure interfacial bonding strength. With this technique, film-substrate system is of transient load of different laser energy, the relation between the dynamic response characteristics of such film-substrate system and film-substrate’s interfacial bonding strength is a core problem to be solved urgently. On this basis, this paper conducted research on the dynamic response characteristics of film-substrate system during laser loading process using detecting technique of PVDF patch sensor. Results show that under the irradiation of different laser energy, it can detect dynamic responses of theory models of different film-substrate system using PVDF patch sensor, wherein shockwave dynamic response and dynamic strain response are included. Laser energy and interfacial bonding strength are of a regular influence to the dynamic response of film-substrate system theory model.
文摘A kind of W/DLC/W-S-C composite film was fabricated by magnetron sputtering method.Effects of WSx content on the structure and the adhesion of the composite films were investigated.In addition,tribological behavior of the composite films was studied in the conditions of the ambient air and N2 gas atmosphere by ball-on-disk tester.The results indicate that the composite films show dense and amorphous microstructure.The WCx and WSx compounds are found in amorphous diamond like carbon matrix in the top layers of W-S-C.A proper WSx content is beneficial for improving the adhesion of the composite films.In air atmosphere,the composite films with high C content have better wear resistance and the friction coefficients range from 0.15 to 0.25.In N2 condition,high WSx content is benefit for the wear resistance and the friction coefficients of the composite films range from 0.03 to 0.1.
基金Project(20130073110036)supported by the Research Fund for the Doctoral Program of Higher Education of China
文摘Amorphous Si O2（a-Si O2） films were synthesized on WC-Co substrates with H2 and tetraethoxysilane（TEOS） via pyrolysis of molecular precursor.X-ray diffraction（XRD） pattern shows that silicon-cobalt compounds form at the interface between a-Si O2 films and WC-Co substrates.Moreover,it is observed by transmission electron microscope（TEM） that the a-Si O2 films are composed of hollow mirco-spheroid a-Si O2 particles.Subsequently,the a-Si O2 films are used as intermediate films and chemical vapor deposition（CVD） diamond films are deposited on them.Indentation tests were performed to evaluate the adhesion of bi-layer（a-Si O2 ＋ diamond） films on cemented carbide substrates.And the cutting performance of bi-layer（a-Si O2 ＋ diamond） coated inserts was evaluated by machining the glass fiber reinforced plastic（GFRP）.The results show that a-Si O2 interlayers can greatly improve the adhesive strength of diamond films on cemented carbide inserts;furthermore,thickness of the a-Si O2 interlayers plays a significant role in their effectiveness on adhesion enhancement of diamond films.
基金supported financially by the Joint Funds of the National Natural Science Foundation of China (Grant No. U1601213)the National Natural Science Foundation of China (Grant No. 51601005)the Fundamental Research Funds for the Central Universities.
文摘Flexible electrode films play critical and fundamental roles in the successful development of flexible electronic devices. In this study, carbon nanotubes（CNTs） were implanted into silver（Ag） ink to enhance the electrical conductivity and the reliability of the printed Ag electrode films. The fabricated carbon nanotubes-enriched silver（Ag-CNTs） electrode films were printed on the polyimide substrates by a facile screen printing method and sintered at a relatively low temperature. The resistivity of Ag-CNTs films was decreased by 62.27% compared with the pure Ag film. Additionally, the Ag-CNTs films exhibited excellent flexibility under a bending radius of 4 mm（strain ε = 2.09%） over 1000 cycles. Furthermore, the Ag-CNTs film displayed unchangeable electrical conductivity together with a strong adhesion after an accelerated aging test with 500 thermal shock cycles. These improvements were attributed to the AgCNTs interconnected network structure, which can provide electronic transmission channels and prevent cracks from initiating and propagating.
