据韩媒报导,苹果（Apple）决定将iPhone 7行动应用处理器（AP）A10交由台积电代工,关键在于台积电拥有后段制程竞争力。台积电具备扇出型晶圆级封装（Fan-out WLP;FoWLP）技术,将其称为整合型扇型封装（Intgrated Fan Out;InFO）。FoWL...据韩媒报导,苹果（Apple）决定将iPhone 7行动应用处理器（AP）A10交由台积电代工,关键在于台积电拥有后段制程竞争力。台积电具备扇出型晶圆级封装（Fan-out WLP;FoWLP）技术,将其称为整合型扇型封装（Intgrated Fan Out;InFO）。FoWLP封装在技术上最大特点是无需使用印刷电路板（PCB）,加上I/O Port能弹性扩充、封装面积较小等优点,能大幅降低生产成本,且性能更佳提升。展开更多
A transformer-in-package(TiP)isolated direct current-direct current(DC-DC)converter using glass-based fan-out wafer-level packaging(FOWLP)is proposed.By using 3-layer redistribution layers(RDLs),both the transformer a...A transformer-in-package(TiP)isolated direct current-direct current(DC-DC)converter using glass-based fan-out wafer-level packaging(FOWLP)is proposed.By using 3-layer redistribution layers(RDLs),both the transformer and interconnections are built without an additional transformer chip,and the converter only has 2 dies:a transmitter(TX)chip and a receiver(RX)chip.The proposed solution results in a significant reduction in the cost and makes major improvements in the form factor and power density.Moreover,the transformer built by the RDLs achieves a high quality factor(Q)and high coupling factor(k),and the efficiency of the converter is thus improved.The TX and RX chips were implemented in a 0.18μm Biopolar CMOS DMOS(BCD)process and embedded in a compact package with a size of 5 mm×5 mm.With an output capacitance of 10μF,the converter achieves a peak efficiency of 46.5%at 0.3 W output power and a maximum delivery power of 1.25 W,achieving a maximum power density of 50 mW/mm2.展开更多
基金supported in part by the National Natural Science Foundation of China(62104220)in part by the National Key Research and Development Program of China(2019YFB2204800).
文摘A transformer-in-package(TiP)isolated direct current-direct current(DC-DC)converter using glass-based fan-out wafer-level packaging(FOWLP)is proposed.By using 3-layer redistribution layers(RDLs),both the transformer and interconnections are built without an additional transformer chip,and the converter only has 2 dies:a transmitter(TX)chip and a receiver(RX)chip.The proposed solution results in a significant reduction in the cost and makes major improvements in the form factor and power density.Moreover,the transformer built by the RDLs achieves a high quality factor(Q)and high coupling factor(k),and the efficiency of the converter is thus improved.The TX and RX chips were implemented in a 0.18μm Biopolar CMOS DMOS(BCD)process and embedded in a compact package with a size of 5 mm×5 mm.With an output capacitance of 10μF,the converter achieves a peak efficiency of 46.5%at 0.3 W output power and a maximum delivery power of 1.25 W,achieving a maximum power density of 50 mW/mm2.
