This paper proposes a new eddy current method, named equivalent unit method （EUM）, for the thickness measurement of the top copper film ofmultilayer interconnects in the chemical mechanical polishing （CMP） process...This paper proposes a new eddy current method, named equivalent unit method （EUM）, for the thickness measurement of the top copper film ofmultilayer interconnects in the chemical mechanical polishing （CMP） process, which is an important step in the integrated circuit （IC） manufacturing. The influence of the underneath circuit layers on the eddy current is modeled and treated as an equivalent film thickness. By subtracting this equivalent film component, the accuracy of the thickness measure- ment of the top copper layer with an eddy current sensor is improved and the absolute error is 3 nm for sampler measurement.展开更多
文摘This paper proposes a new eddy current method, named equivalent unit method （EUM）, for the thickness measurement of the top copper film ofmultilayer interconnects in the chemical mechanical polishing （CMP） process, which is an important step in the integrated circuit （IC） manufacturing. The influence of the underneath circuit layers on the eddy current is modeled and treated as an equivalent film thickness. By subtracting this equivalent film component, the accuracy of the thickness measure- ment of the top copper layer with an eddy current sensor is improved and the absolute error is 3 nm for sampler measurement.
