The unclear interfacial characteristics of Ag/Cu interface during diffusion welding limit the improvement of mechanical properties of Ag/Cu bimetallic strips.The growth orientation and evolution of Ag and Cu crystals ...The unclear interfacial characteristics of Ag/Cu interface during diffusion welding limit the improvement of mechanical properties of Ag/Cu bimetallic strips.The growth orientation and evolution of Ag and Cu crystals between Ag and Cu strips were investigated by electron backscatter diffraction(EBSD)analysis,and the interfacial properties of various Ag/Cu interfacial configurations were calculated using first-principles calculations to elucidate the diversified interfacial characteristics.Three interface bonding states,including Ag(100)/Cu(100),Ag(110)/Cu(110)and Ag(111)/Cu(111),were preferentially formed in Ag/Cu bimetallic strips during roll bonding.The intensity of Ag(100)/Cu(100)interface increases with the increasing deformation amounts during cold rolling,accompanied by the decreased intensity of Ag(110)/Cu(110)and Ag(111)/Cu(111)interfaces.The largest adsorption work and lowest interface energy of Ag(100)/Cu(100)interface at the“center”position reveal the transition from Ag(110)/Cu(110)and Ag(111)/Cu(111)interfaces to Ag(100)/Cu(100)interface.展开更多
Preferential oxidation of CO(CO-PROX)in H_(2)-rich streams is highly important for purifying the industrial grade H_(2)used in proton-exchange-membrane fuel cells(PEMFC),but it is still limited to a relatively narrow ...Preferential oxidation of CO(CO-PROX)in H_(2)-rich streams is highly important for purifying the industrial grade H_(2)used in proton-exchange-membrane fuel cells(PEMFC),but it is still limited to a relatively narrow operation temperature window.In this study,the trace amounts of Cu are used to modify a Pt/Al_(2)O_(3)catalyst.The introduced Cu_(2+)species are atomically anchored on Pt nanoparticles through strong electrostatic adsorption.展开更多
A nickel-based coating was deposited on the pure Al substrate by immersion plating,and the Al/Cu bimetals were prepared by diffusion bonding in the temperature range of 450-550 ℃.The interce microstructure and fractu...A nickel-based coating was deposited on the pure Al substrate by immersion plating,and the Al/Cu bimetals were prepared by diffusion bonding in the temperature range of 450-550 ℃.The interce microstructure and fracture surface of Al/Cu joints were studied by scanning electron microscopy（SEM） and X-ray diffraction（XRD）.The mechanical properties of the Al/Cu bimetals were measured by tensile shear and microhardness tests.The results show that the Ni interiayer can effectively eliminate the formation of Al-Cu intermetallic compounds.The Al/Ni interface consists of the Al3Ni and Al3Ni2 phases,while it is Ni-Cu solid solution at the Ni/Cu interce.The tensile shear strength of the joints is improved by the addition of Ni interiayer.The joint with Ni interiayer annealed at 500 ℃ exhibits a maximum value of tensile shear strength of 34.7 MPa.展开更多
The matrix accumulative roll bonding technology （MARB） can improve the matrix performance of metal composite and strengthen the bonding quality of the interface./n this research, for the fwst time, the technology of...The matrix accumulative roll bonding technology （MARB） can improve the matrix performance of metal composite and strengthen the bonding quality of the interface./n this research, for the fwst time, the technology of MARB was proposed. A sound Cu/AI bonding composite was obtained using the MARB process and the bonding characteristic of the interface was studied using scanning electricity microscope （SEM） and energy-dispersive spectroscopy （EDS）. The result indicated that accumulation cycles and diffusion annealing temperature were the most important factors for fabricating a Cu/AI composite material. The substrate aluminum was strengthened by MARB, and a high quality Cu/AI composite with sound interface was obtained as well.展开更多
Cu/Al bar clad material was fabricated by a drawing process and a subsequent heat treatment.During these processes,intermetallic compounds have been formed at the interface of Cu/Al and have affected its bonding prope...Cu/Al bar clad material was fabricated by a drawing process and a subsequent heat treatment.During these processes,intermetallic compounds have been formed at the interface of Cu/Al and have affected its bonding property.Microstructures of Cu/Al interfaces were observed by OM,SEM and EDX Analyser in order to investigate the bonding properties of the material.According to the microstructure a series of diffusion layers were observed at the interface and the thicknesses of diffusion layers have increased with aging time as a result of the diffusion bonding.The interfaces were composed of 3-ply diffusion layers and their compositions were changed with aging time at 400 °C.These compositional compounds were revealed to be η2,(θ+η2),(α+θ) intermetallic phases.It is evident from V-notch impact tests that the growth of the brittle diffusion layers with the increasing aging time directly influenced delamination distance between the Cu sleeve and the Al core.It is suggested that the proper holding time at 400 °C for aging as post heat treatment of a drawn Cu/Al bar clad material would be within 1 h.展开更多
For the immiscible Mo/Cu system with a positive heat of mixing （△Hm 〉 0）, building metallurgical bonding interfaces directly between immiscible Mo and Cu and preparing Mo/Cu laminar metal matrix composites （LMMCs...For the immiscible Mo/Cu system with a positive heat of mixing （△Hm 〉 0）, building metallurgical bonding interfaces directly between immiscible Mo and Cu and preparing Mo/Cu laminar metal matrix composites （LMMCs） are very difficult. To solve the problem, a new alloying method for immiscible systems, which is named as irradiation damage alloying （IDA）, is presented in this paper. The IDA primarily consists of three steps. Firstly, Mo is damaged by irradiation with multi-energy （186, 62 keV） Cu ion beams at a dose of 2× 1017 ions/cm2. Secondly, Cu layers are superimposed on the surfaces of the irradiation-damaged Mo to obtain Mo]Cu laminated specimens. Thirdly, the irradiation damage induces the diffusion alloying between Mo and Cu when the laminated specimens are annealed at 950 ℃ in a protective atmosphere. Through IDA, Mo/Cu LMMCs are prepared in this paper. The tensile tests carried out for the Mo/Cu LMMCs specimens show that the Mo/Cu interfaces constructed via IDA have high normal and shear strengths. Additionally, the microstructure of the Mo/Cu interface is characterized by High Resolution Transmission Electron Microscopy （HRTEM）, X-ray diffraction （XRD） and Energy Dispersive X-ray （EDX） attached in HRTEM. The microscopic characterization results show that the expectant diffusion between Mo and Cu occurs through the irradiation damage during the process of IDA. Thus a Mo/Cu metallurgical bonding interface successfully forms. Moreover, the microscopic test results show that the Mo/Cu metallurgical interface is mainly constituted of crystalline phases with twisted and tangled lattices, and amorphous phase is not observed. Finally, based on the positron annihilation spectroscopy （PAS） and HRTEM results, the diffusion mechanism of IDA is discussed and determined to be vacancy assisted diffusion.展开更多
Graphene-reinforced Mg matrix composites suffer seriously from the weak Mg/graphene interfacial bonding.In this study,a first-principles study was performed to evaluate the feasibility of improving the Mg/graphene bon...Graphene-reinforced Mg matrix composites suffer seriously from the weak Mg/graphene interfacial bonding.In this study,a first-principles study was performed to evaluate the feasibility of improving the Mg/graphene bonding using an in-situ formed intermediate MgO layer.The calculated interface adhesion strengths suggested a relative ordering(from high to low)of Mg(0001)/MgO(11−1)>MgO(11−1)/graphene>Mg(0001)/graphene.The enhanced Mg/MgO/graphene interface bonding can be attributed to the newly formed strong ionic and covalent interactions at the Mg/MgO and the MgO/graphene interfaces,respectively,which replace the otherwise very weak van der Waals bonding between Mg and graphene.展开更多
Cu/Al clad strips are prepared using solid?liquid cast-rolling bonding(SLCRB)technique with a d160mm×150mm twin-roll experimental caster.The extent of interfacial reactions,composition of the reaction products,an...Cu/Al clad strips are prepared using solid?liquid cast-rolling bonding(SLCRB)technique with a d160mm×150mm twin-roll experimental caster.The extent of interfacial reactions,composition of the reaction products,and their micro-morphology evolution in the SLCRB process are investigated with scanning electron microscope(SEM),energy dispersive spectrometer(EDS),and X-ray diffraction(XRD).In the casting pool,initial aluminized coating is first generated on the copper strip surface,with the diffusion layer mainly consisting ofα(Al)+CuAl2and growing at high temperatures,with the maximum thickness of10μm.After sequent rolling below the kiss point,the diffusion layer is broken by severe elongation,which leads to an additional crack bond process with a fresh interface of virgin base metal.The average thickness is reduced from10to5μm.The reaction products,CuAl2,CuAl,and Cu9Al4,are dispersed along the rolling direction.Peeling and bending test results indicate that the fracture occurs in the aluminum substrate,and the morphology is a dimple pattern.No crack or separation is found at the bonding interface after90°-180°bending.The presented method provides an economical way to fabricate Cu/Al clad strip directly.展开更多
The atomic structure of the active sites in Cu/CeO2 catalysts is intimately associated with the copper-ceria interaction. Both the shape of ceria and the loading of copper affect the chemical bonding of copper species...The atomic structure of the active sites in Cu/CeO2 catalysts is intimately associated with the copper-ceria interaction. Both the shape of ceria and the loading of copper affect the chemical bonding of copper species on ceria surfaces and the electronic and geometric character of the relevant interfaces. Nanostructured ceria, including particles(polyhedra), rods, and cubes, provides anchoring sites for the copper species. The atomic arrangements and chemical properties of the(111),(110) and(100) facets, preferentially exposed depending on the shape of ceria, govern the copper-ceria interactions and in turn determine their catalytic properties. Also, the metal loading significantly influences the dispersion of copper species on ceria with a specific shape, forming copper layers, clusters, and nanoparticles. Lower copper contents result in copper monolayers and/or bilayers while higher copper loadings lead to multi-layered clusters and faceted particles. The active sites are usually generated via interactions between the copper atoms in the metal species and the oxygen vacancies on ceria, which is closely linked to the number and density of surface oxygen vacancies dominated by the shape of ceria.展开更多
The properties of Sc-dopedθ′(Al_(2)Cu)/Al interface in Al−Cu alloys were investigated by first-principles calculations.Sc-doped semi-coherent and coherentθ′(Al_(2)Cu)/Al interfaces(Sc doped in Al slab(S1 site),Sc ...The properties of Sc-dopedθ′(Al_(2)Cu)/Al interface in Al−Cu alloys were investigated by first-principles calculations.Sc-doped semi-coherent and coherentθ′(Al_(2)Cu)/Al interfaces(Sc doped in Al slab(S1 site),Sc doped inθ′slab(S2 site))were modeled based on calculated results and reported experiments.Through the analysis of interfacial bonding strength,it is revealed that the doping of Sc at S1 site can significantly decrease the interface energy and increase the work of adhesion.In particular,the doped coherent interface with Sc at S1 site which is occupied by interstitial Cu atoms has very good bonding strength.The electronic structure shows the strong Al—Cu bonds at the interfaces with Sc at S1 site,and the Al—Al bonds at the interfaces with Sc at S2 site are formed.The formation of strong Al—Cu and Al—Al bonds plays an important role in the enhancement of doped interface strength.展开更多
Based on theoretical analyses, the effect of electric current density on stability of solidification interface morphology of QAl 4 alloy was studied experimentally. The results show that the experimental results agree...Based on theoretical analyses, the effect of electric current density on stability of solidification interface morphology of QAl 4 alloy was studied experimentally. The results show that the experimental results agree well with the theoretical analyses, and the following conclusions can be drawn: the increase of electric current density improves the stability of the solidification interface morphology under the condition of no convection of the liquid metal. Otherwise this convection will slow down the trend of solidification interface developing to stability caused by increasing electric current density.展开更多
Cu2ZnSnS（e）4 （CZTS（e）） solar cells have attracted much attention due to the elemental abundance and the non- toxicity. However, the record efficiency of 12.6% for CuzZnSn（S,Se）4 （CZTSSe） solar cells is much ...Cu2ZnSnS（e）4 （CZTS（e）） solar cells have attracted much attention due to the elemental abundance and the non- toxicity. However, the record efficiency of 12.6% for CuzZnSn（S,Se）4 （CZTSSe） solar cells is much lower than that of Cu（In,Ga）See （CIGS） solar cells. One crucial reason is the recombination at interfaces. In recent years, large amount inves- tigations have been done to analyze the interfacial problems and improve the interfacial properties via a variety of methods. This paper gives a review of progresses on interfaces of CZTS（e） solar cells, including： （i） the band alignment optimization at buffer/CZTS（e） interface, （ii） tailoring the thickness of MoS（e）2 interfacial layers between CZTS（e） absorber and Mo back contact, （iii） the passivation of rear interface, （iv） the passivation of front interface, and （v） the etching of secondary phases.展开更多
The effects of reduction ratio during roll bonding on the microstructural evolution at interface and subsequent mechanical properties of roll-bonded Al/Cu 2-ply sheets were investigated. The interface microstructures ...The effects of reduction ratio during roll bonding on the microstructural evolution at interface and subsequent mechanical properties of roll-bonded Al/Cu 2-ply sheets were investigated. The interface microstructures for several Al/Cu 2-ply sheets fabricated under different reduction ratios between 30% and 65% were verified by transmission electron microscopy(TEM). Taking the difference of interface microstructure into consideration, 3-point bending and peel tests were performed for obtaining flexural and bonding strengths for Al/Cu 2-ply sheets. The effect of the quantified areas of metallurgical bonding at interfaces on the bonding strength was also discussed. The results show that both the bonding and flexural strengths for Al/Cu 2-ply sheets are reduced by decreasing the reduction ratio during the roll bonding process, which is strongly correlated with the interface microstructure. This was especially verified by observing the interface delamination from the 3-point bent samples.展开更多
The motion of intervariant intedeces under the action of applied stress in the internally faulted 18R martensite in a Cu-Zn-Al shape memory alloy has been studied. Transmission electron microscopy in situ observations...The motion of intervariant intedeces under the action of applied stress in the internally faulted 18R martensite in a Cu-Zn-Al shape memory alloy has been studied. Transmission electron microscopy in situ observations show that the interfaces between 24 martensite variants have different reaction to applied stress. The A/C type and A/B type interfaces have good mobil-ity, the A/D type interface has bad mobiIity, and the different-group-intervariant interfaces are basically immobile.展开更多
Al/Cu laminate composite was fabricated based on hot press sintering using Cu sheet and Al powders as raw materials.The effects of sintering parameters on interfacial structure and mechanical properties were investiga...Al/Cu laminate composite was fabricated based on hot press sintering using Cu sheet and Al powders as raw materials.The effects of sintering parameters on interfacial structure and mechanical properties were investigated.The results revealed that a uniform Al/Cu interface with excellent bonding quality was achieved.The thickness of intermetallic compounds(IMCs)reached 33.88μm after sintering at 620℃for 2 h,whereas it was only 14.88μm when sintered at 600℃for 1 h.AlCu phase was developed through the reaction between Al4Cu9 and Al2Cu with prolonging sintering time,and an amorphous oxide strip formed at AlCu/Al4Cu9 interface.Both the grain morphology and interfacial structure affected the tensile strength of Al/Cu laminate,whereas the mode of tensile fracture strongly relied on the interfacial bonding strength.The highest tensile strength of 151.1 MPa and bonding strength of 93.7 MPa were achieved after sintering at 600℃for 1 h.展开更多
Electronic structure and spin-related state coupling at ferromagnetic material （FM）/MgO （FM = Fe, CoFe, CoFeB） interfaces under biaxial strain are evaluated using the first-principles calculations. The CoFeB/MgO i...Electronic structure and spin-related state coupling at ferromagnetic material （FM）/MgO （FM = Fe, CoFe, CoFeB） interfaces under biaxial strain are evaluated using the first-principles calculations. The CoFeB/MgO interface, which is su- perior to the Fe/MgO and CoFe/MgO interfaces, can markedly maintain stable and effective coupling channels for majority- spin A1 state under large biaxial strain. Bonding interactions between Fe, Co, and B atoms and the electron transfer between Bloch states are responsible for the redistribution of the majority-spin A1 state, directly influencing the coupling effect for the strained interfaces. Layer-projected wave function of the majority-spin Al state suggests slower decay rate and more stable transport property in the CoFeB/MgO interface, which is expected to maintain a higher tunneling magnetoresistance （TMR） value under large biaxial strain. This work reveals the internal mechanism for the state coupling al strained FM/MgO interfaces. This study may provide some references to the design and manufacturing of magnetic tunnel .junctions with high tunneling magnetoresistance effect.展开更多
The atom (Ag,Cu) diffusion behavior and the effect of technology on the interface of rolled Ag/Cu composite contact were investigated. The concentration of Ag and Cu atoms near the interface was determined with electr...The atom (Ag,Cu) diffusion behavior and the effect of technology on the interface of rolled Ag/Cu composite contact were investigated. The concentration of Ag and Cu atoms near the interface was determined with electron probe. The bonding strength of composite interface was tested and the fracture in tensile sample was observed by SEM. The results show that there was inter diffusion of Ag and Cu atoms on the interface, which formed compact layer with high bonding strength of 98 MPa. The practical application proved that the Ag/Cu composite interface is reliable.展开更多
The first-principles calculations are employed to investigate the electrical properties of polar MgO/BaTiO3（110）interfaces. Both n-type and p-type polar interfaces show a two-dimensional metallic behavior. For the n...The first-principles calculations are employed to investigate the electrical properties of polar MgO/BaTiO3（110）interfaces. Both n-type and p-type polar interfaces show a two-dimensional metallic behavior. For the n-type polar interface,the interface Ti3d electrons are the origin of the metallic and magnetic properties. Varying the thickness of Ba TiO3 may induce an insulator–metal transition, and the critical thickness is 4 unit cells. For the p-type polar interface, holes preferentially occupy the interface O 2p y state, resulting in a conducting interface. The unbalance of the spin splitting of the O 2p states in the interface Mg O layer leads to a magnetic moment of about 0.25μB per O atom at the interface.These results further demonstrate that other polar interfaces, besides LaAlO3/SrTiO3, can show a two-dimensional metallic behavior. It is helpful to fully understand the role of polar discontinuity on the properties of the interface, which widens the field of polar-nonpolar interfaces.展开更多
基金supported by the National Natural Science Foundation of China(No.52474401)the Project funded by the China Postdoctoral Science Foundation(No.2022M712919)+1 种基金Open Project of State Key Laboratory of Advanced Brazing Filler Metals and Technology(SKLABFMT-2021-03)Guangdong Basic and Applied Basic Research Foundation(2023A1515140124).
文摘The unclear interfacial characteristics of Ag/Cu interface during diffusion welding limit the improvement of mechanical properties of Ag/Cu bimetallic strips.The growth orientation and evolution of Ag and Cu crystals between Ag and Cu strips were investigated by electron backscatter diffraction(EBSD)analysis,and the interfacial properties of various Ag/Cu interfacial configurations were calculated using first-principles calculations to elucidate the diversified interfacial characteristics.Three interface bonding states,including Ag(100)/Cu(100),Ag(110)/Cu(110)and Ag(111)/Cu(111),were preferentially formed in Ag/Cu bimetallic strips during roll bonding.The intensity of Ag(100)/Cu(100)interface increases with the increasing deformation amounts during cold rolling,accompanied by the decreased intensity of Ag(110)/Cu(110)and Ag(111)/Cu(111)interfaces.The largest adsorption work and lowest interface energy of Ag(100)/Cu(100)interface at the“center”position reveal the transition from Ag(110)/Cu(110)and Ag(111)/Cu(111)interfaces to Ag(100)/Cu(100)interface.
基金financially supported by the National Key Research and Development Program of China(No.2022YFB3504200)the National Natural Science Foundation of China(Nos.U21A20326 and 22376063)+4 种基金the fund of the National Engineering Laboratory for Mobile Source Emission Control Technology(No.NELMS2020A05)the Fundamental Research Funds for the Central Universitiesthe funding received from the European Union's Horizon 2020 research and innovation program under the Marie Sklodowska-Curie grant agreement No 897197.Y.L.(CSC No.202006740085)is grateful for thegrant from the China Scholarship Councilthe ICREA Academia program and grants MICINN/FEDER PID2021124572OB-C31 and GC 2021 SGR 01061part of Maria de Maeztu Units of Excellence Programme CEX2023-001300-M/funded by MCIN/AEI/https://doi.org/10.13039/501100011033
文摘Preferential oxidation of CO(CO-PROX)in H_(2)-rich streams is highly important for purifying the industrial grade H_(2)used in proton-exchange-membrane fuel cells(PEMFC),but it is still limited to a relatively narrow operation temperature window.In this study,the trace amounts of Cu are used to modify a Pt/Al_(2)O_(3)catalyst.The introduced Cu_(2+)species are atomically anchored on Pt nanoparticles through strong electrostatic adsorption.
基金Projects (51274054,51375070,51271042) supported by the National Natural Science Foundation of ChinaProjects (2013M530913) supported by the China Postdoctoral Science Foundation
文摘A nickel-based coating was deposited on the pure Al substrate by immersion plating,and the Al/Cu bimetals were prepared by diffusion bonding in the temperature range of 450-550 ℃.The interce microstructure and fracture surface of Al/Cu joints were studied by scanning electron microscopy（SEM） and X-ray diffraction（XRD）.The mechanical properties of the Al/Cu bimetals were measured by tensile shear and microhardness tests.The results show that the Ni interiayer can effectively eliminate the formation of Al-Cu intermetallic compounds.The Al/Ni interface consists of the Al3Ni and Al3Ni2 phases,while it is Ni-Cu solid solution at the Ni/Cu interce.The tensile shear strength of the joints is improved by the addition of Ni interiayer.The joint with Ni interiayer annealed at 500 ℃ exhibits a maximum value of tensile shear strength of 34.7 MPa.
基金the National Natural Science Foundation of China (No. 50375019).
文摘The matrix accumulative roll bonding technology （MARB） can improve the matrix performance of metal composite and strengthen the bonding quality of the interface./n this research, for the fwst time, the technology of MARB was proposed. A sound Cu/AI bonding composite was obtained using the MARB process and the bonding characteristic of the interface was studied using scanning electricity microscope （SEM） and energy-dispersive spectroscopy （EDS）. The result indicated that accumulation cycles and diffusion annealing temperature were the most important factors for fabricating a Cu/AI composite material. The substrate aluminum was strengthened by MARB, and a high quality Cu/AI composite with sound interface was obtained as well.
基金Project supported by the Fundamental Materials Development funded by the Korean Ministry of Knowledge Economy
文摘Cu/Al bar clad material was fabricated by a drawing process and a subsequent heat treatment.During these processes,intermetallic compounds have been formed at the interface of Cu/Al and have affected its bonding property.Microstructures of Cu/Al interfaces were observed by OM,SEM and EDX Analyser in order to investigate the bonding properties of the material.According to the microstructure a series of diffusion layers were observed at the interface and the thicknesses of diffusion layers have increased with aging time as a result of the diffusion bonding.The interfaces were composed of 3-ply diffusion layers and their compositions were changed with aging time at 400 °C.These compositional compounds were revealed to be η2,(θ+η2),(α+θ) intermetallic phases.It is evident from V-notch impact tests that the growth of the brittle diffusion layers with the increasing aging time directly influenced delamination distance between the Cu sleeve and the Al core.It is suggested that the proper holding time at 400 °C for aging as post heat treatment of a drawn Cu/Al bar clad material would be within 1 h.
基金financially supported by the National Natural Science Foundation of China (Grant Nos. 51171128 and 51471114)the Key Technologies R & D Program of Tianjin (Grant No. 11ZCKFGX03800)
文摘For the immiscible Mo/Cu system with a positive heat of mixing （△Hm 〉 0）, building metallurgical bonding interfaces directly between immiscible Mo and Cu and preparing Mo/Cu laminar metal matrix composites （LMMCs） are very difficult. To solve the problem, a new alloying method for immiscible systems, which is named as irradiation damage alloying （IDA）, is presented in this paper. The IDA primarily consists of three steps. Firstly, Mo is damaged by irradiation with multi-energy （186, 62 keV） Cu ion beams at a dose of 2× 1017 ions/cm2. Secondly, Cu layers are superimposed on the surfaces of the irradiation-damaged Mo to obtain Mo]Cu laminated specimens. Thirdly, the irradiation damage induces the diffusion alloying between Mo and Cu when the laminated specimens are annealed at 950 ℃ in a protective atmosphere. Through IDA, Mo/Cu LMMCs are prepared in this paper. The tensile tests carried out for the Mo/Cu LMMCs specimens show that the Mo/Cu interfaces constructed via IDA have high normal and shear strengths. Additionally, the microstructure of the Mo/Cu interface is characterized by High Resolution Transmission Electron Microscopy （HRTEM）, X-ray diffraction （XRD） and Energy Dispersive X-ray （EDX） attached in HRTEM. The microscopic characterization results show that the expectant diffusion between Mo and Cu occurs through the irradiation damage during the process of IDA. Thus a Mo/Cu metallurgical bonding interface successfully forms. Moreover, the microscopic test results show that the Mo/Cu metallurgical interface is mainly constituted of crystalline phases with twisted and tangled lattices, and amorphous phase is not observed. Finally, based on the positron annihilation spectroscopy （PAS） and HRTEM results, the diffusion mechanism of IDA is discussed and determined to be vacancy assisted diffusion.
基金the financial supports from the National Natural Science Foundation of China(Nos.52061028,52061039,51971249,51761037)the Natural Science Foundation of Jiangxi Province,China(No.2020BABL204002)+1 种基金the Interdisciplinary Innovation Fund of Nanchang University(IIFNCU),China(No.9166-27060003-ZD05)the Innovative Funding for Graduate Students in Nanchang University,China(No.CX2019068).
文摘Graphene-reinforced Mg matrix composites suffer seriously from the weak Mg/graphene interfacial bonding.In this study,a first-principles study was performed to evaluate the feasibility of improving the Mg/graphene bonding using an in-situ formed intermediate MgO layer.The calculated interface adhesion strengths suggested a relative ordering(from high to low)of Mg(0001)/MgO(11−1)>MgO(11−1)/graphene>Mg(0001)/graphene.The enhanced Mg/MgO/graphene interface bonding can be attributed to the newly formed strong ionic and covalent interactions at the Mg/MgO and the MgO/graphene interfaces,respectively,which replace the otherwise very weak van der Waals bonding between Mg and graphene.
基金Project(51474189)supported by the National Natural Science Foundation of ChinaProject(QN2015214)supported by the Educational Commission of Hebei Province,China
文摘Cu/Al clad strips are prepared using solid?liquid cast-rolling bonding(SLCRB)technique with a d160mm×150mm twin-roll experimental caster.The extent of interfacial reactions,composition of the reaction products,and their micro-morphology evolution in the SLCRB process are investigated with scanning electron microscope(SEM),energy dispersive spectrometer(EDS),and X-ray diffraction(XRD).In the casting pool,initial aluminized coating is first generated on the copper strip surface,with the diffusion layer mainly consisting ofα(Al)+CuAl2and growing at high temperatures,with the maximum thickness of10μm.After sequent rolling below the kiss point,the diffusion layer is broken by severe elongation,which leads to an additional crack bond process with a fresh interface of virgin base metal.The average thickness is reduced from10to5μm.The reaction products,CuAl2,CuAl,and Cu9Al4,are dispersed along the rolling direction.Peeling and bending test results indicate that the fracture occurs in the aluminum substrate,and the morphology is a dimple pattern.No crack or separation is found at the bonding interface after90°-180°bending.The presented method provides an economical way to fabricate Cu/Al clad strip directly.
文摘The atomic structure of the active sites in Cu/CeO2 catalysts is intimately associated with the copper-ceria interaction. Both the shape of ceria and the loading of copper affect the chemical bonding of copper species on ceria surfaces and the electronic and geometric character of the relevant interfaces. Nanostructured ceria, including particles(polyhedra), rods, and cubes, provides anchoring sites for the copper species. The atomic arrangements and chemical properties of the(111),(110) and(100) facets, preferentially exposed depending on the shape of ceria, govern the copper-ceria interactions and in turn determine their catalytic properties. Also, the metal loading significantly influences the dispersion of copper species on ceria with a specific shape, forming copper layers, clusters, and nanoparticles. Lower copper contents result in copper monolayers and/or bilayers while higher copper loadings lead to multi-layered clusters and faceted particles. The active sites are usually generated via interactions between the copper atoms in the metal species and the oxygen vacancies on ceria, which is closely linked to the number and density of surface oxygen vacancies dominated by the shape of ceria.
基金the financia supports from the National Key Research and Development Program of China (No. 2019YFB2006500)the National Natura Science Foundation of China (Nos. 52171024 51771234, 51601228)。
文摘The properties of Sc-dopedθ′(Al_(2)Cu)/Al interface in Al−Cu alloys were investigated by first-principles calculations.Sc-doped semi-coherent and coherentθ′(Al_(2)Cu)/Al interfaces(Sc doped in Al slab(S1 site),Sc doped inθ′slab(S2 site))were modeled based on calculated results and reported experiments.Through the analysis of interfacial bonding strength,it is revealed that the doping of Sc at S1 site can significantly decrease the interface energy and increase the work of adhesion.In particular,the doped coherent interface with Sc at S1 site which is occupied by interstitial Cu atoms has very good bonding strength.The electronic structure shows the strong Al—Cu bonds at the interfaces with Sc at S1 site,and the Al—Al bonds at the interfaces with Sc at S2 site are formed.The formation of strong Al—Cu and Al—Al bonds plays an important role in the enhancement of doped interface strength.
文摘Based on theoretical analyses, the effect of electric current density on stability of solidification interface morphology of QAl 4 alloy was studied experimentally. The results show that the experimental results agree well with the theoretical analyses, and the following conclusions can be drawn: the increase of electric current density improves the stability of the solidification interface morphology under the condition of no convection of the liquid metal. Otherwise this convection will slow down the trend of solidification interface developing to stability caused by increasing electric current density.
基金Project supported by the National Natural Science Foundation of China(Grant Nos.51572132,51372121,and 61674082)the Natural Science Foundation of Key Project of Tianjin City,China(Grant No.16JCZDJC30700)+1 种基金the Yang Fan Innovative and Entrepreneurial Research Team Project of China(Grant No.2014YT02N037)111 Project,China(Grant No.B16027)
文摘Cu2ZnSnS（e）4 （CZTS（e）） solar cells have attracted much attention due to the elemental abundance and the non- toxicity. However, the record efficiency of 12.6% for CuzZnSn（S,Se）4 （CZTSSe） solar cells is much lower than that of Cu（In,Ga）See （CIGS） solar cells. One crucial reason is the recombination at interfaces. In recent years, large amount inves- tigations have been done to analyze the interfacial problems and improve the interfacial properties via a variety of methods. This paper gives a review of progresses on interfaces of CZTS（e） solar cells, including： （i） the band alignment optimization at buffer/CZTS（e） interface, （ii） tailoring the thickness of MoS（e）2 interfacial layers between CZTS（e） absorber and Mo back contact, （iii） the passivation of rear interface, （iv） the passivation of front interface, and （v） the etching of secondary phases.
基金Project(10037273) supported by the Ministry of Knowledge Economy,Korea
文摘The effects of reduction ratio during roll bonding on the microstructural evolution at interface and subsequent mechanical properties of roll-bonded Al/Cu 2-ply sheets were investigated. The interface microstructures for several Al/Cu 2-ply sheets fabricated under different reduction ratios between 30% and 65% were verified by transmission electron microscopy(TEM). Taking the difference of interface microstructure into consideration, 3-point bending and peel tests were performed for obtaining flexural and bonding strengths for Al/Cu 2-ply sheets. The effect of the quantified areas of metallurgical bonding at interfaces on the bonding strength was also discussed. The results show that both the bonding and flexural strengths for Al/Cu 2-ply sheets are reduced by decreasing the reduction ratio during the roll bonding process, which is strongly correlated with the interface microstructure. This was especially verified by observing the interface delamination from the 3-point bent samples.
文摘The motion of intervariant intedeces under the action of applied stress in the internally faulted 18R martensite in a Cu-Zn-Al shape memory alloy has been studied. Transmission electron microscopy in situ observations show that the interfaces between 24 martensite variants have different reaction to applied stress. The A/C type and A/B type interfaces have good mobil-ity, the A/D type interface has bad mobiIity, and the different-group-intervariant interfaces are basically immobile.
基金the financial support from the National Natural Science Foundation of China(Nos.51875317,52222510)Key Research and Development Program of Shandong Province,China(No.2021ZLGX01)。
文摘Al/Cu laminate composite was fabricated based on hot press sintering using Cu sheet and Al powders as raw materials.The effects of sintering parameters on interfacial structure and mechanical properties were investigated.The results revealed that a uniform Al/Cu interface with excellent bonding quality was achieved.The thickness of intermetallic compounds(IMCs)reached 33.88μm after sintering at 620℃for 2 h,whereas it was only 14.88μm when sintered at 600℃for 1 h.AlCu phase was developed through the reaction between Al4Cu9 and Al2Cu with prolonging sintering time,and an amorphous oxide strip formed at AlCu/Al4Cu9 interface.Both the grain morphology and interfacial structure affected the tensile strength of Al/Cu laminate,whereas the mode of tensile fracture strongly relied on the interfacial bonding strength.The highest tensile strength of 151.1 MPa and bonding strength of 93.7 MPa were achieved after sintering at 600℃for 1 h.
基金Project supported by the National Key Research and Development Program of China(Grant No.2016YFB0400801)the National Natural Science Foundation of China(Grant Nos.61774128,61674124,11604275,11304257,and 61227009)+1 种基金the Natural Science Foundation of Fujian Province of China(Grant Nos.2017J01012,2014J01026,2016J01037,and 2015J01028)the Fundamental Research Funds for the Central Universities,China(Grant Nos.20720150027,20720160044,20720160122,20720170085,20720170012,and 20720150033)
文摘Electronic structure and spin-related state coupling at ferromagnetic material （FM）/MgO （FM = Fe, CoFe, CoFeB） interfaces under biaxial strain are evaluated using the first-principles calculations. The CoFeB/MgO interface, which is su- perior to the Fe/MgO and CoFe/MgO interfaces, can markedly maintain stable and effective coupling channels for majority- spin A1 state under large biaxial strain. Bonding interactions between Fe, Co, and B atoms and the electron transfer between Bloch states are responsible for the redistribution of the majority-spin A1 state, directly influencing the coupling effect for the strained interfaces. Layer-projected wave function of the majority-spin Al state suggests slower decay rate and more stable transport property in the CoFeB/MgO interface, which is expected to maintain a higher tunneling magnetoresistance （TMR） value under large biaxial strain. This work reveals the internal mechanism for the state coupling al strained FM/MgO interfaces. This study may provide some references to the design and manufacturing of magnetic tunnel .junctions with high tunneling magnetoresistance effect.
文摘The atom (Ag,Cu) diffusion behavior and the effect of technology on the interface of rolled Ag/Cu composite contact were investigated. The concentration of Ag and Cu atoms near the interface was determined with electron probe. The bonding strength of composite interface was tested and the fracture in tensile sample was observed by SEM. The results show that there was inter diffusion of Ag and Cu atoms on the interface, which formed compact layer with high bonding strength of 98 MPa. The practical application proved that the Ag/Cu composite interface is reliable.
基金supported by the National Basic Research Program of China(Grant No.2013CB632506)the National Natural Science Foundation of China(Grant Nos.11374186,51231007,51202132,and 51102153)the Independent Innovation Foundation of Shandong University,China(Grant No.2012TS027)
文摘The first-principles calculations are employed to investigate the electrical properties of polar MgO/BaTiO3（110）interfaces. Both n-type and p-type polar interfaces show a two-dimensional metallic behavior. For the n-type polar interface,the interface Ti3d electrons are the origin of the metallic and magnetic properties. Varying the thickness of Ba TiO3 may induce an insulator–metal transition, and the critical thickness is 4 unit cells. For the p-type polar interface, holes preferentially occupy the interface O 2p y state, resulting in a conducting interface. The unbalance of the spin splitting of the O 2p states in the interface Mg O layer leads to a magnetic moment of about 0.25μB per O atom at the interface.These results further demonstrate that other polar interfaces, besides LaAlO3/SrTiO3, can show a two-dimensional metallic behavior. It is helpful to fully understand the role of polar discontinuity on the properties of the interface, which widens the field of polar-nonpolar interfaces.
