The thermal conductivity of diamond particles reinforced copper matrix composite as an attractive thermal management material is significantly lowered by the non-wetting heterointerface.The paper investigates the heat...The thermal conductivity of diamond particles reinforced copper matrix composite as an attractive thermal management material is significantly lowered by the non-wetting heterointerface.The paper investigates the heat transport behavior between a 200-nm Cu layer and a single-crystalline diamond substrate inserted by a chromium(Cr)interlayer having a series of thicknesses from 150 nm down to 5 nm.The purpose is to detect the impact of the modifying interlayer thickness on the interfacial thermal conductance(h)between Cu and diamond.The time-domain thermoreflectance measurements suggest that the introduction of Cr interlayer dramatically improves the h between Cu and diamond owing to the enhanced interfacial adhesion and bridged dissimilar phonon states between Cu and diamond.The h value exhibits a decreasing trend as the Cr interlayer becomes thicker because of the increase in thermal resistance of Cr interlayer.The high h values are observed for the Cr interlayer thicknesses below 21 nm since phononic transport channel dominates the thermal conduction in the ultrathin Cr layer.The findings provide a way to tune the thermal conduction across the metal/nonmetal heterogeneous interface,which plays a pivotal role in designing materials and devices for thermal management applications.展开更多
Ag-Cu-In-Ti low-temperature filler was used to braze the diamond and copper,and the effects of brazing temperature and soaking time on the microstructure and mechanical properties of the joints were investigated.In ad...Ag-Cu-In-Ti low-temperature filler was used to braze the diamond and copper,and the effects of brazing temperature and soaking time on the microstructure and mechanical properties of the joints were investigated.In addition,the joint formation mechanism was discussed,and the correlation between joint microstructure and mechanical performance was established.Results show that adding appropriate amount of In into the filler can significantly reduce the filler melting point and enhance the wettability of filler on diamond.When the brazing temperature is 750°C and the soaking time is 10 min,a uniformly dense braze seam with excellent metallurgical bonding can be obtained,and its average joint shear strength reaches 322 MPa.The lower brazing temperature can mitigate the risk of diamond graphitization and also reduce the residual stresses during joining.展开更多
Diamonds were formed in the mantle lithosphere,mostly at depths of 150~200km in the centres of Precambrian cratons,the buoyant ancient cores of continents.From there they were normally transported into the upper crust...Diamonds were formed in the mantle lithosphere,mostly at depths of 150~200km in the centres of Precambrian cratons,the buoyant ancient cores of continents.From there they were normally transported into the upper crust in kimberlite pipes whose diamonds are largely colourless and light yellow related to trace element N(Ia type),although brown,green,and more rarely blue-coloured diamonds are related to lattice defect and trace amounts of H,more rarely B and Ni.Pink diamonds are extremely rare in the approximately 90 diamondiferous pipes mined globally.Although small quantities have been discovered elsewhere,about 90%have been mined from the ca.1.3Ga Argyle diamond pipe in Western Australia,with the Arkhangelskaya diamond pipe in Russia the only other significant source.The pink colour at both Argyle and Arkhangelskaya is unrelated to trace elements and instead results from absorption of light from nanoscale(550nm)defects related to shear stress and plastic deformation.Macroscopically,defects are shown by glide planes,lamellae,and grain lines imposed on the originally colourless diamonds derived from their mantle source.The key question is why these defects were uniquely acquired in diamonds in the Argyle and Arkhangelskaya pipes.Unlike most diamondiferous pipes,Argyle is a rare diamondiferous volatile-rich lamproite pipe that was emplaced into the multiply deformed and rifted NNE-trending Halls Creek Orogen on the margin of the Kimberley Craton.Similarly,Arkhangelskaya in the Devonian Lomonosov kimberlite cluster is a volatile-rich low-Ti type kimberlite,a close relative to lamproite,that was emplaced into the multiply deformed Lapland-Kola Orogen on the rifted margin of the Kola Craton.These craton margins are underlain by subduction-induced volatile-enriched metasomatized mantle lithosphere in contrast to the more primeval mantle under craton centres.It is thus likely that shear stresses were exacerbated at Argyle and Arkangelskaya by rapid vertical emplacement of the anomalous volatile-enriched magmas at supercritical pressures and temperatures,that induced catastrophic phase separation of these volatiles and'mini seismic events'during rapid pressure drops during ascent from 200km depth to the surface.Such a mechanism is consistent with the presence of strongly resorbed and plastically deformed small brown industrial diamonds in the Argyle pipe.From a China perspective,it is potentially important that at 1.3Ga the alkaline Argyle pipe in northern Australia is placed adjacent to the North China Craton(NCC),with numerous world-class mineral deposits including the giant ca.1.4~1.2Ga alkaline Bayan Obo REE system on its margin.However,it is the southeastern margin of the Yangtze Craton and the Jiangnan Orogen with their lamproite pipes derived from metasomatized mantle lithosphere that present the most prospective regions for pink diamond occurrences.展开更多
The synthesis of high-quality heteroepitaxial diamond films on iridium composite substrates is a critical step toward advancing diamond for electronic and optical applications.Microwave plasma chemical vapor depositio...The synthesis of high-quality heteroepitaxial diamond films on iridium composite substrates is a critical step toward advancing diamond for electronic and optical applications.Microwave plasma chemical vapor deposition,combined with in situ optical emission spectroscopy,enables precise control over growth modes through plasma parameter tuning.In this study,we examine how methane concentration,microwave power,and gas pressure influence plasma species and,consequently,the growth modes of heteroepitaxial diamond by optical emission spectroscopy and scanning electron microscope.At low nucleation densities,increased methane concentrations promote the transition from faceted polyhedral to ballas structures,driven by elevated C_(2) radical concentrations in the plasma.Conversely,at higher nucleation densities,gas pressure,and substrate temperature dominate growth mode determination,leading to diverse morphologies,such as planar,polycrystalline,octahedral,and step-flow growth.These findings elucidate the interplay among plasma species,growth parameters,and growth mode,offering critical insights for optimizing growth conditions and preparing heteroepitaxial diamond films in a specific growth mode.展开更多
A series of leaching and electrochemical experiments were conducted to elucidate the critical role of hydrogen sulfide(H_(2)S)in copper-driven reduction of chalcopyrite.Results demonstrate that in the absence of H_(2)...A series of leaching and electrochemical experiments were conducted to elucidate the critical role of hydrogen sulfide(H_(2)S)in copper-driven reduction of chalcopyrite.Results demonstrate that in the absence of H_(2)S,metallic copper converts chalcopyrite into bornite(Cu_(5)FeS_(4)).However,the introduction of H_(2)S promotes the formation of chalcocite(Cu_(2)S)by altering the oxidation pathway of copper.Electrochemical analysis demonstrates that the presence of H₂S significantly reduces the corrosion potential of copper from 0.251 to−0.223 V(vs SHE),reaching the threshold necessary for the formation of Cu_(2)S.Nevertheless,excessive H_(2)S triggers sulfate reduction via the reaction of 8Cu+H_(2)SO_(4)+3H_(2)S=4Cu_(2)S+4H_(2)O(ΔG=−519.429 kJ/mol at 50℃),leading to inefficient copper utilization.展开更多
It is difficult to recover chrysocolla from sulfidation flotation which is closely related to the mineral surface composition.In this study,the effects of fluoride roasting on the surface composition of chrysocolla we...It is difficult to recover chrysocolla from sulfidation flotation which is closely related to the mineral surface composition.In this study,the effects of fluoride roasting on the surface composition of chrysocolla were investigated,its impact on sulfidation flotation was explored,and the mechanisms involved in both fluoride roasting and sulfidation flotation were discussed.With CaF_(2)as the roasting reagent,Na_(2)S·9H_(2)O as the sulfidation reagent,and sodium butyl xanthate(NaBX)as the collector,the results of the flotation experiments showed that fluoride roasting improved the floatability of chrysocolla,and the recovery rate increased from 16.87%to 82.74%.X-ray diffraction analysis revealed that after fluoride roasting,approximately all the Cu on the chrysocolla surface was exposed in the form of CuO,which could provide a basis for subsequent sulfidation flotation.The microscopy and elemental analyses revealed that large quantities of"pagoda-like"grains were observed on the sulfidation surface of the fluoride-roasted chrysocolla,indicating high crystallinity particles of copper sulfide.This suggests that the effect of sulfide formation on the chrysocolla surface was more pronounced.X-ray photoelectron spectroscopy revealed that fluoride roasting increased the relative contents of sulfur and copper on the surface and that both the Cu~+and polysulfide fractions on the surface of the minerals increased.This enhances the effect of sulfidation,which is conducive to flotation recovery.Therefore,fluoride roasting improved the effect of copper species transformation and sulfidation on the surface of chysocolla,promoted the adsorption of collectors,and improved the recovery of chrysocolla from sulfidation flotation.展开更多
A Ni layer with a thickness of about 100 nm was sputtered on Cu substrates,followed by an ultrasonic seeding with nanodiamond suspension.High-quality diamond film with its crystalline grains close to thermal equilibri...A Ni layer with a thickness of about 100 nm was sputtered on Cu substrates,followed by an ultrasonic seeding with nanodiamond suspension.High-quality diamond film with its crystalline grains close to thermal equilibrium shape was deposited on Cu substrates by hot-filament chemical vapor deposition（HF-CVD）,and the sp2 carbon content was less than 5.56%.The nucleation and growth of diamond film were investigated by micro-Raman spectroscopy,scanning electron microscopy,and X-ray diffraction.The results show that the nucleation density of diamond on the Ni-modified Cu substrates is 10 times higher than that on blank Cu substrates.The enhancement mechanism of the nucleation kinetics by Ni modification layer results from two effects：namely,the nanometer rough Ni-modified surface shows an improved absorption of nanodiamond particles that act as starting points for the diamond nucleation during HF-CVD process;the strong catalytic effect of the Ni-modified surface causes the formation of graphite layer that acts as an intermediate to facilitate diamond nucleation quickly.展开更多
Effects of rare earth element La on the microstructure of Cumatrix diamond tools were researched under the conditions of variousmaterials components and the process parameters in order to improvematerials properties. ...Effects of rare earth element La on the microstructure of Cumatrix diamond tools were researched under the conditions of variousmaterials components and the process parameters in order to improvematerials properties. SEM, XPS and X-ray were used to investigate thefracture section, microstructure and the element valence inmaterials. The Results shown that the combination of rare earthelement La and transition element Ti is advantageous to the bondingstate Between diamond particles and matrix, so it can improve thematerials properties. Suitable sintering temperature is 790 deg. C.展开更多
The thermal conductivity of diamond/copper composites with bimodal particle sizes was studied. The composites were prepared through pressure infiltration of liquid copper into diamond preforms with a mixture of 40 and...The thermal conductivity of diamond/copper composites with bimodal particle sizes was studied. The composites were prepared through pressure infiltration of liquid copper into diamond preforms with a mixture of 40 and 100 pm-size diamonds. The permeability of the preforms with different coarse-to-fine volume ratios of diamonds was investigated. The thermal conductivity of the diamond/copper composites with bimodal size distribution was compared to the theoretical value derived from an analytical model developed by Chu. It is predicted that the diamond/copper composites could reach a higher thermal conductivity and their surface roughness could be improved by applying bimodal diamond particle sizes.展开更多
Submicron diamonds were co-deposited on aluminum substrates with copper from the acid copper sulfate electrolyte by electro- lyte-suspension co-deposition. After submicron diamonds were added to the electrolyte, the s...Submicron diamonds were co-deposited on aluminum substrates with copper from the acid copper sulfate electrolyte by electro- lyte-suspension co-deposition. After submicron diamonds were added to the electrolyte, the shape of copper grains transformed from oval or round to polyhedron, the growth mode of copper grains transformed from columnar growth to gradual change in size, and the preferred ori- entation of copper grains transformed from （220） to （200）. Analyzing the variation of cathodic overpotential, it was found that the cathodic overpotential tended to remain tmchanged when copper plane （220） grew in the process of electrodepositing pure copper, while it tended to decrease with time when copper plane （200） grew in the process of co-deposition. It was inferred that copper plane （200） was propitious to the deposition of submicron diamonds.展开更多
Tungsten was plated on the surface of diamond by using thermal diffusion method.Different process parameters were employed to prepare the composites with tungsten,diamond and copper.The micro morphology of different s...Tungsten was plated on the surface of diamond by using thermal diffusion method.Different process parameters were employed to prepare the composites with tungsten,diamond and copper.The micro morphology of different samples was observed,and the thermal conductivity of samples was measured by laser flash method.The optimal process parameters for preparing diamond/copper composites with high thermal conductivity were investigated.The results indicated that plating tungsten on diamond could modify the interface bonding.When the diamond was plated for 60 min,the coating appeared intact,uniform and flat,and the thermal conductivity of the sample could reach as high as 486 W/(m·K).The integrity and uniformity were more important than thickness for the coating.When the tungsten-plated diamond was further annealed,the metallurgical bonding between the coating and the diamond was enhanced,and the thermal conductivity rose to 559 W/(m·K).展开更多
The thermal conductivity of diamond hybrid SiC/Cu,diamond/Cu and SiC/Cu composite were calculated by using the extended differential effective medium (DEM) theoretical model in this paper.The effects of the particle v...The thermal conductivity of diamond hybrid SiC/Cu,diamond/Cu and SiC/Cu composite were calculated by using the extended differential effective medium (DEM) theoretical model in this paper.The effects of the particle volume fraction,the particle size and the volume ratio of the diamond particles to the total particles on the thermal conductivity of the composite were studied.The DEM theoretical calculation results show that,for the diamond hybrid SiC/Cu composite,when the particle volume fraction is above 46% and the volume ratio of the diamond particles to the SiC particles is above 13:12,the thermal conductivity of the composite can reach 500 W·m-1·K-1.The thermal conduc-tivity of the composite has little change when the particle size is above 200μm.The experimental results show that Ti can improve the wettability of the SiC and Cu.The thermal conductivity of the diamond hybrid SiCTi/Cu is almost two times better than that of the diamond hybrid SiC/Cu.It is feasible to predict the thermal conductivity of the composite by DEM theoretical model.展开更多
The electroless copper deposition on both pure and Cr-coated diamond particles was stud- ied to produce copper/diamond composites for electronic packaging materials. The particles were characterized and the mechanism ...The electroless copper deposition on both pure and Cr-coated diamond particles was stud- ied to produce copper/diamond composites for electronic packaging materials. The particles were characterized and the mechanism of product formation was investigated through scanning electron microscopy （SEM）, energy dispersive spectroscopy （EDS）, X-ray diffraction （XRD）, and X-ray photoelectron spectra （XPS）. The particle coating thickness was measured using optical micro- graphs. The diamond particles got uniform coating thickness of copper crystals layers. This method provided an excellent base for the fabrication of metal-based composites using cheap equipments, and was less time consuming, nature friendly and economical compared with other methods of dia- mond surface metallization.展开更多
The scratch test is used for quality control mostly in phenomenological ways,and whether fracture toughness can be obtained from this test is still a matter of debate requiring further elucidation.In this paper,values...The scratch test is used for quality control mostly in phenomenological ways,and whether fracture toughness can be obtained from this test is still a matter of debate requiring further elucidation.In this paper,values of the fracture toughness of copper obtained by different scratch-based approaches are compared in order to examine the applicability of scratch-based methodologies to characterize the fracture toughness of soft metals.The scratch response of copper to a Rockwell C diamond indenter is studied under a constant normal load condition.The variations of penetration depth,residual depth,and residual scratch width with applied normal load are quantified from spherical to sphero-conical contact regimes by piecewise functions.A newly proposed size effect law is found to be the most suitable for scratch-based approaches to characterizing the fracture toughness of soft metallic materials with significant plasticity.A simple expression relating the nominal stress to the penetration depth is proposed for the spherical contact regime and gives almost the same value of fracture toughness.The residual scratch width provides useful information on pile-up of material and on the spherical tip radius of the indenter.It is found that the values of the fracture toughness obtained from the microscratch test are influenced by the data range for analysis.展开更多
The direct deposition of diamond films on copper substrate has been suffered fromadhesion problems due to the mismatch of the thermal expansion coefficients of diamond andcopper. In this paper nuclei with valuable den...The direct deposition of diamond films on copper substrate has been suffered fromadhesion problems due to the mismatch of the thermal expansion coefficients of diamond andcopper. In this paper nuclei with valuable density were directly introduced thirough a submicrondiamond powder layer. The diamond grits partially were buried in the copper substrate leadingto better adhesion. Another method with nickel intermediate layer for enhancing the adhesionwas studied here in detail. It was suggested that Cu-Ni eutectic between the copper substrate andNi interlayer might contribute to the adhesion improvement. The quality of the diamond filmsdeposited wlth rnckel interlayer was investigated by scanning electron microscopy and Ramanspectroscopy.展开更多
Formation of diamond particles was investigated in an energy-controlled CH4/H2 radio-frequency (RF) discharge plasma. Here, in particular, it was examined how diamond particles grew on a nickel substrate under an infl...Formation of diamond particles was investigated in an energy-controlled CH4/H2 radio-frequency (RF) discharge plasma. Here, in particular, it was examined how diamond particles grew on a nickel substrate under an influence of Cu vapor that was supplied from a heated Cu wire. Here, the plasma was generated by a hollow-magnetron-type (HMT) RF plasma source at the frequency of 13.56 MHz. Total pressure was kept at 100 mTorr. Diamond particles grew besides Ni and Cu particles. From Raman spectrum the substrate surface was covered with thin graphite film deposited as a background layer. It was shown that diamond could grow in a self-organized manner even when the other atomic gas species such as Ni and Cu were contained in the gas at the same time during the growth process.展开更多
Copper,one of the most prolific transition metals in the body,is required for normal brain physiological activity and allows various functions to work normally through its range of concentrations.Copper homeostasis is...Copper,one of the most prolific transition metals in the body,is required for normal brain physiological activity and allows various functions to work normally through its range of concentrations.Copper homeostasis is meticulously maintained through a complex network of copper-dependent proteins,including copper transporters(CTR1 and CTR2),the two copper ion transporters the Cu-transporting ATPase 1(ATP7A)and Cu-transporting beta(ATP7B),and the three copper chaperones ATOX1,CCS,and COX17.Disruptions in copper homeostasis can lead to either the deficiency or accumulation of copper in brain tissue.Emerging evidence suggests that abnormal copper metabolism or copper binding to various proteins,including ceruloplasmin and metallothionein,is involved in the pathogenesis of neurodegenerative disorders.However,the exact mechanisms underlying these processes are not known.Copper is a potent oxidant that increases reactive oxygen species production and promotes oxidative stress.Elevated reactive oxygen species levels may further compromise mitochondrial integrity and cause mitochondrial dysfunction.Reactive oxygen species serve as key signaling molecules in copper-induced neuroinflammation,with elevated levels activating several critical inflammatory pathways.Additionally,copper can bind aberrantly to several neuronal proteins,including alphasynuclein,tau,superoxide dismutase 1,and huntingtin,thereby inducing neurotoxicity and ultimately cell death.This study focuses on the latest literature evaluating the role of copper in neurodegenerative diseases,with a particular focus on copper-containing metalloenzymes and copper-binding proteins in the regulation of copper homeostasis and their involvement in neurodegenerative disease pathogenesis.By synthesizing the current findings on the functions of copper in oxidative stress,neuroinflammation,mitochondrial dysfunction,and protein misfolding,we aim to elucidate the mechanisms by which copper contributes to a wide range of hereditary and neuronal disorders,such as Wilson's disease,Menkes'disease,Alzheimer's disease,Parkinson's disease,amyotrophic lateral sclerosis,Huntington's disease,and multiple sclerosis.Potential clinically significant therapeutic targets,including superoxide dismutase 1,D-penicillamine,and 5,7-dichloro-2-[(dimethylamino)methyl]-8-hydroxyquinoline,along with their associated therapeutic agents,are further discussed.Ultimately,we collate evidence that copper homeostasis may function in the underlying etiology of several neurodegenerative diseases and offer novel insights into the potential prevention and treatment of these diseases based on copper homeostasis.展开更多
基金financially supported by the National Natural Science Foundation of China (Nos. 51871014, 51571015)the National Youth Science Foundation, China (No. 51606193)
文摘The thermal conductivity of diamond particles reinforced copper matrix composite as an attractive thermal management material is significantly lowered by the non-wetting heterointerface.The paper investigates the heat transport behavior between a 200-nm Cu layer and a single-crystalline diamond substrate inserted by a chromium(Cr)interlayer having a series of thicknesses from 150 nm down to 5 nm.The purpose is to detect the impact of the modifying interlayer thickness on the interfacial thermal conductance(h)between Cu and diamond.The time-domain thermoreflectance measurements suggest that the introduction of Cr interlayer dramatically improves the h between Cu and diamond owing to the enhanced interfacial adhesion and bridged dissimilar phonon states between Cu and diamond.The h value exhibits a decreasing trend as the Cr interlayer becomes thicker because of the increase in thermal resistance of Cr interlayer.The high h values are observed for the Cr interlayer thicknesses below 21 nm since phononic transport channel dominates the thermal conduction in the ultrathin Cr layer.The findings provide a way to tune the thermal conduction across the metal/nonmetal heterogeneous interface,which plays a pivotal role in designing materials and devices for thermal management applications.
基金National MCF Energy R&D Program(2019YFE03100400)。
文摘Ag-Cu-In-Ti low-temperature filler was used to braze the diamond and copper,and the effects of brazing temperature and soaking time on the microstructure and mechanical properties of the joints were investigated.In addition,the joint formation mechanism was discussed,and the correlation between joint microstructure and mechanical performance was established.Results show that adding appropriate amount of In into the filler can significantly reduce the filler melting point and enhance the wettability of filler on diamond.When the brazing temperature is 750°C and the soaking time is 10 min,a uniformly dense braze seam with excellent metallurgical bonding can be obtained,and its average joint shear strength reaches 322 MPa.The lower brazing temperature can mitigate the risk of diamond graphitization and also reduce the residual stresses during joining.
文摘Diamonds were formed in the mantle lithosphere,mostly at depths of 150~200km in the centres of Precambrian cratons,the buoyant ancient cores of continents.From there they were normally transported into the upper crust in kimberlite pipes whose diamonds are largely colourless and light yellow related to trace element N(Ia type),although brown,green,and more rarely blue-coloured diamonds are related to lattice defect and trace amounts of H,more rarely B and Ni.Pink diamonds are extremely rare in the approximately 90 diamondiferous pipes mined globally.Although small quantities have been discovered elsewhere,about 90%have been mined from the ca.1.3Ga Argyle diamond pipe in Western Australia,with the Arkhangelskaya diamond pipe in Russia the only other significant source.The pink colour at both Argyle and Arkhangelskaya is unrelated to trace elements and instead results from absorption of light from nanoscale(550nm)defects related to shear stress and plastic deformation.Macroscopically,defects are shown by glide planes,lamellae,and grain lines imposed on the originally colourless diamonds derived from their mantle source.The key question is why these defects were uniquely acquired in diamonds in the Argyle and Arkhangelskaya pipes.Unlike most diamondiferous pipes,Argyle is a rare diamondiferous volatile-rich lamproite pipe that was emplaced into the multiply deformed and rifted NNE-trending Halls Creek Orogen on the margin of the Kimberley Craton.Similarly,Arkhangelskaya in the Devonian Lomonosov kimberlite cluster is a volatile-rich low-Ti type kimberlite,a close relative to lamproite,that was emplaced into the multiply deformed Lapland-Kola Orogen on the rifted margin of the Kola Craton.These craton margins are underlain by subduction-induced volatile-enriched metasomatized mantle lithosphere in contrast to the more primeval mantle under craton centres.It is thus likely that shear stresses were exacerbated at Argyle and Arkangelskaya by rapid vertical emplacement of the anomalous volatile-enriched magmas at supercritical pressures and temperatures,that induced catastrophic phase separation of these volatiles and'mini seismic events'during rapid pressure drops during ascent from 200km depth to the surface.Such a mechanism is consistent with the presence of strongly resorbed and plastically deformed small brown industrial diamonds in the Argyle pipe.From a China perspective,it is potentially important that at 1.3Ga the alkaline Argyle pipe in northern Australia is placed adjacent to the North China Craton(NCC),with numerous world-class mineral deposits including the giant ca.1.4~1.2Ga alkaline Bayan Obo REE system on its margin.However,it is the southeastern margin of the Yangtze Craton and the Jiangnan Orogen with their lamproite pipes derived from metasomatized mantle lithosphere that present the most prospective regions for pink diamond occurrences.
基金funded by the National Key Research and Development Program of China(Grant No.2022YFB3608602)the National Natural Science Foundation of China(Grant Nos.62404215 and 62574199)Instrument and Equipment Development Project of CAS(Grant No.PTYQ2024TD0003)。
文摘The synthesis of high-quality heteroepitaxial diamond films on iridium composite substrates is a critical step toward advancing diamond for electronic and optical applications.Microwave plasma chemical vapor deposition,combined with in situ optical emission spectroscopy,enables precise control over growth modes through plasma parameter tuning.In this study,we examine how methane concentration,microwave power,and gas pressure influence plasma species and,consequently,the growth modes of heteroepitaxial diamond by optical emission spectroscopy and scanning electron microscope.At low nucleation densities,increased methane concentrations promote the transition from faceted polyhedral to ballas structures,driven by elevated C_(2) radical concentrations in the plasma.Conversely,at higher nucleation densities,gas pressure,and substrate temperature dominate growth mode determination,leading to diverse morphologies,such as planar,polycrystalline,octahedral,and step-flow growth.These findings elucidate the interplay among plasma species,growth parameters,and growth mode,offering critical insights for optimizing growth conditions and preparing heteroepitaxial diamond films in a specific growth mode.
基金financially supported by the National Key Research and Development Program of China (No. 2022YFC2105300)。
文摘A series of leaching and electrochemical experiments were conducted to elucidate the critical role of hydrogen sulfide(H_(2)S)in copper-driven reduction of chalcopyrite.Results demonstrate that in the absence of H_(2)S,metallic copper converts chalcopyrite into bornite(Cu_(5)FeS_(4)).However,the introduction of H_(2)S promotes the formation of chalcocite(Cu_(2)S)by altering the oxidation pathway of copper.Electrochemical analysis demonstrates that the presence of H₂S significantly reduces the corrosion potential of copper from 0.251 to−0.223 V(vs SHE),reaching the threshold necessary for the formation of Cu_(2)S.Nevertheless,excessive H_(2)S triggers sulfate reduction via the reaction of 8Cu+H_(2)SO_(4)+3H_(2)S=4Cu_(2)S+4H_(2)O(ΔG=−519.429 kJ/mol at 50℃),leading to inefficient copper utilization.
基金financially supported by the National Natural Science Foundation of China(No.52374259)the Open Fund of the State Key Laboratory of Mineral Processing Science and Technology,China(No.BGRIMM-KJSKL-2023-11)the Major Science and Technology Projects in Yunnan Province,China(No.202302 AF080004)。
文摘It is difficult to recover chrysocolla from sulfidation flotation which is closely related to the mineral surface composition.In this study,the effects of fluoride roasting on the surface composition of chrysocolla were investigated,its impact on sulfidation flotation was explored,and the mechanisms involved in both fluoride roasting and sulfidation flotation were discussed.With CaF_(2)as the roasting reagent,Na_(2)S·9H_(2)O as the sulfidation reagent,and sodium butyl xanthate(NaBX)as the collector,the results of the flotation experiments showed that fluoride roasting improved the floatability of chrysocolla,and the recovery rate increased from 16.87%to 82.74%.X-ray diffraction analysis revealed that after fluoride roasting,approximately all the Cu on the chrysocolla surface was exposed in the form of CuO,which could provide a basis for subsequent sulfidation flotation.The microscopy and elemental analyses revealed that large quantities of"pagoda-like"grains were observed on the sulfidation surface of the fluoride-roasted chrysocolla,indicating high crystallinity particles of copper sulfide.This suggests that the effect of sulfide formation on the chrysocolla surface was more pronounced.X-ray photoelectron spectroscopy revealed that fluoride roasting increased the relative contents of sulfur and copper on the surface and that both the Cu~+and polysulfide fractions on the surface of the minerals increased.This enhances the effect of sulfidation,which is conducive to flotation recovery.Therefore,fluoride roasting improved the effect of copper species transformation and sulfidation on the surface of chysocolla,promoted the adsorption of collectors,and improved the recovery of chrysocolla from sulfidation flotation.
基金Project(20110933K) supported by the State Key Laboratory of Powder Metallurgy,ChinaProject(2012QNZT002) supported by the Freedom Explore Program of Central South University,ChinaProject(CSUZC2012024) supported by the Open-End Fund for the Valuable and Precision Instruments of Central South University,China
文摘A Ni layer with a thickness of about 100 nm was sputtered on Cu substrates,followed by an ultrasonic seeding with nanodiamond suspension.High-quality diamond film with its crystalline grains close to thermal equilibrium shape was deposited on Cu substrates by hot-filament chemical vapor deposition（HF-CVD）,and the sp2 carbon content was less than 5.56%.The nucleation and growth of diamond film were investigated by micro-Raman spectroscopy,scanning electron microscopy,and X-ray diffraction.The results show that the nucleation density of diamond on the Ni-modified Cu substrates is 10 times higher than that on blank Cu substrates.The enhancement mechanism of the nucleation kinetics by Ni modification layer results from two effects：namely,the nanometer rough Ni-modified surface shows an improved absorption of nanodiamond particles that act as starting points for the diamond nucleation during HF-CVD process;the strong catalytic effect of the Ni-modified surface causes the formation of graphite layer that acts as an intermediate to facilitate diamond nucleation quickly.
文摘Effects of rare earth element La on the microstructure of Cumatrix diamond tools were researched under the conditions of variousmaterials components and the process parameters in order to improvematerials properties. SEM, XPS and X-ray were used to investigate thefracture section, microstructure and the element valence inmaterials. The Results shown that the combination of rare earthelement La and transition element Ti is advantageous to the bondingstate Between diamond particles and matrix, so it can improve thematerials properties. Suitable sintering temperature is 790 deg. C.
基金supported by the National Natural Science Foundation of China (No. 50971020)the National High-Tech Research and Development Program of China (No. 2008AA03Z505)
文摘The thermal conductivity of diamond/copper composites with bimodal particle sizes was studied. The composites were prepared through pressure infiltration of liquid copper into diamond preforms with a mixture of 40 and 100 pm-size diamonds. The permeability of the preforms with different coarse-to-fine volume ratios of diamonds was investigated. The thermal conductivity of the diamond/copper composites with bimodal size distribution was compared to the theoretical value derived from an analytical model developed by Chu. It is predicted that the diamond/copper composites could reach a higher thermal conductivity and their surface roughness could be improved by applying bimodal diamond particle sizes.
文摘Submicron diamonds were co-deposited on aluminum substrates with copper from the acid copper sulfate electrolyte by electro- lyte-suspension co-deposition. After submicron diamonds were added to the electrolyte, the shape of copper grains transformed from oval or round to polyhedron, the growth mode of copper grains transformed from columnar growth to gradual change in size, and the preferred ori- entation of copper grains transformed from （220） to （200）. Analyzing the variation of cathodic overpotential, it was found that the cathodic overpotential tended to remain tmchanged when copper plane （220） grew in the process of electrodepositing pure copper, while it tended to decrease with time when copper plane （200） grew in the process of co-deposition. It was inferred that copper plane （200） was propitious to the deposition of submicron diamonds.
基金supported by the National Natural Science Foundation of China(No.11802125)。
文摘Tungsten was plated on the surface of diamond by using thermal diffusion method.Different process parameters were employed to prepare the composites with tungsten,diamond and copper.The micro morphology of different samples was observed,and the thermal conductivity of samples was measured by laser flash method.The optimal process parameters for preparing diamond/copper composites with high thermal conductivity were investigated.The results indicated that plating tungsten on diamond could modify the interface bonding.When the diamond was plated for 60 min,the coating appeared intact,uniform and flat,and the thermal conductivity of the sample could reach as high as 486 W/(m·K).The integrity and uniformity were more important than thickness for the coating.When the tungsten-plated diamond was further annealed,the metallurgical bonding between the coating and the diamond was enhanced,and the thermal conductivity rose to 559 W/(m·K).
基金financially supported by High-Technology Research and Development Program of China (No.2008AA03Z505)
文摘The thermal conductivity of diamond hybrid SiC/Cu,diamond/Cu and SiC/Cu composite were calculated by using the extended differential effective medium (DEM) theoretical model in this paper.The effects of the particle volume fraction,the particle size and the volume ratio of the diamond particles to the total particles on the thermal conductivity of the composite were studied.The DEM theoretical calculation results show that,for the diamond hybrid SiC/Cu composite,when the particle volume fraction is above 46% and the volume ratio of the diamond particles to the SiC particles is above 13:12,the thermal conductivity of the composite can reach 500 W·m-1·K-1.The thermal conduc-tivity of the composite has little change when the particle size is above 200μm.The experimental results show that Ti can improve the wettability of the SiC and Cu.The thermal conductivity of the diamond hybrid SiCTi/Cu is almost two times better than that of the diamond hybrid SiC/Cu.It is feasible to predict the thermal conductivity of the composite by DEM theoretical model.
文摘The electroless copper deposition on both pure and Cr-coated diamond particles was stud- ied to produce copper/diamond composites for electronic packaging materials. The particles were characterized and the mechanism of product formation was investigated through scanning electron microscopy （SEM）, energy dispersive spectroscopy （EDS）, X-ray diffraction （XRD）, and X-ray photoelectron spectra （XPS）. The particle coating thickness was measured using optical micro- graphs. The diamond particles got uniform coating thickness of copper crystals layers. This method provided an excellent base for the fabrication of metal-based composites using cheap equipments, and was less time consuming, nature friendly and economical compared with other methods of dia- mond surface metallization.
基金This work was supported by the National Natural Science Foundation of China(No.51705082)the Engineering Research Center for CAD/CAM of Fujian Provincial Colleges and Universities(No.K201705)+1 种基金the Development Center of Scientific and Educational Park of Fuzhou University in the City of Jinjiang(No.2019-JJFDKY-11)Fuzhou University Testing Fund of Precious Apparatus(No.2020T017).
文摘The scratch test is used for quality control mostly in phenomenological ways,and whether fracture toughness can be obtained from this test is still a matter of debate requiring further elucidation.In this paper,values of the fracture toughness of copper obtained by different scratch-based approaches are compared in order to examine the applicability of scratch-based methodologies to characterize the fracture toughness of soft metals.The scratch response of copper to a Rockwell C diamond indenter is studied under a constant normal load condition.The variations of penetration depth,residual depth,and residual scratch width with applied normal load are quantified from spherical to sphero-conical contact regimes by piecewise functions.A newly proposed size effect law is found to be the most suitable for scratch-based approaches to characterizing the fracture toughness of soft metallic materials with significant plasticity.A simple expression relating the nominal stress to the penetration depth is proposed for the spherical contact regime and gives almost the same value of fracture toughness.The residual scratch width provides useful information on pile-up of material and on the spherical tip radius of the indenter.It is found that the values of the fracture toughness obtained from the microscratch test are influenced by the data range for analysis.
文摘The direct deposition of diamond films on copper substrate has been suffered fromadhesion problems due to the mismatch of the thermal expansion coefficients of diamond andcopper. In this paper nuclei with valuable density were directly introduced thirough a submicrondiamond powder layer. The diamond grits partially were buried in the copper substrate leadingto better adhesion. Another method with nickel intermediate layer for enhancing the adhesionwas studied here in detail. It was suggested that Cu-Ni eutectic between the copper substrate andNi interlayer might contribute to the adhesion improvement. The quality of the diamond filmsdeposited wlth rnckel interlayer was investigated by scanning electron microscopy and Ramanspectroscopy.
文摘Formation of diamond particles was investigated in an energy-controlled CH4/H2 radio-frequency (RF) discharge plasma. Here, in particular, it was examined how diamond particles grew on a nickel substrate under an influence of Cu vapor that was supplied from a heated Cu wire. Here, the plasma was generated by a hollow-magnetron-type (HMT) RF plasma source at the frequency of 13.56 MHz. Total pressure was kept at 100 mTorr. Diamond particles grew besides Ni and Cu particles. From Raman spectrum the substrate surface was covered with thin graphite film deposited as a background layer. It was shown that diamond could grow in a self-organized manner even when the other atomic gas species such as Ni and Cu were contained in the gas at the same time during the growth process.
基金supported by the Notional Natural Science Foundation of Chino,No.82160690Colloborotive Innovation Center of Chinese Ministry of Education,No.2020-39Science and Technology Foundation of Guizhou Province,No.ZK[2021]-014(all to FZ)。
文摘Copper,one of the most prolific transition metals in the body,is required for normal brain physiological activity and allows various functions to work normally through its range of concentrations.Copper homeostasis is meticulously maintained through a complex network of copper-dependent proteins,including copper transporters(CTR1 and CTR2),the two copper ion transporters the Cu-transporting ATPase 1(ATP7A)and Cu-transporting beta(ATP7B),and the three copper chaperones ATOX1,CCS,and COX17.Disruptions in copper homeostasis can lead to either the deficiency or accumulation of copper in brain tissue.Emerging evidence suggests that abnormal copper metabolism or copper binding to various proteins,including ceruloplasmin and metallothionein,is involved in the pathogenesis of neurodegenerative disorders.However,the exact mechanisms underlying these processes are not known.Copper is a potent oxidant that increases reactive oxygen species production and promotes oxidative stress.Elevated reactive oxygen species levels may further compromise mitochondrial integrity and cause mitochondrial dysfunction.Reactive oxygen species serve as key signaling molecules in copper-induced neuroinflammation,with elevated levels activating several critical inflammatory pathways.Additionally,copper can bind aberrantly to several neuronal proteins,including alphasynuclein,tau,superoxide dismutase 1,and huntingtin,thereby inducing neurotoxicity and ultimately cell death.This study focuses on the latest literature evaluating the role of copper in neurodegenerative diseases,with a particular focus on copper-containing metalloenzymes and copper-binding proteins in the regulation of copper homeostasis and their involvement in neurodegenerative disease pathogenesis.By synthesizing the current findings on the functions of copper in oxidative stress,neuroinflammation,mitochondrial dysfunction,and protein misfolding,we aim to elucidate the mechanisms by which copper contributes to a wide range of hereditary and neuronal disorders,such as Wilson's disease,Menkes'disease,Alzheimer's disease,Parkinson's disease,amyotrophic lateral sclerosis,Huntington's disease,and multiple sclerosis.Potential clinically significant therapeutic targets,including superoxide dismutase 1,D-penicillamine,and 5,7-dichloro-2-[(dimethylamino)methyl]-8-hydroxyquinoline,along with their associated therapeutic agents,are further discussed.Ultimately,we collate evidence that copper homeostasis may function in the underlying etiology of several neurodegenerative diseases and offer novel insights into the potential prevention and treatment of these diseases based on copper homeostasis.
