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Advances in electrolytic copper foils:fabrication,microstructure,and mechanical properties 被引量:1
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作者 Long-Long Lu Hai-Tao Liu +8 位作者 Zhao-Dong Wang Qiong-Qiong Lu Yan-Jun Zhou Fei Zhou Yan-Min Zhang Wei-Wei Lu Bin Yang Qian-Qian Zhu Ke-Xing Song 《Rare Metals》 2025年第2期757-792,共36页
Electrolytic copper foil has gained significant attention as an essential component in lithium-ion batteries(LIBs),printed circuit boards(PCBs),and chip packaging substrates(CPSs)applications.With the advancement of L... Electrolytic copper foil has gained significant attention as an essential component in lithium-ion batteries(LIBs),printed circuit boards(PCBs),and chip packaging substrates(CPSs)applications.With the advancement of LIBs towards higher energy densities and the increasing density of electronic components on circuits,copper foil is required to have demanding properties,such as extremely thin thickness and extremely high tensile strength.This comprehensive review firstly summarizes recent progress on the fabrication of electrolytic copper foil,and the effects of process parameters,cathode substrate,and additives on the electrodeposition behavior,microstructure,and properties of copper foil are discussed in detail.Then the regulation strategies of mechanical properties of electrolytic copper foil are also summarized,including the formation of nanotwins and texture.Furthermore,the recent advances in novel electrolytic copper foils,such as composite foils and extra-thin copper foils,are also overviewed.Lastly,the remaining challenges and perspectives on the further development of electrolytic copper foils are presented. 展开更多
关键词 Electrolytic copper foil Fabrication processes ELECTRODEPOSITION MICROSTRUCTURE Mechanical properties
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Edge cracking behavior of copper foil in asymmetrical micro-rolling
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作者 Jing-qi CHEN Lin-yun ZHENG +7 位作者 Wei ZHAO Zhen-hua BAI Xue-tong LI Ri-huan LU Shou-dong CHEN Xiang-hua LIU Hai-tao GAO Hai-liang YU 《Transactions of Nonferrous Metals Society of China》 2025年第5期1634-1647,共14页
The edge crack behavior of copper foil in asymmetrical micro-rolling was studied.The effects of the speed ratio between rolls,grain size and stress state in the deformation zone on edge cracks of the rolled piece in a... The edge crack behavior of copper foil in asymmetrical micro-rolling was studied.The effects of the speed ratio between rolls,grain size and stress state in the deformation zone on edge cracks of the rolled piece in asymmetrical rolling were analyzed.Low plasticity,uneven deformation and longitudinal secondary tensile stress generated in the edge area of the rolled piece during the rolling process are the main causes of edge cracks.The larger the grain size of the rolled piece,the smaller the number of edge cracks and the deeper the expansion depth,and the larger the spacing between cracks under the same rolling reduction.Asymmetrical rolling can effectively increase the rolling reduction at when the copper foil fist shows edge cracks compared to symmetrical rolling.This enhancement is attributed to the shearing stress induced by asymmetrical rolling,which reduces the rolling force and longitudinal secondary tensile stress,and increases the residual compressive stress on the surface of the rolled piece.The edge crack defects of copper foil can be effectively reduced by increasing the speed ratio between the rolls in asymmetrical rolling. 展开更多
关键词 edge crack copper foil asymmetrical rolling size effect
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Mechanical properties and microstructure of rolled and electrodeposited thin copper foil 被引量:7
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作者 Xiang-Qian Yin Li-Jun Peng +5 位作者 Saif Kayani Lei Cheng Jian-Wei Wang Wei Xiao Li-Gen Wang Guo-Jie Huang 《Rare Metals》 SCIE EI CAS CSCD 2016年第12期909-914,共6页
Commercial grade rolled and electrodeposited copper foils from Japan and China were selected, and their mechanical properties and microstructure were investigated. It was observed that there are notable differences in... Commercial grade rolled and electrodeposited copper foils from Japan and China were selected, and their mechanical properties and microstructure were investigated. It was observed that there are notable differences in fracture strength, elongation at break and hydrophilicity between rol- led and electrodeposited copper foils. The rolled copper foils have higher tensile strength, lower ductility and larger static contact angle than electrodeposited copper foils. The rolled copper foils contain a [^-fiber texture, and the electrodeposited copper foils have random crystalline orientations. It was also observed that the rolled foils have packed grains, and elec- trodeposited foils have equiaxial grains. The uniform fine grain size and a few substructures of Japanese electrode- posited foils are major reasons for their higher elongation. 展开更多
关键词 copper foil ROLLING Electrodepositing TEXTURE SUBSTRUCTURE
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Trace bis-(3-sulfopropyl)-disulfide enhanced electrodeposited copper foils 被引量:12
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作者 Lingling Liu Yeqiang Bu +5 位作者 Yue Sun Jianfeng Pan Jiabin Liu Jien Ma Lin Qiu Youtong Fang 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 2021年第15期237-245,共9页
Smooth and strong copper foils are highly required for the development of printed circuit boards and Li-ion batteries.Adding additives is an efficient and low-cost method to enhance electrodeposited copper foils.Here ... Smooth and strong copper foils are highly required for the development of printed circuit boards and Li-ion batteries.Adding additives is an efficient and low-cost method to enhance electrodeposited copper foils.Here we chose Bis-(3-sulfopropyl)-disulfide(SPS)as the additive and investigated its concentration on the surface roughness and tensile strength of the electrodeposited copper foils.A copper foil with the smoothest surface(Rz=2.1μm)and the highest tensile strength(~338 MPa)was prepared with1.5 mg/L SPS.The contact angle on the copper foil decreased with the reduction of surface roughness.The enhancing mechanism of the SPS was investigated by scanning electron microscopy and X-ray diffraction.The refined grain and enhanced(220)texture were considered to be the radical reason for the smooth and strong copper foils.The electrochemical results prove the suppressing effect is related to the SPS adsorption. 展开更多
关键词 Electrodeposited copper foil Bis-(3-sulfopropyl)-disulfide Surface roughness Tensile strength
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Effects of Corrosion Inhibitors on Lubrication Performance of Rolling Oil for Copper Foil 被引量:5
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作者 Xiong Sang Sun Jianlin +1 位作者 Zeng Yingfeng Xu Yang 《China Petroleum Processing & Petrochemical Technology》 SCIE CAS 2014年第2期71-78,共8页
The 2,5-bis(ethyldisulfanyl)-l,3,4-thiadiazole (T561), benzotriazole (BTA),1-N, N-bis (2-ethylhexyl) aminomethyl-4-methyl-lh-benzotriazole (IRGAMET39) and I-IN, N-bis (2-ethylhexyl) aminomethyl] methyl ben... The 2,5-bis(ethyldisulfanyl)-l,3,4-thiadiazole (T561), benzotriazole (BTA),1-N, N-bis (2-ethylhexyl) aminomethyl-4-methyl-lh-benzotriazole (IRGAMET39) and I-IN, N-bis (2-ethylhexyl) aminomethyl] methyl benzotriazole (TT- LX) have been evaluated as corrosion inhibitors used in rolling oil for cold rolling of copper foil. The MRS-10A four-ball friction and wear tests have been carried out to compare their tribological properties, and the lubricating performance of rolling oils has been studied through rolling experiments. The oil sample containing IRGAMET 39 has the same PB value as that one containing T561, with the coefficient of friction increased by 35.6% and wear scar diameter decreased by 4%. The minimum rolling gauge has been studied after rolling lubrication, but the results show that inhibitors have no effect on it. Scanning electron microscopy (SEM) and energy dispersive spectrometry (EDS) analyses have indicated that the inhibitor is adsorbed on the copper surface to prevent copper from being corroded easily. In addition, the LEXT OLS4000 laser confocal microscopy has been used to observe the foil surface which shows that the streaks of foil surface are clear, the scratches are shallow and the surface failure is improved effectively. 展开更多
关键词 copper foil corrosion inhibitor cold rolling surface topography LUBRICATION
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Copper foils with gradient structure in thickness direction and different roughnesses on two surfaces fabricated by double rolling 被引量:1
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作者 Xi-yong Wang Xue-feng Liu +1 位作者 Wen-jiang Zou Jian-xin Xie 《International Journal of Minerals,Metallurgy and Materials》 SCIE EI CAS CSCD 2013年第12期1170-1175,共6页
Copper foils with gradient structure in thickness direction and different roughnesses on two surfaces were fabricated by double rolling. The two surface morphologies of double-rolled copper foils are quite different, ... Copper foils with gradient structure in thickness direction and different roughnesses on two surfaces were fabricated by double rolling. The two surface morphologies of double-rolled copper foils are quite different, and the surface roughness values are 61 and 1095 nm, respectively. The roughness value of matt surface can meet the requirement for bonding the resin matrix with copper foils used for flexible printed circuit boards, thus may omit traditional roughening treatment; the microstructure of double-rolled copper foils demonstrates an obviously asymmetric gradient feature. From bright surface to matt surface in thickness direction, the average grain size first increases from 2.3 to 7.4 μm and then decreases to 3.6 μm; compared with conventional rolled copper foils, the double-rolled copper foils exhibit a remarkably increased bending fatigue life, and the increased range is about 16.2%. 展开更多
关键词 copper foils ROLLING SURFACES gradient structure fatigue of materials
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Single-crystallization of electrolytic copper foils 被引量:1
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作者 Xingguang Li Mengze Zhao +13 位作者 Quanlin Guo Chong Zhao Mingchao Ding Dingxin Zou Zhiqiang Ding Zhiqiang Zhang Menglin He Kehai Liu Muhong Wu Zhihong Zhang Enge Wang Ying Fu Kaihui Liu Zhibin Zhang 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 2024年第9期112-118,共7页
Depending on the production process,copper(Cu)foils can be classified into two types,i.e.,rolled copper(r-Cu)foils and electrolytic copper(e-Cu)foils.Owing to their high electrical conductivity and ductility at low co... Depending on the production process,copper(Cu)foils can be classified into two types,i.e.,rolled copper(r-Cu)foils and electrolytic copper(e-Cu)foils.Owing to their high electrical conductivity and ductility at low cost,e-Cu foils are employed extensively in modern industries and account for more than 98%of the Cu foil market share.However,industrial e-Cu foils have never been single-crystallized due to their high density of grain boundaries,various grain orientations and vast impurities originating from the electrochemical deposition process.Here,we report a methodology of transforming industrial e-Cu foils into single crystals by facet copy from a single-crystal template.Different facets of both low and high indices are successfully produced,and the thickness of the single crystal can reach 500μm.Crystallographic characterizations directly recognized the single-crystal copy process,confirming the complete assimilation impact from the template.The obtained single-crystal e-Cu foils exhibit remarkably improved ductility(elongation-to-fracture of 105%vs.25%),fatigue performance(the average numbers of cycles to failure of 1600 vs.200)and electrical property(electrical conductivity of 102.6%of the international annealed copper standard(IACS)vs.98.5%)than original ones.This work opens up a new avenue for the preparation of single-crystal e-Cu foils and may expand their applications in high-speed,flexible,and wearable devices. 展开更多
关键词 Electrolytic copper foil Single-crystallization Facet copy Grain growth Mechanical property
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Purification of copper foils driven by single crystallization
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作者 寇金宗 赵孟泽 +10 位作者 李兴光 何梦林 杨方友 刘科海 成庆秋 任云龙 刘灿 付莹 吴慕鸿 刘开辉 王恩哥 《Chinese Physics B》 SCIE EI CAS CSCD 2024年第2期506-511,共6页
High-purity copper(Cu) with excellent thermal and electrical conductivity, is crucial in modern technological applications, including heat exchangers, integrated circuits, and superconducting magnets. The current puri... High-purity copper(Cu) with excellent thermal and electrical conductivity, is crucial in modern technological applications, including heat exchangers, integrated circuits, and superconducting magnets. The current purification process is mainly based on the zone/electrolytic refining or anion exchange, however, which excessively relies on specific integrated equipment with ultra-high vacuum or chemical solution environment, and is also bothered by external contaminants and energy consumption. Here we report a simple approach to purify the Cu foils from 99.9%(3N) to 99.99%(4N) by a temperature-gradient thermal annealing technique, accompanied by the kinetic evolution of single crystallization of Cu.The success of purification mainly relies on(i) the segregation of elements with low effective distribution coefficient driven by grain-boundary movements and(ii) the high-temperature evaporation of elements with high saturated vapor pressure.The purified Cu foils display higher flexibility(elongation of 70%) and electrical conductivity(104% IACS) than that of the original commercial rolled Cu foils(elongation of 10%, electrical conductivity of ~ 100% IACS). Our results provide an effective strategy to optimize the as-produced metal medium, and therefore will facilitate the potential applications of Cu foils in precision electronic products and high-frequency printed circuit boards. 展开更多
关键词 PURIFICATION copper foil thermal annealing technique single crystallization
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Study on Surface Adsorption and Inhibition Behavior of Corrosion Inhibitors Contained in Copper Foil Rolling Oil 被引量:3
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作者 Xiong Sang Sun Jianlin +3 位作者 Jiang Wei Xu Yang Zeng Yingfeng Xia Lei 《China Petroleum Processing & Petrochemical Technology》 SCIE CAS 2015年第1期96-107,共12页
Adsorption and inhibition behavior of 2,5-bis(ethyldisulfanyl)-1,3,4-thiadiazole(DMTDA) and N-((6-methyl-1H-benzo[d][1,2,3]triazol-1-yl)methyl)-N-octyloctan-1-amine(EAMBA) as corrosion inhibitors contained in copper f... Adsorption and inhibition behavior of 2,5-bis(ethyldisulfanyl)-1,3,4-thiadiazole(DMTDA) and N-((6-methyl-1H-benzo[d][1,2,3]triazol-1-yl)methyl)-N-octyloctan-1-amine(EAMBA) as corrosion inhibitors contained in copper foil rolling oil have been investigated using gravimetric and electrochemical techniques. Meanwhile, scanning electron microscopy(SEM) and energy dispersive spectrometer(EDS) have been employed to observe the surface topography and analyze the components on copper foil. The results show that the rolling oil containing DMTDA and EAMBA can significantly decrease the dissolution rate and increase the inhibition efficiency of samples, especially in the case of best compounded rolling oil system. The SEM and EDS investigations also confirmed that the protection of the copper foil surface is achieved by strong adsorption of the molecules which can prevent copper from being corroded easily. Reactivity descriptors of the corrosion inhibitors have been calculated by the density functional theory(DFT) and the reactivity has been analyzed through the molecular orbital and Fukui indices. Active sites of inhibitor are mainly concentrated on the ring and the polar functional groups, and in the meanwhile, the distribution is helpful to form coordination and backbonding among molecules and then to form stable adsorption on the metal surface. And this work provides theoretical evidence for the selection of corrosion inhibitors contained in copper foil rolling oil. 展开更多
关键词 copper foil surface corrosion INHIBITOR ELECTROCHEMISTRY DFT REACTIVITY adsorption
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Remarkable Performance in Lithium Battery Copper Foil Market
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《China Nonferrous Metals Monthly》 2018年第5期7-9,共3页
2018 government work report indicates that'We should strengthen fundamental role of consumption in economic development,as well as promote consumption upgrading and develop new business models of consumer sector.W... 2018 government work report indicates that'We should strengthen fundamental role of consumption in economic development,as well as promote consumption upgrading and develop new business models of consumer sector.We will extend preferential policies on NEV vehicle purchase tax for another three years'. 展开更多
关键词 In Remarkable Performance in Lithium Battery copper foil Market
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Far-reaching Impact of The Fastgrowing Lithium Foil Market on The Development of The Copper Foil Industry
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《China Nonferrous Metals Monthly》 2017年第5期1-5,共5页
What is the profound impact of the fastgrowing lithium foil market on the copper foil industry and market?How long can the prosperous lithium foil market last?When will the imbalanced supply and demand of lithium foil... What is the profound impact of the fastgrowing lithium foil market on the copper foil industry and market?How long can the prosperous lithium foil market last?When will the imbalanced supply and demand of lithium foil be solved?When will the acute supply shortage of standard foil be relieved?How 展开更多
关键词 will Far-reaching Impact of The Fastgrowing Lithium foil Market on The Development of The copper foil Industry
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Research and Analysis of Production and New Capacity of China's Electronic Copper Foil Enterprises in 2017
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《China Nonferrous Metals Monthly》 2017年第9期1-2,共2页
In the light of current fast development of new and expanded copper foil projects of electronic copper foil enterprises and recent adjustment of the main copper foil categories set to be developed by some companies(ge... In the light of current fast development of new and expanded copper foil projects of electronic copper foil enterprises and recent adjustment of the main copper foil categories set to be developed by some companies(generally from lithium foil to PCB foil).The secretariat of China Electronics Materials Industry Association e-copper foil branch conducted in March,2017 an extensive and in-depth 展开更多
关键词 Research and Analysis of Production and New Capacity of China’s Electronic copper foil Enterprises in 2017
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面向电镀铜箔表面成像的Hessian矩阵微缺陷检测
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作者 王艳华 《电镀与精饰》 北大核心 2026年第1期18-24,52,共8页
电镀铜箔表面微缺陷尺寸微小,利用全聚焦成像可提升分辨率,由于不同类型的微缺陷尺寸和形态分布在一个较宽的范围内,而单一图像处理算法参数难以有效检测所有类型的缺陷,需要一种能自适应不同尺度的分析方法。对此,本文提出一种面向电... 电镀铜箔表面微缺陷尺寸微小,利用全聚焦成像可提升分辨率,由于不同类型的微缺陷尺寸和形态分布在一个较宽的范围内,而单一图像处理算法参数难以有效检测所有类型的缺陷,需要一种能自适应不同尺度的分析方法。对此,本文提出一种面向电镀铜箔表面成像的Hessian矩阵微缺陷检测方法。通过调控电镀液添加剂成分,制备了具有针孔与表面粗糙两类典型缺陷的可控样本及无缺陷对比样本。采用电磁超声全聚焦成像技术对样本进行检测,利用其横波模式对表面缺陷的高灵敏度,获取了高信噪比的缺陷图像数据;并针对成像结果中缺陷特征,提出了一种基于Hessian矩阵与多尺度分析的缺陷检测算法。该算法通过计算Hessian矩阵特征值实现点状与线状缺陷的增强,结合多尺度响应融合与余弦相似度计算,有效实现了复杂背景下的微缺陷精准识别。结果表明,所制备的缺陷样本特征鲜明,电磁超声TFM成像能清晰区分不同缺陷类型;所提出的缺陷检测方法在对比实验中显著优于对比方法,具有更高的检测精度与抗干扰能力,为电镀铜箔的工艺优化与在线质量检测提供了可靠的技术手段。 展开更多
关键词 电镀铜箔 表面微缺陷 电磁超声 全聚焦成像
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Preparation of graphene on Cu foils by ion implantation with negative carbon clusters
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作者 李慧 尚艳霞 +3 位作者 张早娣 王泽松 张瑞 付德君 《Chinese Physics B》 SCIE EI CAS CSCD 2015年第1期528-530,共3页
We report on few-layer graphene synthesized on Cu foils by ion implantation using negative carbon cluster ions,followed by annealing at 950?C in vacuum. Raman spectroscopy reveals IG/I2 Dvalues varying from 1.55 to 2... We report on few-layer graphene synthesized on Cu foils by ion implantation using negative carbon cluster ions,followed by annealing at 950?C in vacuum. Raman spectroscopy reveals IG/I2 Dvalues varying from 1.55 to 2.38 depending on energy and dose of the cluster ions, indicating formation of multilayer graphene. The measurements show that the samples with more graphene layers have fewer defects. This is interpreted by graphene growth seeded by the first layers formed via outward diffusion of C from the Cu foil, though nonlinear damage and smoothing effects also play a role. Cluster ion implantation overcomes the solubility limit of carbon in Cu, providing a technique for multilayer graphene synthesis. 展开更多
关键词 ion implantation carbon clusters GRAPHENE copper foil
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不同添加剂对硫酸盐体系电沉积制备锂电铜箔的影响
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作者 舒霞 王岩 +7 位作者 秦永强 洪雨 徐龙 黄国平 操声跃 殷勇 张勇 吴玉程 《电镀与涂饰》 北大核心 2025年第5期68-76,共9页
[目的]添加剂的选择和复配及其对镀液性能的影响是锂电铜箔制备过程中的关键技术问题。[方法]在硫酸盐体系电解液中分别添加Cl^(-)、DPS(N,N-二甲基-二硫代羰基丙烷磺酸钠)、SPS(聚二硫二丙烷磺酸钠)、蛋白肽、PEG 6000(聚乙二醇)和OP-... [目的]添加剂的选择和复配及其对镀液性能的影响是锂电铜箔制备过程中的关键技术问题。[方法]在硫酸盐体系电解液中分别添加Cl^(-)、DPS(N,N-二甲基-二硫代羰基丙烷磺酸钠)、SPS(聚二硫二丙烷磺酸钠)、蛋白肽、PEG 6000(聚乙二醇)和OP-10(十二烷基酚聚氧乙烯醚乳化剂)添加剂,采用阴极线性扫描伏安法(LSV)研究各自对铜电沉积行为的影响。[结果]Cl^(-)和DPS对铜离子的还原具有明显的促进作用,蛋白肽、PEG 6000和OP-10抑制铜离子还原,SPS与Cl^(-)协同作用时可促进铜离子还原。[结论]阴极线性扫描伏安法可快速评估添加剂的作用效果,为锂电铜箔生产中添加剂的筛选与复配提供有效指导。 展开更多
关键词 锂电铜箔 电沉积 添加剂 阴极线性扫描伏安曲线
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电解铜箔微观结构与力学性能影响因素的研究进展
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作者 杨誉淞 唐健 +5 位作者 李银 杨斌 张克宇 张少泽 姚耀春 胡均贤 《化工进展》 北大核心 2025年第9期5043-5054,共12页
电解铜箔作为锂离子电池负极材料的重要组成部分,其性能直接关系到电池的电化学特性和安全性。本文系统探讨了电沉积工艺参数和添加剂对铜箔性能的影响,重点分析了铜离子浓度、电解液温度、电流密度和电解液循环等因素对铜箔晶粒尺寸、... 电解铜箔作为锂离子电池负极材料的重要组成部分,其性能直接关系到电池的电化学特性和安全性。本文系统探讨了电沉积工艺参数和添加剂对铜箔性能的影响,重点分析了铜离子浓度、电解液温度、电流密度和电解液循环等因素对铜箔晶粒尺寸、表面粗糙度和电化学性能的作用。研究表明,适宜的铜离子浓度和电解液温度有助于获得均匀细小的晶粒和更平滑的表面,而电流密度的提高可以在一定程度上提升铜箔的沉积速率和电流效率。添加剂的使用对铜箔的晶粒细化、表面质量和内应力分布具有重要作用,不同添加剂之间的协同和竞争作用需要精细调控以优化铜箔性能。尽管电解铜箔在锂离子电池中的应用已经取得了显著进展,但仍存在提高产品一致性和性能稳定性的挑战。未来的研究和开发工作需要聚焦于提高电解铜箔的生产效率、产品质量以及环境可持续性,同时控制和降低生产成本。 展开更多
关键词 电解铜箔 电沉积工艺 添加剂 微观结构 力学性能
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搅拌速度对废电路板酸浸液中脉冲电沉积铜箔的影响
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作者 孙艳 刘洪军 +1 位作者 李亚敏 李伟盛 《材料导报》 北大核心 2025年第18期146-152,共7页
基于废电路板酸浸液采用脉冲电沉积工艺制备铜箔,研究了搅拌速度对铜箔组织和性能的影响。研究表明:搅拌速度增加到200 r/min以上可获得铜箔,继续增加搅拌速度,晶粒变细且晶粒之间更加紧密,晶粒取向趋向于(220)晶面的高度择优;搅拌速度... 基于废电路板酸浸液采用脉冲电沉积工艺制备铜箔,研究了搅拌速度对铜箔组织和性能的影响。研究表明:搅拌速度增加到200 r/min以上可获得铜箔,继续增加搅拌速度,晶粒变细且晶粒之间更加紧密,晶粒取向趋向于(220)晶面的高度择优;搅拌速度为400 r/min时,铜箔的抗拉强度及延伸率均比200 r/min时高1倍多,纯度基本不变,600 r/min时铜箔抗拉强度下降39.8%,延伸率略下降0.07%,纯度下降0.2%。搅拌速度通过控制传质速度来改变晶粒大小和晶面择优取向,从而影响铜箔的组织和性能,搅拌速度为400 r/min时,铜箔的纯度、抗拉强度和延伸率分别达到99.91%、218.9 MPa和20.6%。 展开更多
关键词 废电路板 铜箔 酸浸液 搅拌速度 脉冲电沉积
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后处理工艺对铜箔微观组织及电化学性能的影响
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作者 张博 孙万昌 +6 位作者 李凤 刘二勇 周梦然 许一凡 蔡辉 张菁丽 贾天泽 《热加工工艺》 北大核心 2025年第24期84-92,共9页
随着5G通讯技术及新能源汽车的更新换代,对电路板用铜箔提出了更高要求。电解原箔表面经过预处理、粗化、固化、镀锌及镀铬等一系列后处理工艺,才能提高铜箔的组织及性能,满足5G通讯高端电路板的应用。通过优化铜箔光面镀锌和镀铬工艺条... 随着5G通讯技术及新能源汽车的更新换代,对电路板用铜箔提出了更高要求。电解原箔表面经过预处理、粗化、固化、镀锌及镀铬等一系列后处理工艺,才能提高铜箔的组织及性能,满足5G通讯高端电路板的应用。通过优化铜箔光面镀锌和镀铬工艺条件,分析了镀锌和镀铬工艺参数(电流密度、沉积时间、镀液温度)对铜箔光面锌阻挡层和铬钝化层微观组织及电化学性能的影响。结果表明,当镀锌电流密度为2 A/dm^(2)、沉积时间为16 s、锌镀液温度为40℃时,镀锌层的微观形貌致密,耐腐蚀性能最佳;当镀铬电流密度为1 A/dm^(2)、沉积时间为15 s、铬镀液温度为30℃时,铬钝化层性能优异。 展开更多
关键词 电路板用铜箔 铜箔光面 后处理 镀锌 镀铬 电化学性能
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DPS添加剂对高抗拉低轮廓锂电铜箔的调控研究
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作者 赵嫚 廖娟 +3 位作者 赵蒙 刘伟飞 唐云志 樊小伟 《昆明理工大学学报(自然科学版)》 北大核心 2025年第4期17-25,共9页
铜箔作为锂离子电池的集流体,其力学性能和表面性能对锂离子电池有着重要的影响.在锂电铜箔的制备过程中添加微量的添加剂是改变其性能的有效方法,但单一添加剂发挥的作用有限.本研究以胶原蛋白、聚二硫二丙烷磺酸钠(SPS)、醇硫丙烷磺酸... 铜箔作为锂离子电池的集流体,其力学性能和表面性能对锂离子电池有着重要的影响.在锂电铜箔的制备过程中添加微量的添加剂是改变其性能的有效方法,但单一添加剂发挥的作用有限.本研究以胶原蛋白、聚二硫二丙烷磺酸钠(SPS)、醇硫丙烷磺酸盐(HP)、N,N-二甲基-二硫代甲酰胺丙烷磺酸钠(DPS)作为复合添加剂,制备了抗拉强度为502.39 MPa、粗糙度为0.737μm、厚度为6μm的锂电铜箔.同时,探究了复合添加中DPS对铜箔电化学特性、表面微观性能和晶体结构的影响.结果表明:DPS的加入减小了铜箔的晶粒尺寸,提高了晶界密度,减弱了(111)晶面择优取向,从而增加了位错运动阻力,提升了铜箔的力学性能;DPS、SPS、HP三者之间存在协同作用,加强了与胶原蛋白的竞争吸附,进一步细化了铜晶粒,改善了铜箔的表面性能;DPS通过细化晶粒尺寸、增大晶界面积,有效抑制晶体滑移,降低应力集中程度,从而实现铜箔力学性能的提升. 展开更多
关键词 电解铜箔 复合添加剂 锂电铜箔 抗拉强度
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硫脲对复合添加剂体系电解制备超低轮廓电解铜箔性能的影响
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作者 吴敏娴 张然 +4 位作者 明智耀 王文昌 秦水平 光崎尚利 陈智栋 《电镀与精饰》 北大核心 2025年第3期77-82,共6页
电解铜箔是电子制造领域不可或缺的材料之一,随着5G通信技术的快速发展与广泛应用,对电解铜箔的性能提出了更高的要求。除了需要满足“低轮廓”的基础要求,铜箔还需要具有高抗拉强度、高延伸率、高导电性、及良好的耐蚀性等。本文报道... 电解铜箔是电子制造领域不可或缺的材料之一,随着5G通信技术的快速发展与广泛应用,对电解铜箔的性能提出了更高的要求。除了需要满足“低轮廓”的基础要求,铜箔还需要具有高抗拉强度、高延伸率、高导电性、及良好的耐蚀性等。本文报道了硫脲在由PEG、HP、MESS组成的复合添加剂体系中对电解铜箔性能的影响。利用扫描电镜和粗糙度仪研究了硫脲对铜箔表面粗糙度的影响,结果表明硫脲可有效降低铜箔粗糙度至0.32μm。拉伸实验结果表明,复合添加剂体系中硫脲的加入有利电解铜箔的抗拉强度(514MPa)和延伸率(4.57%)的提高。此外,中性模拟海水的动电位极化曲线测试显示硫脲的加入还有效提高了电解铜箔的耐腐蚀性。 展开更多
关键词 中文电解铜箔 硫脲 低轮廓 抗拉强度 延伸率 耐腐蚀性
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