This study explores the application of cold plate liquid cooling technology in co-packaged optics(CPO).By integrating optical modules and the switch chip on the same substrate,CPO shortens the electrical interconnecti...This study explores the application of cold plate liquid cooling technology in co-packaged optics(CPO).By integrating optical modules and the switch chip on the same substrate,CPO shortens the electrical interconnection distance,effectively solving the problems of high power consumption and poor signal integrity of traditional pluggable optical modules under high bandwidth.However,the surge in power density and the thermal crosstalk resulting from high integration density make thermal management one of the key challenges that constrain the reliability of high-capacity co-packaged optics.For the unique architecture of CPO,this study analyzes its heat dissipation needs in detail,and a thermal management scheme is designed.The thermal management scheme is simulated and optimized based on the Navier−Stokes equation.The simulation results show that,in a 51.2 Tbit/s CPO system,the junction temperature of the switch chip is 97.3℃,the maximum junction temperature of the optical modules is 31.3℃,and the temperature difference between the optical modules is 2.4℃ to 1.2℃.To verify the simulation results,a thermal test experimental platform is built,and the experimental results show that the temperature simulation difference is within 4%and the pressure change trend is consistent with the simulation.Combining the experimental data and simulation results,the designed heat sink can satisfy the heat dissipation demands of the 51.2 Tbit/s bandwidth CPO system.This conclusion demonstrates the potential of liquid-cooling technology in CPO,providing support for research on liquid-cooling technology in the CPO.The design provides a theoretical and practical basis for the high performance and reliability of optoelectronic integration technology in wavelength division multiplexing(WDM)systems and micro-ring device applications,contributing to the application of next-generation optical communication networks.展开更多
Due to the rise of 5G,IoT,AI,and high-performance computing applications,datacenter trafc has grown at a compound annual growth rate of nearly 30%.Furthermore,nearly three-fourths of the datacenter trafc resides withi...Due to the rise of 5G,IoT,AI,and high-performance computing applications,datacenter trafc has grown at a compound annual growth rate of nearly 30%.Furthermore,nearly three-fourths of the datacenter trafc resides within datacenters.The conventional pluggable optics increases at a much slower rate than that of datacenter trafc.The gap between application requirements and the capability of conventional pluggable optics keeps increasing,a trend that is unsustainable.Copackaged optics(CPO)is a disruptive approach to increasing the interconnecting bandwidth density and energy efciency by dramatically shortening the electrical link length through advanced packaging and co-optimization of electronics and photonics.CPO is widely regarded as a promising solution for future datacenter interconnections,and silicon platform is the most promising platform for large-scale integration.Leading international companies(e.g.,Intel,Broadcom and IBM)have heavily investigated in CPO technology,an inter-disciplinary research feld that involves photonic devices,integrated circuits design,packaging,photonic device modeling,electronic-photonic co-simulation,applications,and standardization.This review aims to provide the readers a comprehensive overview of the state-of-the-art progress of CPO in silicon platform,identify the key challenges,and point out the potential solutions,hoping to encourage collaboration between diferent research felds to accelerate the development of CPO technology.展开更多
基金support from the Beijing Municipal Science and Technology Project(No.Z241100004224020)the National Natural Science Foundation of China(Grant No.62204258)the Key Research and Development Program of Jiangsu(No.BE2022051-3).
文摘This study explores the application of cold plate liquid cooling technology in co-packaged optics(CPO).By integrating optical modules and the switch chip on the same substrate,CPO shortens the electrical interconnection distance,effectively solving the problems of high power consumption and poor signal integrity of traditional pluggable optical modules under high bandwidth.However,the surge in power density and the thermal crosstalk resulting from high integration density make thermal management one of the key challenges that constrain the reliability of high-capacity co-packaged optics.For the unique architecture of CPO,this study analyzes its heat dissipation needs in detail,and a thermal management scheme is designed.The thermal management scheme is simulated and optimized based on the Navier−Stokes equation.The simulation results show that,in a 51.2 Tbit/s CPO system,the junction temperature of the switch chip is 97.3℃,the maximum junction temperature of the optical modules is 31.3℃,and the temperature difference between the optical modules is 2.4℃ to 1.2℃.To verify the simulation results,a thermal test experimental platform is built,and the experimental results show that the temperature simulation difference is within 4%and the pressure change trend is consistent with the simulation.Combining the experimental data and simulation results,the designed heat sink can satisfy the heat dissipation demands of the 51.2 Tbit/s bandwidth CPO system.This conclusion demonstrates the potential of liquid-cooling technology in CPO,providing support for research on liquid-cooling technology in the CPO.The design provides a theoretical and practical basis for the high performance and reliability of optoelectronic integration technology in wavelength division multiplexing(WDM)systems and micro-ring device applications,contributing to the application of next-generation optical communication networks.
基金supported by the National Key Research and Development Program of China(No.2019YFB2203004).
文摘Due to the rise of 5G,IoT,AI,and high-performance computing applications,datacenter trafc has grown at a compound annual growth rate of nearly 30%.Furthermore,nearly three-fourths of the datacenter trafc resides within datacenters.The conventional pluggable optics increases at a much slower rate than that of datacenter trafc.The gap between application requirements and the capability of conventional pluggable optics keeps increasing,a trend that is unsustainable.Copackaged optics(CPO)is a disruptive approach to increasing the interconnecting bandwidth density and energy efciency by dramatically shortening the electrical link length through advanced packaging and co-optimization of electronics and photonics.CPO is widely regarded as a promising solution for future datacenter interconnections,and silicon platform is the most promising platform for large-scale integration.Leading international companies(e.g.,Intel,Broadcom and IBM)have heavily investigated in CPO technology,an inter-disciplinary research feld that involves photonic devices,integrated circuits design,packaging,photonic device modeling,electronic-photonic co-simulation,applications,and standardization.This review aims to provide the readers a comprehensive overview of the state-of-the-art progress of CPO in silicon platform,identify the key challenges,and point out the potential solutions,hoping to encourage collaboration between diferent research felds to accelerate the development of CPO technology.
