Target assembly is a key consumable material for producing thin fi lm used in the electronic packaging and devices. The residual stresses induced during the process of soldering are detrimental to the performance of t...Target assembly is a key consumable material for producing thin fi lm used in the electronic packaging and devices. The residual stresses induced during the process of soldering are detrimental to the performance of target assembly. In this work, the intensity and distribution of the soldering residual stress of Co/In/Cu target assembly subjected to a 20 W/(m^2 K) cooling condition corresponding to the actual air cooling process were studied, based on fi nite element simulation and Taguchi method, to optimize the sputtering target assembly. Effects of different control factors, including solder material, thickness of solder layer, target and backing plate, on the soldering residual stress of target assembly are investigated. The maximum residual stress is calculated as 9.28 MPa in the target located at 0.16 mm from target–solder layer interface and at a distance of 0.78 mm from symmetry axis. The optimal design in target assembly has the combination of indium solder material, cobalt target at 12 mm thick, solder layer at 0.8 mm thick, copper backing plate at 15 mm thick. Moreover, solder material is the most important factor among control factors in the target assembly.展开更多
采用放电等离子烧结技术制备了Tb Fe Co/Ti复合梯度磁光靶材。利用扫描电子显微镜和电子能谱对材料的显微组织形貌及化学成分进行了观察和分析。结果表明 ,这种Tb Fe Co/Ti复合梯度靶材具有宏观组织不均匀性和微观组织连续性的特征。各...采用放电等离子烧结技术制备了Tb Fe Co/Ti复合梯度磁光靶材。利用扫描电子显微镜和电子能谱对材料的显微组织形貌及化学成分进行了观察和分析。结果表明 ,这种Tb Fe Co/Ti复合梯度靶材具有宏观组织不均匀性和微观组织连续性的特征。各梯度层之间的原子扩散现象不明显。层间界面结合良好 ,不存在微裂纹 ,从而具有较好的力学性能。展开更多
基金supported financially by the National Key R&D Program of China (No. 2017YFB0305501)the National Natural Science Foundation of China (No. 51475220)the China Postdoctoral Science Foundation Funded Project (No. 2016M591464)
文摘Target assembly is a key consumable material for producing thin fi lm used in the electronic packaging and devices. The residual stresses induced during the process of soldering are detrimental to the performance of target assembly. In this work, the intensity and distribution of the soldering residual stress of Co/In/Cu target assembly subjected to a 20 W/(m^2 K) cooling condition corresponding to the actual air cooling process were studied, based on fi nite element simulation and Taguchi method, to optimize the sputtering target assembly. Effects of different control factors, including solder material, thickness of solder layer, target and backing plate, on the soldering residual stress of target assembly are investigated. The maximum residual stress is calculated as 9.28 MPa in the target located at 0.16 mm from target–solder layer interface and at a distance of 0.78 mm from symmetry axis. The optimal design in target assembly has the combination of indium solder material, cobalt target at 12 mm thick, solder layer at 0.8 mm thick, copper backing plate at 15 mm thick. Moreover, solder material is the most important factor among control factors in the target assembly.
文摘采用放电等离子烧结技术制备了Tb Fe Co/Ti复合梯度磁光靶材。利用扫描电子显微镜和电子能谱对材料的显微组织形貌及化学成分进行了观察和分析。结果表明 ,这种Tb Fe Co/Ti复合梯度靶材具有宏观组织不均匀性和微观组织连续性的特征。各梯度层之间的原子扩散现象不明显。层间界面结合良好 ,不存在微裂纹 ,从而具有较好的力学性能。
