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Halogenated Metal-Organic Clusters for High-Resolution Extreme Ultraviolet Lithography Resists
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作者 Jinwen Li Zhaohui Zhu +6 位作者 Tianlei Ma Weina Li Kaimin Luo Yanshu Gu Jun Zhao Fu Li Min Tu 《Chinese Journal of Chemistry》 2026年第1期25-32,共8页
The relentless drive toward miniaturization in the semiconductor industry demands photoresists capable of patterning sub-20 nm features for next-generation extreme ultraviolet(EUV)lithography.Metal-oxo clusters,with s... The relentless drive toward miniaturization in the semiconductor industry demands photoresists capable of patterning sub-20 nm features for next-generation extreme ultraviolet(EUV)lithography.Metal-oxo clusters,with sub-5 nm molecular dimensions,structural tunability,and high EUV absorption via metal centers,have emerged as promising EUV photoresist candidates.Advancing next-generation photoresist materials necessitates resolving the inherent trade-offs between sensitivity,resolution,and line-edge roughness.In this work,we report a series of halogenated metal-organic clusters based EUVL photoresists,aiming to modulate the sensitivity,resolution,and line-edge roughness.Here,we report the synthesis of halogenated metal-organic clusters as EUVL photoresists,designed to modulate the resolution-line edge roughness-sensitivity trade-off.Sub-20 nm critical dimensions and line edge roughness below 2 nm were achieved with the clusters by EUVL.The results demonstrated that halogen elements influenced the sensitivity of the clusters.To unravel the EUV-driven reaction pathways,we analyzed the chemical transformations in these clusters after exposure using X-ray photoelectron spectroscopy and Fourier-transform infrared spectroscopy.These findings pave the way for the rational design of high-performance EUV photoresists. 展开更多
关键词 Extreme ultraviolet lithography E-beam lithography Photoresists Metal-oxo clusters ceric-oxo clusters Halogenated compounds Lithographic process Semiconductor manufacturing
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