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BOARD-LEVEL BUILT-IN SELF-REPAIR METHOD OF RAM 被引量:1
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作者 DOU Yanjie Zhan Huiqin +1 位作者 Chen Yakun Shang Hongliang 《Journal of Electronics(China)》 2012年第1期128-131,共4页
This paper describes the method of built-in self-repairing of RAM on board, designs hardware circuit, and logic for the RAM's faults self-repairing system based on FPGA. The key technology is that it utilizes FPGA... This paper describes the method of built-in self-repairing of RAM on board, designs hardware circuit, and logic for the RAM's faults self-repairing system based on FPGA. The key technology is that it utilizes FPGA to test RAM according to some algorithm to find out failure memory units and replace the faulty units with FPGA. Then it can build a memory that has no fault concern to external controller, and realizes the logic binding between external controller and RAM. Micro Controller Unit (MCU) can operate external RAM correctly even if RAM has some fault address units. Conventional MCS-51 is used to simulate the operation of MCU operating external memory. Simulation shows FPGA can complete the faulty address units' mapping and MCU can normally read and write external RAM. This design realizes the RAM's built-in self-repairing on board. 展开更多
关键词 RAM testing built-in self-repairing Faulty address mapping Function test
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Repair the faulty TSVs with the improved FNS-CAC codec
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作者 Wei Chen Cui Xiaole +2 位作者 Cui Xiaoxin Feng Xu Jin Yufeng 《The Journal of China Universities of Posts and Telecommunications》 EI CSCD 2021年第2期1-13,共13页
Through-silicon via(TSV)is a key enabling technology for the emerging 3-dimension(3 D)integrated circuits(ICs).However,the crosstalk between the neighboring TSVs is one of the important sources of the soft faults.To s... Through-silicon via(TSV)is a key enabling technology for the emerging 3-dimension(3 D)integrated circuits(ICs).However,the crosstalk between the neighboring TSVs is one of the important sources of the soft faults.To suppress the crosstalk,the Fibonacci-numeral-system-based crosstalk avoidance code(FNS-CAC)is an effective scheme.Meanwhile,the self-repair schemes are often used to deal with the hard faults,but the repaired results may change the mapping between signals to TSVs,thus may reduce the crosstalk suppression ability of FNS-CAC.A TSV self-repair technique with an improved FNS-CAC codec is proposed in this work.The codec is designed based on the improved Fibonacci numeral system(FNS)adders,which are adaptive to the health states of TSVs.The proposed self-repair technique is able to suppress the crosstalk and repair the faulty TSVs simultaneously.The simulation and analysis results show that the proposed scheme keeps the crosstalk suppression ability of the original FNS-CAC,and it has higher reparability than the local self-repair schemes,such as the signal-switching-based and the signal-shifting-based counterparts. 展开更多
关键词 through-silicon via(TSV) build-in self-repair(bisr) crosstalk avoidance code(CAC) Fibonacci number
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