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Evaluation of stress intensity factors for bi-material interface cracks using displacement jump methods 被引量:3
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作者 K. C. Nehar B. E. Hachi +1 位作者 F. Cazes M. Haboussi 《Acta Mechanica Sinica》 SCIE EI CAS CSCD 2017年第6期1051-1064,共14页
The aim of the present work is to investigate the numerical modeling of interfacial cracks that may appear at the interface between two isotropic elastic materials. The extended finite element method is employed to an... The aim of the present work is to investigate the numerical modeling of interfacial cracks that may appear at the interface between two isotropic elastic materials. The extended finite element method is employed to analyze brittle and bi-material interfacial fatigue crack growth by computing the mixed mode stress intensity factors(SIF). Three different approaches are introduced to compute the SIFs. In the first one, mixed mode SIF is deduced from the computation of the contour integral as per the classical J-integral method,whereas a displacement method is used to evaluate the SIF by using either one or two displacement jumps located along the crack path in the second and third approaches. The displacement jump method is rather classical for mono-materials,but has to our knowledge not been used up to now for a bimaterial. Hence, use of displacement jump for characterizing bi-material cracks constitutes the main contribution of the present study. Several benchmark tests including parametric studies are performed to show the effectiveness of these computational methodologies for SIF considering static and fatigue problems of bi-material structures. It is found that results based on the displacement jump methods are in a very good agreement with those of exact solutions, such as for the J-integral method, but with a larger domain of applicability and a better numerical efficiency(less time consuming and less spurious boundary effect). 展开更多
关键词 bi-material interface crack Mixed mode stress intensity factor Displacement jump X-FEM Fatigue crack growth
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How does the shape of an inclusion near a bi-material interface evolve to maintain uniform internal stress:the anti-plane shear case
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作者 Ming Dai Cun-Fa Gao 《Acta Mechanica Sinica》 2025年第12期98-110,共13页
In the theory of two-dimensional linear elasticity,an elliptical inclusion is known to attain a constant stress field when perfectly buried in an infinite homogeneous matrix if a uniform eigenstrain is applied to it.T... In the theory of two-dimensional linear elasticity,an elliptical inclusion is known to attain a constant stress field when perfectly buried in an infinite homogeneous matrix if a uniform eigenstrain is applied to it.The focus of this paper falls on the question:when the initially elliptical inclusion verges on a bi-material interface,what would happen to its configuration if it is required to retain the internal constant stress?Specifically,we explore the anti-plane shear version of this question(the version of plane deformations or three-dimensional deformations seems,however,insoluble at this stage),in which an inclusion undergoing a uniform(anti-plane shear)eigenstrain is embedded in a bi-material structure composed of two infinite elastic half-planes whose interface is straight and perfectly bonded,and the shape of the inclusion is to be determined such that the eigenstraininduced stress inside the inclusion appears to be a constant.Unlike most optimization methods-driven solution procedures for finding the shape of the inclusion approximately in which huge computation is required,we derive by a rigorous theoretical analysis an exact integral equation with respect to the boundary curve of the inclusion that is sufficiently and necessarily related to the existence of a constant stress inside the inclusion.We solve this integral equation via the use of some analytic techniques and present in several illustrative examples a variety of shapes of the inclusion achieving constant stresses.We discover some interesting phenomena for the evolution of the shape of the uniformly stressed inclusion relative to the stiffness of the nearby interface. 展开更多
关键词 bi-material interface Uniform stress Eshelby conjecture HALF-PLANE Inverse problem
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STRESS SINGULARITY ANALYSIS AT CRACK TIP ON BI-MATERIAL INTERFACES BASED ON HAMILTONIAN PRINCIPLE 被引量:5
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作者 Zhang Hongwu Zhong Wanxie Li Yunpeng, Research Institute of Engineering Mechanics, Dalian University of Technology, Dalian 116023 《Acta Mechanica Solida Sinica》 SCIE EI 1996年第2期124-138,共15页
In this paper, the stress singularity analysis at the crack tip on elastic bi-material interfaces is considered. The governing equations of plane elasticity In sectorial domain are derived to be in Hamiltonian form vi... In this paper, the stress singularity analysis at the crack tip on elastic bi-material interfaces is considered. The governing equations of plane elasticity In sectorial domain are derived to be in Hamiltonian form via variable substitution and variational principle. The methods of separation of variables and conjugate symplectic eigen-function expansion are developed to solve the equations in sectorial domain. The general formulae for the solution of stress singularities at the crack tip on bi-material interfaces are put forward, and a new solution technique for fracture problems is presented. 展开更多
关键词 interface crack fracture mechanics Hamiltonian principle
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Analysis of stress intensity factor in orthotropic bi-material mixed interface crack 被引量:2
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作者 赵文彬 张雪霞 +1 位作者 崔小朝 杨维阳 《Applied Mathematics and Mechanics(English Edition)》 SCIE EI 2014年第10期1271-1292,共22页
Adopting the complex function approach, the paper studies the stress intensity factor in orthotropic bi-material interface cracks under mixed loads. With con- sideration of the boundary conditions, a new stress functi... Adopting the complex function approach, the paper studies the stress intensity factor in orthotropic bi-material interface cracks under mixed loads. With con- sideration of the boundary conditions, a new stress function is introduced to transform the problem of bi-material interface crack into a boundary value problem of partial dif- ferential equations. Two sets of non-homogeneous linear equations with 16 unknowns are constructed. By solving the equations, the expressions for the real bi-material elastic constant εt and the real stress singularity exponents λt are obtained with the bi-material engineering parameters satisfying certain conditions. By the uniqueness theorem of limit, undetermined coefficients are determined, and thus the bi-material stress intensity factor in mixed cracks is obtained. The bi-material stress intensity factor characterizes features of mixed cracks. When orthotropic bi-materials are of the same material, the degenerate solution to the stress intensity factor in mixed bi-material interface cracks is in complete agreement with the present classic conclusion. The relationship between the bi-material stress intensity factor and the ratio of bi-material shear modulus and the relationship be- tween the bi-material stress intensity factor and the ratio of bi-material Young's modulus are given in the numerical analysis. 展开更多
关键词 interface crack stress intensity factor bi-material ORTHOTROPIC complexvariable method
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Crack-Tip Stress Analysis at a Bi-Material Interface by Photoelastic, Isopachic and FEA
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作者 George A. Papadopoulos Elen B. Bouloukou Elen G. Papadopoulou 《Materials Sciences and Applications》 2011年第8期1027-1032,共6页
The paper investigates the stress state at the bi-material interface crack-tip by the Photoelastic and Isopachic methods and the Finite Element Analysis (FEA). The principal stresses at the bi-material interface crack... The paper investigates the stress state at the bi-material interface crack-tip by the Photoelastic and Isopachic methods and the Finite Element Analysis (FEA). The principal stresses at the bi-material interface crack-tip are theoretically determined using the combination photoelastic and isopachic fringes. The size and the shape of crack-tip isochro-matic and isopachic fringes, at a bi-material interface under static load, are studied. When the crack-tip, which is perpendicular to interface, is placed at the interface of the bi-material, the isochromatic and the isopachic fringes depend on the properties of the two materials. Thus, the isochromatic and the isopachic fringes are divided into two branches, which present a jump of values at the interface. The size of the two branches mainly depends on the elastic modulus and the Poisson’s ratio of the two materials. From the combination of the isochromatic and the isopachic fringes, the principal stresses σ1 and σ2 can be estimated and the contour curves around the crack-tip can be plotted. For the FEA analysis, the program ANSYS 11.0 was used. The bi-material cracked plates were made from Lexan (BCBA) and Plexiglas (PMMA). 展开更多
关键词 crack bi-material PHOTOELASTICITY ISOCHROMATIC Isopachic FEA
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Interface microstructure evolution and bonding strength of TC11/c-TiA l bi-materials fabricated by laser powder deposition 被引量:4
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作者 Zhi-Jun Xu Yong-Zhong Zhang +1 位作者 Ming-Kun Liu Xin-Yong Gong 《Rare Metals》 SCIE EI CAS CSCD 2016年第6期456-462,共7页
Laser powder deposition was applied to fabricate the Ti-6.5Al-3.5Mo-1.5Zr-0.3Si (wt%)/Ti-47Al- 2Cr-2Nb-0.2W-0.15B (at%) bi-material system. The asdeposited TC11 alloy shows a basket-wave-like morphology while the ... Laser powder deposition was applied to fabricate the Ti-6.5Al-3.5Mo-1.5Zr-0.3Si (wt%)/Ti-47Al- 2Cr-2Nb-0.2W-0.15B (at%) bi-material system. The asdeposited TC11 alloy shows a basket-wave-like morphology while the as-deposited y-TiAl alloy consists of fully α2/γ lamellar microstructures. Regarding the thermal mismatch between TC11 and γ-TiAl during processing, the interface microstmcture evolution was concerned. The transformation pathway was illustrated. It is found that the content changes of Al elements and β-stabilizers Mo, Cr, and Nb are responsible for the evolution of microstructures at the interface. The fracture surfaces are located at the y-TiAl side. The bi-material shows a brittle-fracture manner, with the ultimate tensile strength of 560 MPa. 展开更多
关键词 Laser powder deposition TC11 titanium alloy γ-TiAl alloy bi-material interface
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Dynamic anti-plane analysis for two symmetrically interfacial cracks near circular cavity in piezoelectric bi-materials 被引量:5
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作者 A.HASSAN 宋天舒 《Applied Mathematics and Mechanics(English Edition)》 SCIE EI 2014年第10期1261-1270,共10页
The present paper is exposed theoretically to the influence on the dynamic stress intensity factor (DSIF) in the piezoelectric bi-materials model with two symmet- rically permeable interracial cracks near the edges ... The present paper is exposed theoretically to the influence on the dynamic stress intensity factor (DSIF) in the piezoelectric bi-materials model with two symmet- rically permeable interracial cracks near the edges of a circular cavity, subjected to the dynamic incident anti-plane shearing wave (SH-wave). An available theoretical method to dynamic analysis in the related research field is provided. The formulations are based on Green's function method. The DSIFs at the inner and outer tips of the left crack are obtained by solving the boundary value problems with the conjunction and crack- simulation technique. The numerical results are obtained by the FORTRAN language program and plotted to show the influence of the variations of the physical parameters, the structural geometry, and the wave frequencies of incident wave on the dimensionless DSIFs. Comparisons with previous work and between the inner and outer tips are con- cluded. 展开更多
关键词 symmetrically interfacial crack piezoelectric bi-material Green's function dynamic stress intensity factor (DSIF) dynamic anti-plane shearing wave (SH-wave)
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INTERFACIAL CRACK ANALYSIS IN THREE-DIMENSIONAL TRANSVERSELY ISOTROPIC BI-MATERIALS BY BOUNDARY INTEGRAL EQUATION METHOD
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作者 赵明皞 李冬霞 沈亚鹏 《Applied Mathematics and Mechanics(English Edition)》 SCIE EI 2005年第12期1539-1546,共8页
The integral-differential equations for three-dimensional planar interfacial cracks of arbitrary shape in transversely isotropic bimaterials were derived by virtue of the Somigliana identity and the fundamental soluti... The integral-differential equations for three-dimensional planar interfacial cracks of arbitrary shape in transversely isotropic bimaterials were derived by virtue of the Somigliana identity and the fundamental solutions, in which the displacement discontinuities across the crack faces are the unknowns to be determined. The interface is parallel to both the planes of isotropy. The singular behaviors of displacement and stress near the crack border were analyzed and the stress singularity indexes were obtained by integral equation method. The stress intensity factors were expressed in terms of the displacement discontinuities. In the non-oscillatory case, the hyper-singular boundary integral-differential equations were reduced to hyper-singular boundary integral equations similar to those of homogeneously isotropic materials. 展开更多
关键词 three-dimensional bi-material transversely isotropic interfacial crack stress intensity factor integral-differential equation
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The asymptotic field of mode Ⅰ quasi-static crack growth on the interface between a rigid and a pressure-sensitive material
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作者 麻文军 唐立强 《Journal of Marine Science and Application》 2009年第3期252-257,共6页
A mechanical model of the quasi-static interface of a mode I crack between a rigid and a pressure-sensitive viscoelastic material was established to investigate the mechanical characteristic of ship-building engineeri... A mechanical model of the quasi-static interface of a mode I crack between a rigid and a pressure-sensitive viscoelastic material was established to investigate the mechanical characteristic of ship-building engineering hi-materials. In the stable growth stage, stress and strain have the same singularity, ie (σ, ε) ∝ r^-1/(n-1). The variable-separable asymptotic solutions of stress and strain at the crack tip were obtained by adopting Airy's stress function and the numerical results of stress and strain in the crack-tip field were obtained by the shooting method. The results showed that the near-tip fields are mainly governed by the power-hardening exponent n and the Poisson ratio v of the pressure-sensitive material. The fracture criterion of mode I quasi-static crack growth in pressure-sensitive materials, according to the asymptotic analyses of the crack-tip field, can be viewed from the perspective of strain. 展开更多
关键词 pressure-sensitive material mode I quasi-static interface crack crack-tip field asymptotic analysis
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SCATTERING OF SH-WAVES BY AN INTERACTING INTERFACE LINEAR CRACK AND A CIRCULAR CAVITY NEAR BIMATERIAL INTERFACE 被引量:8
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作者 刘殿魁 林宏 《Acta Mechanica Sinica》 SCIE EI CAS CSCD 2004年第3期317-326,共10页
An analytical method is developed for scattering of SH-waves and dynamic stressconcentration by an interacting interface crack and a circular cavity near bimaterial interface.Asuitable Green’s function is contructed,... An analytical method is developed for scattering of SH-waves and dynamic stressconcentration by an interacting interface crack and a circular cavity near bimaterial interface.Asuitable Green’s function is contructed,which is the fundamental solution of the displacement fieldfor an elastic half space with a circular cavity impacted by an out-plane harmonic line source loadingat the horizontal surface.First,the bimaterial media is divided into two parts along the horizontalinterface,one is an elastic half space with a circular cavity and the other is a complete half space.Then the problem is solved according to the procedure of combination and by the Green’s functionmethod.The horizontal surfaces of the two half spaces are loaded with undetermined anti-plane forcesin order to satisfy continuity conditions at the linking section,or with some forces to recover cracks bymeans of crack-division technique.A series of Fredholm integral equations of first kind for determiningthe unknown forces can be set up through continuity conditions as expressed in terms of the Green’sfunction.Moreover,some expressions are given in this paper,such as dynamic stress intensity factor(DSIF)at the tip of the interface crack and dynamic stress concentration factor(DSCF)around thecircular cavity edge.Numerical examples are provided to show the influences of the wave numbers,the geometrical location of the interface crack and the circular cavity,and parameter combinations ofdifferent media upon DSIF and DSCF. 展开更多
关键词 bimaterial media SH-wave interface crack circular cavity
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Exact solution of plane isolated crack normal to a bimaterial interface of infinite extent 被引量:4
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作者 Tianhu Hao 《Acta Mechanica Sinica》 SCIE EI CAS CSCD 2006年第5期455-468,共14页
This paper presents an exact solution for the transverse interface crack in the plane strain case. The crack is perpendicular to the interface and in one material. The exact complex stress functions are first obtained... This paper presents an exact solution for the transverse interface crack in the plane strain case. The crack is perpendicular to the interface and in one material. The exact complex stress functions are first obtained with some unknown constants. The satisfactions of all boundary conditions are then checked, the condition at infinity is considered and the unknown constants are determined. Further study may focus on the case with different shear moduli and the influence of the large deformation. 展开更多
关键词 Exact solution interface crack Plane strain problem
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Influence of interface crack on dynamic characteristics of CRTSⅢslab ballastless track on bridge 被引量:11
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作者 YAN Bin CHENG Rui-qi +2 位作者 PANWen-bin XIE Hao-ran FU He-xin 《Journal of Central South University》 SCIE EI CAS CSCD 2022年第8期2665-2674,共10页
The damage of the self-compacting concrete in CRTSⅢslab ballastless track on bridge will lead to a partial void of the track slab,which will affect the comfort and safety of the train and the durability of the track ... The damage of the self-compacting concrete in CRTSⅢslab ballastless track on bridge will lead to a partial void of the track slab,which will affect the comfort and safety of the train and the durability of the track slab and bridge structure.In order to study the impact of the interface crack on the dynamic response of CRTSⅢballastless track system on bridge,based on the principle of multi-body dynamics theory and ANSYS+SIMPACK co-simulation,the spatial model of vehicle-track-bridge integration considering the longitudinal stiffness of supports,the track structure and interlayer contact characteristics were established.The dynamic characteristics of the system under different conditions of the width,length and position of the interface crack were analysed,and the limited values of the length and width of the cracks at the track slab edge were proposed.The results show that when the self-compacting concrete does not completely void along the transverse direction of the track slab,the crack has little effect on the dynamic characteristics of the vehicle-track-bridge system.However,when the self-compacting concrete is completely hollowed out along the transverse direction of the track slab,the dynamic amplitudes of the system increase.When the crack length is 1.6 m,the wheel load reduction rate reaches 0.769,which exceeds the limit value and threatens the safety of train operation.The vertical acceleration of the track slab increases by 250.1%,which affects the service life of the track system under the train speed of 200 km/h. 展开更多
关键词 high-speed railway railroad bridge ballastless track interface crack dynamic characteristics finite element
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Investigation on behavior of crack penetration/deflection at interfaces in intelligent coating system 被引量:3
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作者 Yang SUN Wenjuan WANG +1 位作者 Binbin LI Mabao LIU 《Applied Mathematics and Mechanics(English Edition)》 SCIE EI CSCD 2015年第4期465-474,共10页
Based on the three-phase model, the propagation behavior of a matrix crack in an intelligent coating system is investigated by an energy criterion. The effect of the elastic mismatch parameters and the thickness of th... Based on the three-phase model, the propagation behavior of a matrix crack in an intelligent coating system is investigated by an energy criterion. The effect of the elastic mismatch parameters and the thickness of the interface layer on the ratio of the energy release rate for infinitesimal deflected and penetrated crack is evaluated with the finite element method. The results show that the ratio of the energy release rates strongly depends on the elastic mismatch al between the substrate and the driving layer. It also strongly depends on the elastic mismatch a2 between the driving layer and the sensing layer for a thinner driving layer when a primary crack reaches an interface between the substrate and the driving layer. Moreover, with the increase in the thickness of the driving layer, the dependence on a2 gradually decreases. The experimental observation on aluminum alloys monitored with intelligent coating shows that the established model can better explain the behavior of matrix crack penetration and can be used in optimization design of intelligent coating. 展开更多
关键词 intelligent coating energy criterion interface crack deflection crackpenetration finite element method
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Stress field near interface crack tip of double dissimilar orthotropic composite materials 被引量:2
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作者 李俊林 张少琴 杨维阳 《Applied Mathematics and Mechanics(English Edition)》 SCIE EI 2008年第8期1045-1051,共7页
In this paper, double dissimilar orthotropic composite materials interfacial crack is studied by constructing new stress functions and employing the method of composite material complex. When the characteristic equati... In this paper, double dissimilar orthotropic composite materials interfacial crack is studied by constructing new stress functions and employing the method of composite material complex. When the characteristic equations' discriminants △1 〉 0 and △2 〉0, the theoretical formula of the stress field and the displacement field near the mode I interface crack tip are derived, indicating that there is no oscillation and interembedding between the interfaces of the crack. 展开更多
关键词 ORTHOTROPIC interface crack crack tip stress field
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Analysis of a permeable interface crack in elastic dielectric/piezoelectric bimaterials 被引量:2
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作者 Qun Li Yiheng Chen 《Acta Mechanica Sinica》 SCIE EI CAS CSCD 2007年第6期681-687,共7页
A permeable interface crack between elastic dielectric material and piezoelectric material is studied based on the extended Stroh's formalism. Motivated by strong engineering demands to design new composite materials... A permeable interface crack between elastic dielectric material and piezoelectric material is studied based on the extended Stroh's formalism. Motivated by strong engineering demands to design new composite materials, the authors perform numerical analysis of interface crack tip singularities and the crack tip energy release rates for 35 types of dissimilar bimaterials, respectively, which are constructed by five kinds of elastic dielectric materials: Epoxy, Polymer, Al2O3, SiC, and Si3N4 and seven kinds of practical piezoelectric ceramics: PZT-4, BaTiO3, PZT-5H, PZT-6B, PZT-TA, P-7, and PZT-PIC 151, respectively. The elastic dielectric material with much smaller permittivity than commercial piezoelectric ceramics is treated as a special transversely isotropic piezoelectric material with extremely small piezoelectricity. The present investigation shows that the structure of the singular field near the permeable interface crack tip consists of three singularities: r^-1/2±iε and r^-1/2, which is quite different from that in the impermeable interface crack. It can be concluded that different far field loading cases have significant influence on the near-tip fracture behaviors of the permeable interface crack. Based on the present theoretical treatment and numerical analysis, the electric field induced crack growth is well explained, which provides a better understanding of the failure mechanism induced from interface crack growth in elastic dielectric/piezoelectric bimaterials. 展开更多
关键词 Elastic dielectric PIEZOELECTRIC PERMEABLE interface crack SINGULARITY Energy release rate
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ON THE PLANE PIEZOELECTRIC PROBLEM OF A LOADED CRACK TERMINATING AT A MATERIAL INTERFACE 被引量:2
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作者 Qin Qinghua Yu Shouwen, Dept. of Eng. Mechanics, Tsinghua University, Beijing 100084 《Acta Mechanica Solida Sinica》 SCIE EI 1996年第2期151-158,共8页
The plane problem of a crack terminating at the interface of a bimaterial piezoelectric, and loaded on its faces, is treated. The emphasis is placed on how to transform this problem into a non-homogeneous Hilbert prob... The plane problem of a crack terminating at the interface of a bimaterial piezoelectric, and loaded on its faces, is treated. The emphasis is placed on how to transform this problem into a non-homogeneous Hilbert problem. To make the derivation tractable, the concept of the axial conjugate is introduced and related to the complex conjugate. The angle between the crack line and the interface may be arbitrary. Numerical results are given to illustrate the stress singularity at crack tip. 展开更多
关键词 PIEZOELECTRICITY crack axial conjugate interface singular integral equation
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Effects of electric/magnetic impact on the transient fracture of interface crack in piezoelectric-piezomagnetic sandwich structure: anti-plane case 被引量:3
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作者 Xing ZHAO Zhenghua QIAN +1 位作者 Jinxi LIU Cunfa GAO 《Applied Mathematics and Mechanics(English Edition)》 SCIE EI CSCD 2020年第1期139-156,共18页
Due to the incompatibility of the interlaminar deformations,the interface debonding or cracking usually happens in a layered magnetoelectric(ME)structure under an applied load.In this paper,the transient responses of ... Due to the incompatibility of the interlaminar deformations,the interface debonding or cracking usually happens in a layered magnetoelectric(ME)structure under an applied load.In this paper,the transient responses of the anti-plane interface cracks in piezoelectric(PE)-piezomagnetic(PM)sandwich structures are studied by the standard methods of the integral transform and singular integral equation.Discussion on the numerical examples indicates that the PE-PM-PE structure under electric impact is more likely to fracture than the PM-PE-PM structure under a magnetic impact.The dynamic stress intensity factors(DSIFs)are more sensitive to the variation of the active layer thickness.The effects of the material constants on the DSIFs are dependent on the roles played by PE and PM media during the deformation process. 展开更多
关键词 piezoelectric(PE)-piezomagnetic(PM) sandwich structure interface crack transient response dynamic stress intensity factor(DSIF)
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ELASTIC SH WAVE PROPAGATION IN PERIODIC LAYERED COMPOSITES WITH A PERIODIC ARRAY OF INTERFACE CRACKS 被引量:2
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作者 Zhizhong Yan Chunqiu Wei Chuanzeng Zhang 《Acta Mechanica Solida Sinica》 SCIE EI CSCD 2015年第5期453-463,共11页
The interaction of anti-plane elastic SH waves with a periodic array of interface cracks in a multi-layered periodic medium is analyzed in this paper. A perfect periodic structure without interface cracks is first stu... The interaction of anti-plane elastic SH waves with a periodic array of interface cracks in a multi-layered periodic medium is analyzed in this paper. A perfect periodic structure without interface cracks is first studied and the transmission displacement coefficient is obtained based on the transfer matrix method in conjunction with the Bloch-Floquet theorem. This is then generalized to a single and periodic distribution of cracks at the center interface and the result is compared with that of perfect periodic cases without interface cracks. The dependence of the transmission displacement coefficient on the frequency of the incident wave, the influences of material combination, crack configuration and incident angle are discussed in detail. Compared with the corresponding perfect periodic structure without interface cracks, a new phenomenon is found in the periodic layered system with a single and periodic array of interface cracks. 展开更多
关键词 layered composite transmission coefficient interface crack transfer matrix method
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Acoustic emission assessment of interface cracking in thermal barrier coatings 被引量:7
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作者 Li Yang Zhi-Chun Zhong +4 位作者 Yi-Chun Zhou Wang Zhu Zhi-Biao Zhang Can-Ying Cai Chun-Sheng Lu 《Acta Mechanica Sinica》 SCIE EI CAS CSCD 2016年第2期342-348,共7页
In this paper,acoustic emission(AE) and digital image correlation methods were applied to monitor interface cracking in thermal barrier coatings under compression.The interface failure process can be identifie via i... In this paper,acoustic emission(AE) and digital image correlation methods were applied to monitor interface cracking in thermal barrier coatings under compression.The interface failure process can be identifie via its AE features,including buckling,delamination incubation and spallation.According to the Fourier transformation of AE signals,there arefourdifferentfailuremodes:surfaceverticalcracks,opening and sliding interface cracks,and substrate deformation.The characteristic frequency of AE signals from surface vertical cracks is 0.21 MHz,whilst that of the two types of interface cracks are 0.43 and 0.29 MHz,respectively.The energy released of the two types of interface cracks are 0.43 and 0.29 MHz,respectively.Based on the energy released from cracking and the AE signals,a relationship is established between the interface crack length and AE parameters,which is in good agreement with experimental results. 展开更多
关键词 Thermal barrier coatings Acoustic emission interface cracking crack type Quantitative analysis
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A Nano-Cantilever Method for Crack Initiation at the Free Edge of the Cu/Si Interface in Nanoscale Components 被引量:1
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作者 Xiaoyuan Wang Yabin Yan +2 位作者 Qiang Wan Takashi Sumigawa Takayuki Kitamura 《Acta Mechanica Solida Sinica》 SCIE EI CSCD 2016年第4期416-428,共13页
Straight and Bent nano-cantilever specimens are respectively proposed to investigate the single-mode and mixed-mode crack initiation at the Cu/Si interface edge in nanoscale components. With a minute loading apparatus... Straight and Bent nano-cantilever specimens are respectively proposed to investigate the single-mode and mixed-mode crack initiation at the Cu/Si interface edge in nanoscale components. With a minute loading apparatus, all nanoscale samples are in situ loaded and observed. Numerical analysis is employed to acquire the critical interfacial stress distributions during crack initiation. The stress concentration regions near the edge of Cu/Si interface in all specimens are within the scale of 100 nm, and the critical normal and shear stresses have a circular relation in nanoscale components, which represents the fracture criterion of the interface in nanoscale components. 展开更多
关键词 NANOSCALE CANTILEVER interface crack initiation mixed mode thin film
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