An ultrasonic test of spot welding for stainless steel is conducted. Based on wavelet packet decomposition, the ultrasonic echo signal has been analyzed deeply in time - frequency domain, which can easily distinguish ...An ultrasonic test of spot welding for stainless steel is conducted. Based on wavelet packet decomposition, the ultrasonic echo signal has been analyzed deeply in time - frequency domain, which can easily distinguish the nugget from the corona bond. The 2D C-scan images produced by ultrasonic C scan which contribute to quantitatively calculate the nugget diameter for the computer are further analyzed. The spot welding nugget diameter can be automatically obtained by image enhancement, edge detection and equivalent diameter algorithm procedure. The ultrasonic detection values in this paper show good agreement with the metallographic measured values. The mean value of normal distribution curve is 0.006 67, and the standard deviation is 0.087 11. Ultrasonic C-scan test based on wavelet packet signal analysis is of high accuracy and stability.展开更多
In spacecraft electronic devices,the deformation of solder balls within ball grid array(BGA)packages poses a significant risk of system failure.Therefore,accurately measuring the mechanical behavior of solder balls is...In spacecraft electronic devices,the deformation of solder balls within ball grid array(BGA)packages poses a significant risk of system failure.Therefore,accurately measuring the mechanical behavior of solder balls is crucial for ensuring the safety and reliability of spacecraft.Although finite element simulations have been extensively used to study solder ball deformation,there is a significant lack of experimental validation,particularly under thermal cycling conditions.This is due to the challenges in accurately measuring the internal deformations of solder balls and eliminating the rigid body displacement introduced during ex-situ thermal cycling tests.In this work,an ex-situ three-dimensional deformation measurement method using X-ray computed tomography(CT)and digital volume correlation(DVC)is proposed to overcome these obstacles.By incorporating the layer-wise reliability-guided displacement tracking(LW-RGDT)DVC with a singular value decomposition(SVD)method,this method enables accurate assessment of solder ball mechanical behavior in BGA packages without the influence of rigid body displacement.Experimental results reveal that BGA structures exhibit progressive convex deformation with increased thermal cycling,particularly in peripheral solder balls.This method provides a reliable and effective tool for assessing internal deformations in electronic packages under ex-situ conditions,which is crucial for their design optimization and lifespan predictions.展开更多
The packaging poses a critical challenge for commercialization of MEMS products. Major problems with the packaging process include degraded reliability caused by the excess stress due to thermal mismatch and altered p...The packaging poses a critical challenge for commercialization of MEMS products. Major problems with the packaging process include degraded reliability caused by the excess stress due to thermal mismatch and altered performance of the MEMS device after packaging caused by thermal exposure. The localized laser bonding technique for ceramic MEMS packaging to address above-mentioned challenges was investigated. A continuous wave CO2 laser was used to locally heat sealing material for ceramic MEMS package lid to substrate bonding. To determine the laser power density and scanning speed, finite element analysis thermal models were constructed to simulate the localized laser bonding process. Further, the effect of external pressure at sealing ring on the bonding formation was studied. Pull testing results show that the scanning speed and external pressure have significant influence on the pull strength at the bonding interface. Cross-sectional microscopy of the bonding interface indicates that the packages bonded with relatively low scanning speed and external pressure conditions have higher bonding quality. This research demonstrates the potential of localized laser bonding process for ceramic MEMS packaging.展开更多
The Shapiro-Wilk test (SWT) for normality is well known for its competitive power against numerous one-dimensional alternatives. Several extensions of the SWT to multi-dimensions have also been proposed. This paper in...The Shapiro-Wilk test (SWT) for normality is well known for its competitive power against numerous one-dimensional alternatives. Several extensions of the SWT to multi-dimensions have also been proposed. This paper investigates the relative strength and rotational robustness of some SWT-based normality tests. In particular, the Royston’s H-test and the SWT-based test proposed by Villase?or-Alva and González-Estrada have R packages available for testing multivariate normality;thus they are user friendly but lack of rotational robustness compared to the test proposed by Fattorini. Numerical power comparison is provided for illustration along with some practical guidelines on the choice of these SWT-type tests in practice.展开更多
The importance of meat preservation and various reports on different types of packaging, and to compare the effects of modified atmosphere packaging （MAP） and vacuum packaging （VP） on shelf life of flesh bull meat...The importance of meat preservation and various reports on different types of packaging, and to compare the effects of modified atmosphere packaging （MAP） and vacuum packaging （VP） on shelf life of flesh bull meat, and microbiological tests on meat together with some chemical and sensory tests was on tight observation. It was an experimental study, 96 samples were randomly packaged in two groups of MAP and VP equally. The package consists of five layers which are Polyvinylidin Chloride （PVDC）, Ethyl Vinyl Alcohol （EVOH）, Poly Ethylene （PE）, Linear Low Density Poly Ethylene （LLDPE）, and poly Amid （PA）, respectively. MAP meat with 700 mL of CO2 per kg of meat. The packaging were made in at-ameh-pars factory and transported in chilled condition to a well prepared refrigerator in National Research Institute of Food Science （NRIFS） of Shahidbeheshti University of Medical Sciences. These samples tested weekly, since first day after packaging, and week 2, 3, 4, 5, 6, 7, and 8. Microbial tests include Total Microbial, Coliform, Lactic Acid Bacteria, Pseudomonas Counts, and Clostridium. Chemical and sensory tests also carried out. Total volatile bases （TVN）, TBA, and pH as chemical analyses and color, odor, and weep as sensory analyses are also added. Results revealed that total microbial count was in standard range within the 6 weeks for VP, and 5 weeks for MAP technique. Other microbial factors including coliforms, lactic acid bacteria are less and somehow in chemical and sensory tests emphasized the microbial figures. recommended for meat packaging. similar pattern to total count, and no clostridia were found. By the way, The results showed that according to our existing facilities, VP is展开更多
A new type application specific light emitting diode （LED） package （ASLP） with freeform polycarbonate lens for street lighting is developed, whose manufacturing processes are compatible with a typical LED packagin...A new type application specific light emitting diode （LED） package （ASLP） with freeform polycarbonate lens for street lighting is developed, whose manufacturing processes are compatible with a typical LED packaging process. The reliability test methods and failure criterions from different vendors are reviewed and compared. It is found that test methods and failure criterions are quite different. The rapid reliability assessment standards are urgently needed for the LED industry. 85℃/85 RH with 700 mA is used to test our LED modules with three other vendors for 1000 h, showing no visible degradation in optical performance for our modules, with two other vendors showing significant degradation. Some failure analysis methods such as C-SAM, Nano X-ray CT and optical microscope are used for LED packages. Some failure mechanisms such as delaminations and cracks are detected in the LED packages after the accelerated reliability testing. The finite element simulation method is helpful for the failure analysis and design of the reliability of the LED packaging. One example is used to show one currently used module in industry is vulnerable and may not easily pass the harsh thermal cycle testing.展开更多
基金Funded by Key Laboratory of Automobile Materials of Ministry of Education and Department of Materials Science & Engineering,Jilin University
文摘An ultrasonic test of spot welding for stainless steel is conducted. Based on wavelet packet decomposition, the ultrasonic echo signal has been analyzed deeply in time - frequency domain, which can easily distinguish the nugget from the corona bond. The 2D C-scan images produced by ultrasonic C scan which contribute to quantitatively calculate the nugget diameter for the computer are further analyzed. The spot welding nugget diameter can be automatically obtained by image enhancement, edge detection and equivalent diameter algorithm procedure. The ultrasonic detection values in this paper show good agreement with the metallographic measured values. The mean value of normal distribution curve is 0.006 67, and the standard deviation is 0.087 11. Ultrasonic C-scan test based on wavelet packet signal analysis is of high accuracy and stability.
文摘In spacecraft electronic devices,the deformation of solder balls within ball grid array(BGA)packages poses a significant risk of system failure.Therefore,accurately measuring the mechanical behavior of solder balls is crucial for ensuring the safety and reliability of spacecraft.Although finite element simulations have been extensively used to study solder ball deformation,there is a significant lack of experimental validation,particularly under thermal cycling conditions.This is due to the challenges in accurately measuring the internal deformations of solder balls and eliminating the rigid body displacement introduced during ex-situ thermal cycling tests.In this work,an ex-situ three-dimensional deformation measurement method using X-ray computed tomography(CT)and digital volume correlation(DVC)is proposed to overcome these obstacles.By incorporating the layer-wise reliability-guided displacement tracking(LW-RGDT)DVC with a singular value decomposition(SVD)method,this method enables accurate assessment of solder ball mechanical behavior in BGA packages without the influence of rigid body displacement.Experimental results reveal that BGA structures exhibit progressive convex deformation with increased thermal cycling,particularly in peripheral solder balls.This method provides a reliable and effective tool for assessing internal deformations in electronic packages under ex-situ conditions,which is crucial for their design optimization and lifespan predictions.
文摘The packaging poses a critical challenge for commercialization of MEMS products. Major problems with the packaging process include degraded reliability caused by the excess stress due to thermal mismatch and altered performance of the MEMS device after packaging caused by thermal exposure. The localized laser bonding technique for ceramic MEMS packaging to address above-mentioned challenges was investigated. A continuous wave CO2 laser was used to locally heat sealing material for ceramic MEMS package lid to substrate bonding. To determine the laser power density and scanning speed, finite element analysis thermal models were constructed to simulate the localized laser bonding process. Further, the effect of external pressure at sealing ring on the bonding formation was studied. Pull testing results show that the scanning speed and external pressure have significant influence on the pull strength at the bonding interface. Cross-sectional microscopy of the bonding interface indicates that the packages bonded with relatively low scanning speed and external pressure conditions have higher bonding quality. This research demonstrates the potential of localized laser bonding process for ceramic MEMS packaging.
文摘The Shapiro-Wilk test (SWT) for normality is well known for its competitive power against numerous one-dimensional alternatives. Several extensions of the SWT to multi-dimensions have also been proposed. This paper investigates the relative strength and rotational robustness of some SWT-based normality tests. In particular, the Royston’s H-test and the SWT-based test proposed by Villase?or-Alva and González-Estrada have R packages available for testing multivariate normality;thus they are user friendly but lack of rotational robustness compared to the test proposed by Fattorini. Numerical power comparison is provided for illustration along with some practical guidelines on the choice of these SWT-type tests in practice.
文摘The importance of meat preservation and various reports on different types of packaging, and to compare the effects of modified atmosphere packaging （MAP） and vacuum packaging （VP） on shelf life of flesh bull meat, and microbiological tests on meat together with some chemical and sensory tests was on tight observation. It was an experimental study, 96 samples were randomly packaged in two groups of MAP and VP equally. The package consists of five layers which are Polyvinylidin Chloride （PVDC）, Ethyl Vinyl Alcohol （EVOH）, Poly Ethylene （PE）, Linear Low Density Poly Ethylene （LLDPE）, and poly Amid （PA）, respectively. MAP meat with 700 mL of CO2 per kg of meat. The packaging were made in at-ameh-pars factory and transported in chilled condition to a well prepared refrigerator in National Research Institute of Food Science （NRIFS） of Shahidbeheshti University of Medical Sciences. These samples tested weekly, since first day after packaging, and week 2, 3, 4, 5, 6, 7, and 8. Microbial tests include Total Microbial, Coliform, Lactic Acid Bacteria, Pseudomonas Counts, and Clostridium. Chemical and sensory tests also carried out. Total volatile bases （TVN）, TBA, and pH as chemical analyses and color, odor, and weep as sensory analyses are also added. Results revealed that total microbial count was in standard range within the 6 weeks for VP, and 5 weeks for MAP technique. Other microbial factors including coliforms, lactic acid bacteria are less and somehow in chemical and sensory tests emphasized the microbial figures. recommended for meat packaging. similar pattern to total count, and no clostridia were found. By the way, The results showed that according to our existing facilities, VP is
基金Project supported by the National Natural Science Foundation of China(Nos.50876038,50835005)the National High Technology Research and Development Program of China(No.2009AA03A1A3)
文摘A new type application specific light emitting diode （LED） package （ASLP） with freeform polycarbonate lens for street lighting is developed, whose manufacturing processes are compatible with a typical LED packaging process. The reliability test methods and failure criterions from different vendors are reviewed and compared. It is found that test methods and failure criterions are quite different. The rapid reliability assessment standards are urgently needed for the LED industry. 85℃/85 RH with 700 mA is used to test our LED modules with three other vendors for 1000 h, showing no visible degradation in optical performance for our modules, with two other vendors showing significant degradation. Some failure analysis methods such as C-SAM, Nano X-ray CT and optical microscope are used for LED packages. Some failure mechanisms such as delaminations and cracks are detected in the LED packages after the accelerated reliability testing. The finite element simulation method is helpful for the failure analysis and design of the reliability of the LED packaging. One example is used to show one currently used module in industry is vulnerable and may not easily pass the harsh thermal cycle testing.
