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Recycled micron-sized silicon anode for fast and highly stable lithium-ion storage via interface design engineering
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作者 Dandan Luo Yongjun Lu +3 位作者 Guanjia Zhu Jihao Li Xiuyan Liu Haijiao Zhang 《Journal of Energy Chemistry》 2025年第8期63-73,共11页
Micron-sized silicon anodes offer significant industrial advantages over nanoscale counterparts due to their cost-effectiveness and scalability.However,their practical applications are significantly hindered by severe... Micron-sized silicon anodes offer significant industrial advantages over nanoscale counterparts due to their cost-effectiveness and scalability.However,their practical applications are significantly hindered by severe stress-induced fragmentation,leading to rapid capacity decay.Addressing this challenge,we introduce a novel dual-conformal encapsulated micron-sized porous Si(μm-pSi)anode by utilizingμm-Si recycled from the photovoltaic industry as the Si precursor.This encapsulation design of the internal conformal SiO_(x)/C layer and external Ti_(3)C_(2)Tx MXene layer forms intergranular and intragranular protective skins onμm-pSi,ensuring simultaneous mechanical and electrochemical stability for efficient Li+storage.As a result,the fabricated WpSi@SiO_(x)/C@MXene anode demonstrates an exceptional cycling performance,delivering 535.1 mA h g^(−1)after 1500 cycles at 5 A g^(−1)with a minimal capacity decay of 0.003%per cycle.Chemo-mechanical modeling and SEI analysis reveal that the dual-conformal coating achieves exceptional mechanical and electrochemical stability through robust mechanical confinement and ultra-fast Li+diffusion kinetics during lithiation,coupled with a Li_(2)CO_(3)/LiF-rich hybrid SEI that facilitates Li+transport,collectively enabling rate-insensitive stress evolution,long-term structural durability,and stable cycling under high-rate conditions.This work provides a compelling design strategy for leveraging sustainableμm-Si to achieve high-rate and long-life lithium-ion batteries. 展开更多
关键词 Micron-sized si Dual-conformal coating interface engineering ANODE Lithium-ion batteries
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Cu/AlN/Cu功能梯度电极材料的制备及其应用
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作者 孙静 罗洁 +1 位作者 吕薪羽 张宗仁 《中国陶瓷》 北大核心 2025年第8期31-37,共7页
采用放电等离子烧结(SPS)技术制备了Cu/AlN/Cu功能梯度电极材料,并成功实现了与CoSb_(3)热电材料的高效连接。通过扫描电镜(SEM)和能谱分析(EDS),在Cu/AlN/Cu与CoSb_(3)的界面处检测到Cu_(3)Sb、Cu_(3.3)Sb、(Ag,In)、Cu、CuIn及Cu2In... 采用放电等离子烧结(SPS)技术制备了Cu/AlN/Cu功能梯度电极材料,并成功实现了与CoSb_(3)热电材料的高效连接。通过扫描电镜(SEM)和能谱分析(EDS),在Cu/AlN/Cu与CoSb_(3)的界面处检测到Cu_(3)Sb、Cu_(3.3)Sb、(Ag,In)、Cu、CuIn及Cu2In等多种物相,这些相的分布与局部元素分布高度吻合。研究表明,焊接温度显著影响过渡层的结构和均匀性,较低的焊接温度(500℃)有利于形成均匀稳定的过渡层,减少孔洞生成,提升界面连接质量。此外,Cu、Ag、In、Ti等元素在界面区域展现出复杂的扩散行为,尤其是Ti元素的偏析,显著增强了界面的润湿性和结合强度。然而,不对称的扩散速率引发了Kirkendall效应,进一步影响了过渡层的微观结构。X射线衍射(XRD)结果显示,SPS连接后界面处相结构连续,缺乏明显的界面分界线。 展开更多
关键词 放电等离子烧结 功能梯度材料 Cu/aln/Cu CoSb_(3) 界面连接
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三(三甲基硅基)硼酸酯对Si-C/Li电池性能的影响
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作者 彭龙贵 刘心毅 +2 位作者 李梦鸽 刘安妮 谭一兵 《现代化工》 北大核心 2025年第9期161-166,172,共7页
采用三(三甲基硅基)硼酸酯(TMSB)作为电解液添加剂,研究对Si-C/Li电池电化学性能及负极界面性质的影响。结果表明,在基础电解液中添加质量分数为3%的TMSB,Si-C/Li电池在0.2 C的电流下充放电100次后,电池容量保持率提升24.7%。利用X射线... 采用三(三甲基硅基)硼酸酯(TMSB)作为电解液添加剂,研究对Si-C/Li电池电化学性能及负极界面性质的影响。结果表明,在基础电解液中添加质量分数为3%的TMSB,Si-C/Li电池在0.2 C的电流下充放电100次后,电池容量保持率提升24.7%。利用X射线光电子能谱(XPS)及扫描电子显微镜(SEM)对循环后的硅基负极进行界面表征,证实了TMSB添加剂有助于在硅基负极表面形成稳定的固体电解质界面层(SEI),抑制电解液分解,有效提升了硅基负极的界面稳定性。 展开更多
关键词 锂离子电池 硅基负极材料 电解液添加剂 固体电解质界面膜 三(三甲基硅基)硼酸酯
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Theoretical Studies on the Si(001)-SiO_2 Interface Structure 被引量:1
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作者 ZHOU Ming-Xiu YANG Chun +2 位作者 DENG Xiao-Yan YU Wei-Fei LI Jin-Shan 《Chinese Journal of Structural Chemistry》 SCIE CAS CSCD 北大核心 2006年第6期647-652,共6页
Novel models (2× 1) of Si(001)-SiO2 interface structure have been established. The method of the first-principle General Gradient Approximation (GGA) is employed to structurally optimize the established the... Novel models (2× 1) of Si(001)-SiO2 interface structure have been established. The method of the first-principle General Gradient Approximation (GGA) is employed to structurally optimize the established theoretical models under the K-point space of periodic boundary condition. The structures after optimization have been analyzed, and the results show that the interfaces present in disordered state and both Si-O-Si and Si=O structures exist. Meanwhile, the bonding of surface structure is analyzed via the graphics of electron localization function(ELF). 展开更多
关键词 si/siO2 DFT interface structure
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Preparation and interface modification of Si3N4f/SiO2 composites 被引量:1
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作者 Yubo Houa Xuejin Yang +3 位作者 Bin Li Duan Li Shitao Gao Zhongshuai Wu 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 2019年第12期2767-2771,共5页
In order to modify the interface, Si ON coating was introduced on the surface of silicon nitride fiber by perhydropolysilazane conversion method. Si-3N4f/SiO2 and Si-3N4f/Si ONc/SiO2 composites were prepared by sol-ge... In order to modify the interface, Si ON coating was introduced on the surface of silicon nitride fiber by perhydropolysilazane conversion method. Si-3N4f/SiO2 and Si-3N4f/Si ONc/SiO2 composites were prepared by sol-gel method to explore the influence of Si ON coating on the mechanical properties of composites.The results show that with the protection of Si ON coating, Si-3N4fiber enjoys a strength increase of up to 24.1% and Si-3N4f/Si ONc/SiO2 composites have a tensile strength of 170.5 MPa and a modulus of26.9 GPa, respectively. After 1000℃ annealing in air for 1 h, Si-3N4f/Si ONc/SiO2 composites retain 65.0%of their original strength and show a better toughness than Si-3N4f/SiO2 composites. The improvement of mechanical properties is attributing to the healing effect of Si ON coating as well as its intermediate coefficient of thermal expansion between Si-3N4fiber and SiO2 matrix. 展开更多
关键词 si3N4 fiber Perhydropolysilazane siON coating interface Mechanical properties
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Primary Mg_(2)Si phase and Mg_(2)Si/α-Mg interface modified by Sn and Sb elements in a Mg-5Sn-2Si-1.5Al-1Zn-0.8Sb alloy 被引量:1
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作者 Wenpeng Yang Ying Wang +2 位作者 Hongbao Cui Guangxin Fan Xuefeng Guo 《Journal of Magnesium and Alloys》 SCIE EI CAS CSCD 2022年第11期3234-3249,共16页
The microstructure of primary Mg_(2)Si and the interface of Mg_(2)Si/α-Mg modified by Sn and Sb elements in an as-cast Mg-5Sn-2Si-1.5Al-1Zn-0.8Sb(wt.%) alloy were investigated.In the primary Mg_(2)Si phase not only t... The microstructure of primary Mg_(2)Si and the interface of Mg_(2)Si/α-Mg modified by Sn and Sb elements in an as-cast Mg-5Sn-2Si-1.5Al-1Zn-0.8Sb(wt.%) alloy were investigated.In the primary Mg_(2)Si phase not only the Si atoms but also the Mg atoms could be substituted by Sn and Sb atoms,resulting in the slightly reduced lattice constant a of 0.627 nm.An OR of Mg_(2)Si phase and α-Mg in the form of[001]Mg_(2)Si‖[01■1]α,(220)Mg_(2)Si‖(0■12)αwas discovered.Between primary Mg_(2)Si phase and α-Mg matrix two transitional nano-particle layers were formed.In the rim region of primary Mg_(2)Si particle,Mg_(2)Sn precipitates sizing from 5 nm to 50 nm were observed.Adjacent to the boundary of primary Mg_(2)Si particle,luxuriant columnar crystals of primary Mg_(2)Sn phase with width of about 25 nm and length of about100 nm were distributed on the α-Mg matrix.The lattice constant of the Mg_(2)Sn precipitate in primary Mg_(2)Si particle was about 0.756 nm.Three ORs between Mg_(2)Sn and Mg_(2)Si were found,in which the Mg_(2)Sn precipitates had strong bonding interfaces with Mg_(2)Si phase.Three new minor ORs between Mg_(2)Sn phase and α-Mg were found.The lattice constant of primary Mg_(2)Sn phase was enlarged to 0.813 nm owing to the solution of Sn and Sb atoms.Primary Mg_(2)Sn had edge-to-edge interfaces with α-Mg.Therefore,the primary Mg_(2)Si particle and α-Mg were united and the interfacial adhesion was improved by the two nano-particles layers of Mg_(2)Sn phase. 展开更多
关键词 Mg_(2)si Mg_(2)Sn MODIFICATION interface HRTEM
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Forward and reverse electron transport properties across a CdS/Si multi-interface nanoheterojunction 被引量:2
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作者 李勇 王伶俐 +4 位作者 王小波 闫玲玲 苏丽霞 田永涛 李新建 《Chinese Physics B》 SCIE EI CAS CSCD 2014年第8期502-507,共6页
The electron transport behavior across the interface plays an important role in determining the performance of op- toelectronic devices based on heterojunctions. Here through growing CdS thin film on silicon nanoporou... The electron transport behavior across the interface plays an important role in determining the performance of op- toelectronic devices based on heterojunctions. Here through growing CdS thin film on silicon nanoporous pillar array, an untraditional, nonplanar, and multi-interface CdS/Si nanoheterojunction is prepared. The current density versus voltage curve is measured and an obvious rectification effect is observed. Based on the fitting results and model analyses on the forward and reverse conduction characteristics, the electron transport mechanism under low forward bias, high forward bias, and reverse bias are attributed to the Ohmic regime, space-charge-limited current regime, and modified Poole-Frenkel regime respectively. The forward and reverse electrical behaviors are found to be highly related to the distribution of inter- facial trap states and the existence of localized electric field respectively. These results might be helpful for optimizing the preparing procedures to realize high-performance silicon-based CdS optoelectronic devices. 展开更多
关键词 HETEROJUNCTION multi-interface nanoheterojunction electron transport silicon nanoporous pillararray si-NPA) CdS/si-NPA
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Microstructure evolution and interface structure of Al-40 wt% Si composites produced by high-energy ball milling 被引量:2
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作者 Yuanyuan Chen Zhangping Hu +5 位作者 Yifei Xu Jiangyong Wang Peter Schützendübe Yuan Huang Yongchang Liu Zumin Wang 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 2019年第4期512-519,共8页
High silicon content Al-Si composites with a composition of Al-40 wt% Si were fabricated via a highenergy ball milling method. The microstructure evolution of Al-40 wt% Si milled powders and sintered composites has be... High silicon content Al-Si composites with a composition of Al-40 wt% Si were fabricated via a highenergy ball milling method. The microstructure evolution of Al-40 wt% Si milled powders and sintered composites has been thoroughly studied by scanning electron microscopy, X-ray diffraction, energydispersive spectrometry and high-resolution transmission electron microscopy. The mechanism of ball milling Al-40 wt% Si powders has been disclosed in detail: fracture mechanism dominating in the early stages, followed by the agglomeration mechanism, finally reaching the balance between the fragments and the agglomerates. It has been found that the average particle sizes of mixed Al-Si powders can be refined to the nanoscale, and the crystallite sizes of Al and Si have been reduced to 10nm and 62nm upon milling for 2h–50h, respectively. The finally formed Al-Si interfaces after ball milling for 50h are wellcohesive. A dense and homogenous Al-40 wt% Si composite have been achieved by solid-state sintering at550?C. The results thus provide an effective support for producing bulk nanostructured Al-Si composites. 展开更多
关键词 AL-si COMPOsiTES interface structure HIGH-ENERGY ball MILLING NANOCRYSTALLINE powders
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A LiF-Pie-Structured Interphase for Silicon Anodes 被引量:1
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作者 Weiping Li Shiwei Xu +7 位作者 Cong Zhong Qiu Fang Suting Weng Yinzi Ma Bo Wang Yejing Li Zhaoxiang Wang Xuefeng Wang 《Nano-Micro Letters》 2025年第12期566-577,共12页
Silicon(Si)is a promising anode material for rechargeable batteries due to its high theoretical capacity and abundance,but its practical application is hindered by the continuous growth of porous solid-electrolyte int... Silicon(Si)is a promising anode material for rechargeable batteries due to its high theoretical capacity and abundance,but its practical application is hindered by the continuous growth of porous solid-electrolyte interphase(SEI),leading to capacity fade.Herein,a LiF-Pie structured SEI is proposed,with LiF nanodomains encapsulated in the inner layer of the organic cross-linking silane matrix.A series of advanced techniques such as cryogenic electron microscopy,time-of-flight secondary ion mass spectrometry,and matrix-assisted laser desorption/ionization time-of-flight mass spectrometry have provided detailed insights into the formation mechanism,nanostructure,and chemical composition of the interface.With such SEI,the capacity retention of LiCoO_(2)||Si is significantly improved from 49.6%to 88.9%after 300 cycles at 100 mA g^(-1).These findings provide a desirable interfacial design principle with enhanced(electro)chemical and mechanical stability,which are crucial for sustaining Si anode functionality,thereby significantly advancing the reliability and practical application of Si-based anodes. 展开更多
关键词 si anodes Solid electrolyte interface Electrolyte additive
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First-principles calculations of the hole-induced depassivation of SiO2/Si interface defects
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作者 Zhuo-Cheng Hong Pei Yao +1 位作者 Yang Liu Xu Zuo 《Chinese Physics B》 SCIE EI CAS CSCD 2022年第5期575-581,共7页
The holes induced by ionizing radiation or carrier injection can depassivate saturated interface defects.The depassivation of these defects suggests that the deep levels associated with the defects are reactivated,aff... The holes induced by ionizing radiation or carrier injection can depassivate saturated interface defects.The depassivation of these defects suggests that the deep levels associated with the defects are reactivated,affecting the performance of devices.This work simulates the depassivation reactions between holes and passivated amorphous-SiO_(2)/Si interface defects(HP_(b)+h→P_(b)+H^(+)).The climbing image nudged elastic band method is used to calculate the reaction curves and the barriers.In addition,the atomic charges of the initial and final structures are analyzed by the Bader charge method.It is shown that more than one hole is trapped by the defects,which is implied by the reduction in the total number of valence electrons on the active atoms.The results indicate that the depassivation of the defects by the holes actually occurs in three steps.In the first step,a hole is captured by the passivated defect,resulting in the stretching of the Si-H bond.In the second step,the defect captures one more hole,which may contribute to the breaking of the Si-H bond.The H atom is released as a proton and the Si atom is three-coordinated and positively charged.In the third step,an electron is captured by the Si atom,and the Si atom becomes neutral.In this step,a Pb-type defect is reactivated. 展开更多
关键词 a-siO_(2)/si interface HOLE depassivation first-principles calculation
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Passivation and dissociation of P_(b)-type defects at a-SiO_(2)/Si interface
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作者 Xue-Hua Liu Wei-Feng Xie +1 位作者 Yang Liu Xu Zuo 《Chinese Physics B》 SCIE EI CAS CSCD 2021年第9期49-55,共7页
It is well known that in the process of thermal oxidation of silicon,there are P_(b)-type defects at amorphous silicon dioxide/silicon(a-SiO_(2)/Si)interface due to strain.These defects have a very important impact on... It is well known that in the process of thermal oxidation of silicon,there are P_(b)-type defects at amorphous silicon dioxide/silicon(a-SiO_(2)/Si)interface due to strain.These defects have a very important impact on the performance and reliability of semiconductor devices.In the process of passivation,hydrogen is usually used to inactivate P_(b)-type defects by the reaction P_(b)+H_(2)→P_(b)H+H.At the same time,P_(b)H centers dissociate according to the chemical reaction P_(b)H→P_(b)+H.Therefore,it is of great significance to study the balance of the passivation and dissociation.In this work,the reaction mechanisms of passivation and dissociation of the P_(b)-type defects are investigated by first-principles calculations.The reaction rates of the passivation and dissociation are calculated by the climbing image-nudged elastic band(CI-NEB)method and harmonic transition state theory(HTST).By coupling the rate equations of the passivation and dissociation reactions,the equilibrium density ratio of the saturated interfacial dangling bonds and interfacial defects(P_(b),P_(b)0,and P_(b)1)at different temperatures is calculated. 展开更多
关键词 first-principles calculation a-siO_(2)/si interface P_(b)-type defects equilibrium density
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Effect of Metallurgical Behaviour at the Interface between Ceramic and Interlayer on the Si_3N_4/1.25Cr-0.5Mo Steel Joint Strength
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作者 Huaping XIONG (Dept. of Materials Science and Engineering, Jilin University of Technology, Changchun 130025, China) 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 1998年第1期20-24,共5页
By using newly developed CuNi5~25Ti16~28 B rapldly solidifled brazing filler the joining of Si3 N4/1.25Cr-0.5Mo steel has been carried out with interlayer method. If employing the interlayer structure of steel (0.2 mm... By using newly developed CuNi5~25Ti16~28 B rapldly solidifled brazing filler the joining of Si3 N4/1.25Cr-0.5Mo steel has been carried out with interlayer method. If employing the interlayer structure of steel (0.2 mm)/W (2.0 mm)/Ni(0.2 mm), the joint strength can be increased greatly compared with employing that of Ni/W/Ni, and the three point bend strength of the Joint shows the value of 261 MPa. The metallurgical behaviour at the interface between Si3N4 and the interlayer has been studied. It is found that Fe participated in the interfacial reactions between Si3N4 and the brazing filler at the Si3N4/steel (0.2 mm) interface and the compound Fe5Si3 was produced. However, since the reactions of Fe with the active Ti are weaker than those of Ni with Ti, the normal inter facial reactions were still assured at the interface of Si3N4/steel (0.2 mm) instead of Si3N4/Ni (0.2 mm), resulting in the improvement of the joint strength. The mechanism of the formation of Fe5Si3 is also discussed. Finally, some ideas to further ameliorate and simplify the interlayer structure are put forward. 展开更多
关键词 si Effect of Metallurgical Behaviour at the interface between Ceramic and Interlayer on the si3N4/1.25Cr-0.5Mo Steel Joint Strength Ni Cr Mo
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CRYSTALLOGRAPHIC PROPERTIES OF AN INHERENT LOW-ENERGY INTERFACE(1■1)Cu//(0001)_(AIN)IN Cu-AlN BICRYS
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作者 J. Du,G.Y.Yang and S. Hagegege(General Research Institute for Non-ferrous Metals, Beijing 100088, China)(CECM-CNRS,15 rue G. Urbain, 94407 Vitry/Seine, France ) 《Acta Metallurgica Sinica(English Letters)》 SCIE EI CAS CSCD 1996年第4期235-239,共5页
A model Cu-AlN composite has been prepared by ion implantation technique and annealing. The atomic configuration and lattice relationship of a low-energy inherent interface(11)Cn//(0001)AlN were studied by using trans... A model Cu-AlN composite has been prepared by ion implantation technique and annealing. The atomic configuration and lattice relationship of a low-energy inherent interface(11)Cn//(0001)AlN were studied by using transmission electron microscopy and geometrical modelling. By analysing the dichromatic pattern of the composite,a primary structural unit of the interface atomic configuration was determined for purpose of HREM image simulations and of studying the structurul relaxation state in the near-interface region. 展开更多
关键词 Cu-aln inherent interface SYMMETRY structural unit
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Interface reaction of high-strength low-alloy steel with Al-43.4Zn-1.6Si(wt.%)metallic coating
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作者 Wang-jun Peng Guang-xin Wu +1 位作者 Yi Cheng Jie-yu Zhang 《Journal of Iron and Steel Research International》 SCIE EI CAS CSCD 2019年第12期1304-1314,共11页
The microstructure,elemental distribution,phase composition,and thickness of intermetallic layers between high-strength low-alloy steel(H420)/mild carbon steel(DC51)and Al–43.4Zn–1.6Si(wt.%)(galvalume,GL)alloy were ... The microstructure,elemental distribution,phase composition,and thickness of intermetallic layers between high-strength low-alloy steel(H420)/mild carbon steel(DC51)and Al–43.4Zn–1.6Si(wt.%)(galvalume,GL)alloy were comparatively investigated.The experimental results reveal that the interfacial reaction layer was composed of Fe2Al5,Fe4Al13,and Al8Fe2Si intermetallic compounds.Moreover,the growth curves of the Fe2Al5 and Fe4Al13 intermetallic layers fit the parabolic law well,and the total thickness of the intermetallic layers of H420+GL was almost the same as that of DC51+GL.However,the thickness of the Fe2Al5 layer in H420+GL was thinner than that in DC51+GL.In addition,first-principle calculations were performed to explore the effect of Mn on the growth of the Fe2Al5 intermetallic phase,and the results indicate that Mn substitution in Fe2Al5 removes electronic charge from the Al atoms,thus decreasing the thickness of the Fe2Al5 interface layer. 展开更多
关键词 High-strength low-alloy steel Mild carbon steel Al–43.4Zn–1.6si(wt.%)alloy interface reaction
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Microstructure of interaction interface between Al-Si,Zn-Al alloys and Al_2O_(3p)/6061Al composite
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作者 许志武 闫久春 +1 位作者 吕世雄 杨士勤 《中国有色金属学会会刊:英文版》 CSCD 2004年第2期351-355,共5页
Interaction behaviors between Al-Si, Zn-Al alloys and Al2O)3p)/6061Al composite at different heating temperatures were investigated. It is found that Al2O)3p)/6061Al composite can be wetted well by AlSi-1, AlSi-4 and ... Interaction behaviors between Al-Si, Zn-Al alloys and Al2O)3p)/6061Al composite at different heating temperatures were investigated. It is found that Al2O)3p)/6061Al composite can be wetted well by AlSi-1, AlSi-4 and Zn-Al alloys and an interaction layer forms between the alloy and composite during interaction. Little Al-Si alloys remain on the surface when they fully wet the composite and Si element in Al-Si alloy diffuses into composite entirely and assembles in the composite near the interface of Al-Si alloy/composite to form a Si-rich zone. The microstructure in interaction layer with Si penetration is still dense. Much more residual Zn-Al alloy exists on the surface of composite when it wets the composite, and porosities appear at the interface of Zn-Al alloy/composite. The penetration of elements Zn, Cu of Zn-Al alloy into composite leads to the generation of shrinkage cavities in the interaction layer and makes the microstructure of Al2O)3p)/6061Al composite loose. 展开更多
关键词 AL-si合金 ZN-AL合金 Al2O3p/6061Al复合材料 显微结构 湿润性 TLP 压力焊接
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AlN缓冲层对Si基GaN外延薄膜性质的影响 被引量:2
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作者 陈翔 邢艳辉 +5 位作者 韩军 霍文娟 钟林健 崔明 范亚明 张宝顺 《发光学报》 EI CAS CSCD 北大核心 2014年第6期727-731,共5页
采用金属有机化合物化学气相沉积(MOCVD)方法制备了不同AlN缓冲层厚度的GaN样品,研究了AlN缓冲层厚度对GaN外延层的应力、表面形貌和晶体质量的影响。研究结果表明:厚度为15 nm的AlN缓冲层不仅可以有效抑制Si扩散,而且还给GaN外延层提... 采用金属有机化合物化学气相沉积(MOCVD)方法制备了不同AlN缓冲层厚度的GaN样品,研究了AlN缓冲层厚度对GaN外延层的应力、表面形貌和晶体质量的影响。研究结果表明:厚度为15 nm的AlN缓冲层不仅可以有效抑制Si扩散,而且还给GaN外延层提供了一个较大的压应力,避免GaN薄膜出现裂纹。在该厚度AlN缓冲层上制备的GaN薄膜表面光亮、无裂纹,受到的张应力为0.3 GPa,(0002)和(1012)面的高分辨X射线衍射摇摆曲线峰值半高宽分别为536 arcsec和594 arcsec,原子力显微镜测试得到表面粗糙度为0.2 nm。 展开更多
关键词 aln缓冲层 GAN si衬底 张应力 MOCVD
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V/Ⅲ比对Si基AlN薄膜结构特性的影响 被引量:1
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作者 杨乾坤 潘磊 +2 位作者 李忠辉 董逊 张东国 《固体电子学研究与进展》 CAS CSCD 北大核心 2016年第3期249-252 256,共5页
采用金属有机物化学气相外延法(MOCVD)在Si(111)衬底上生长了200nm厚的AlN薄膜,研究了V/III比对AlN薄膜晶体质量及表面六角缺陷的影响。结果表明,当V/III比为2 400时,得到的样品表面最平整,晶体质量最好,表面粗糙度为1.32nm,(002)半峰宽... 采用金属有机物化学气相外延法(MOCVD)在Si(111)衬底上生长了200nm厚的AlN薄膜,研究了V/III比对AlN薄膜晶体质量及表面六角缺陷的影响。结果表明,当V/III比为2 400时,得到的样品表面最平整,晶体质量最好,表面粗糙度为1.32nm,(002)半峰宽为0.615°,(102)半峰宽为0.689°。通过扫描电子显微镜(SEM)观察样品表面,发现当V/III比过高或者过低时,AlN薄膜的表面都会变得粗糙,六角形缺陷也会增多,合适的V/III比有助于抑制表面六角缺陷的产生。 展开更多
关键词 硅基氮化铝 V/Ⅲ比 六角缺陷
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AlN/Si(111)衬底上4H-SiC的CVD外延生长研究
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作者 吴军 王荣华 +6 位作者 韩平 梅琴 刘斌 谢自力 修向前 张荣 郑有炓 《半导体技术》 CAS CSCD 北大核心 2008年第S1期262-265,共4页
利用CVD的方法在Al N/Si(111)衬底上成功实现了4H-SiC薄膜的异质外延生长,用高分辨X射线衍射仪(HRXRD)、扫描电子显微镜(SEM)、喇曼散射(Raman scattering)对所得样品的结构特征、表面形貌等进行了表征测量。XRD测量结果显示得到的SiC... 利用CVD的方法在Al N/Si(111)衬底上成功实现了4H-SiC薄膜的异质外延生长,用高分辨X射线衍射仪(HRXRD)、扫描电子显微镜(SEM)、喇曼散射(Raman scattering)对所得样品的结构特征、表面形貌等进行了表征测量。XRD测量结果显示得到的SiC薄膜具有单一的晶体取向;Raman散射谱线初步表明得到的SiC薄膜为4H型态。衬底温度过低,不利于Si、C原子选择合适的格点位置成键,外延薄膜晶体质量不高;衬底温度过高,H2的刻蚀作用和表面原子的解吸附作用增强,不利于SiC的成核生长。C/Si比过小,薄膜表面会形成Si的小液滴;C/Si比过大,薄膜中会产生Si空位形式的微缺陷。因此,研究表明在Al N/Si(111)衬底上外延4H-SiC的最佳衬底温度为1230~1270℃,较为理想的C/Si比值为1.3。 展开更多
关键词 aln/si(111)衬底 4H-siC薄膜 异质外延 碳硅比
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Si基MOCVD生长AlN深陷阱中心研究
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作者 邓咏桢 郑有炓 +9 位作者 周春红 孔月婵 陈鹏 叶建东 顾书林 沈波 张荣 江若琏 韩平 施毅 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2004年第9期1109-1113,共5页
通过 PL 谱和 Raman谱对 MOCVD生长 Si基 Al N的深陷阱中心进行了研究 ,发现三个深能级 Et1 ,Et2 ,Et3,分别在 Ev 上 2 .6 1,3.10 ,2 .11e V.Et1 是由氧杂质和氮空位 (或 Al间隙原子 )能级峰位靠近重合共同引起的 ,Et2 、Et3都是由于衬... 通过 PL 谱和 Raman谱对 MOCVD生长 Si基 Al N的深陷阱中心进行了研究 ,发现三个深能级 Et1 ,Et2 ,Et3,分别在 Ev 上 2 .6 1,3.10 ,2 .11e V.Et1 是由氧杂质和氮空位 (或 Al间隙原子 )能级峰位靠近重合共同引起的 ,Et2 、Et3都是由于衬底 Si原子扩散到 Al N引起的 .在 Si浓度较低时 ,Si主要以取代 Al原子的方式存在 ,产生深陷阱中心Et2 .Si浓度高于某个临界浓度时 ,部分 Si原子以取代 N原子位置的方式存在 ,形成深陷阱中心 Et3.实验还表明 ,即使经高温长时间退火 ,Al N中 Et1 和 Et2 展开更多
关键词 sialn 深陷阱中心 PL谱
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采用AlN缓冲层在Si(111)衬底上生长GaN的形貌
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作者 刘喆 王晓亮 +4 位作者 王军喜 胡国新 李建平 曾一平 李晋闽 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2007年第z1期230-233,共4页
针对Si衬底上生长GaN具有的特有形貌进行了研究,分析采用扫描电镜(SEM)、X射线能谱仪(EDS)、原子力显微镜(AFM)等手段,研究了使用AlN作为缓冲层的GaN的生长模式、缺陷形成机理、应力释放机制.并且发现缓冲层厚度和外延层生长温度对裂纹... 针对Si衬底上生长GaN具有的特有形貌进行了研究,分析采用扫描电镜(SEM)、X射线能谱仪(EDS)、原子力显微镜(AFM)等手段,研究了使用AlN作为缓冲层的GaN的生长模式、缺陷形成机理、应力释放机制.并且发现缓冲层厚度和外延层生长温度对裂纹和表面缺陷的形成有很大的影响. 展开更多
关键词 si衬底 aln缓冲层 GAN 形貌 缺陷
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