In this work, a hetero-epitaxial Al0.49In0.51As/Ga0.47In0.53 As metamorphic high electron mobility transistor(mHEMT) grown by metal–organic chemical vapor deposition(MOCVD) on p-type silicon substrate has been succes...In this work, a hetero-epitaxial Al0.49In0.51As/Ga0.47In0.53 As metamorphic high electron mobility transistor(mHEMT) grown by metal–organic chemical vapor deposition(MOCVD) on p-type silicon substrate has been successfully demonstrated. A novel AlGaAs/Al As period multiple quantum well(MQW) composite buffer scheme is developed to effectively tune the leakage current from the buffer layer. The quantized room-temperature Hall mobility of the twodimensional electron gas(2DEG) is larger than 7800 cm2/V·s, with an average sheet carrier density of 4.6×1012cm-2.Two-stage electron beam(EB) lithography technology by a JBX-6300 e-beam lithography system is developed to realize a 0.13-μm m HEMT device on Si substrate. A maximum transconductance Gm of up to 854 mS/mm is achieved, and is comparable to that of m HEMT technology on Ga As substrate with the same dimension. The fTand fmax are 135 GHz and120 GHz, respectively.展开更多
High performance 150-nm gate-length metamorphic Al0.48In0.52As/Ga0.47In0.53 As high electron mobility transistors(mHEMTs) with very good device performance have been successfully fabricated.A T-shaped gate is fabricat...High performance 150-nm gate-length metamorphic Al0.48In0.52As/Ga0.47In0.53 As high electron mobility transistors(mHEMTs) with very good device performance have been successfully fabricated.A T-shaped gate is fabricated by using a combined technique of optical and e-beam photolithography,which is beneficial to decreasing parasitic capacitance and parasitic resistance of the gate.The ohmic contact resistance R c is as low as 0.03 mm when using a novel ohmic contact metal system(Ni/Ge/Ti/Au).The devices exhibit excellent DC and RF performance.A peak extrinsic transconductance of 775 mS/mm and a maximum drain current density of 720 mA/mm are achieved.The unity current gain cut-off frequency(fT) and the maximum oscillation frequency(f max) are 188.4 and 250 GHz,respectively.展开更多
基金supported by the Young Scientists Fund of the National Natural Science Foundation of China(Grant No.61401373)the Fundamental Research Funds for Central University,China(Grant Nos.XDJK2013B004 and 2362014XK13)the Chongqing Natural Science Foundation,China(Grant No.cstc2014jcyj A40038)
文摘In this work, a hetero-epitaxial Al0.49In0.51As/Ga0.47In0.53 As metamorphic high electron mobility transistor(mHEMT) grown by metal–organic chemical vapor deposition(MOCVD) on p-type silicon substrate has been successfully demonstrated. A novel AlGaAs/Al As period multiple quantum well(MQW) composite buffer scheme is developed to effectively tune the leakage current from the buffer layer. The quantized room-temperature Hall mobility of the twodimensional electron gas(2DEG) is larger than 7800 cm2/V·s, with an average sheet carrier density of 4.6×1012cm-2.Two-stage electron beam(EB) lithography technology by a JBX-6300 e-beam lithography system is developed to realize a 0.13-μm m HEMT device on Si substrate. A maximum transconductance Gm of up to 854 mS/mm is achieved, and is comparable to that of m HEMT technology on Ga As substrate with the same dimension. The fTand fmax are 135 GHz and120 GHz, respectively.
基金supported by the National Natural Science Foundation of China(Grant Nos.61274026,60274077 and 60976068)the Scientific Research Fund of Hunan Provincial Education Department(Grant No. 10C0709)the Science and Technology Plan Foundation of Hunan Province(Grant No.2011GK3058)
文摘High performance 150-nm gate-length metamorphic Al0.48In0.52As/Ga0.47In0.53 As high electron mobility transistors(mHEMTs) with very good device performance have been successfully fabricated.A T-shaped gate is fabricated by using a combined technique of optical and e-beam photolithography,which is beneficial to decreasing parasitic capacitance and parasitic resistance of the gate.The ohmic contact resistance R c is as low as 0.03 mm when using a novel ohmic contact metal system(Ni/Ge/Ti/Au).The devices exhibit excellent DC and RF performance.A peak extrinsic transconductance of 775 mS/mm and a maximum drain current density of 720 mA/mm are achieved.The unity current gain cut-off frequency(fT) and the maximum oscillation frequency(f max) are 188.4 and 250 GHz,respectively.
